JP6594304B2 - 処理装置 - Google Patents
処理装置 Download PDFInfo
- Publication number
- JP6594304B2 JP6594304B2 JP2016523293A JP2016523293A JP6594304B2 JP 6594304 B2 JP6594304 B2 JP 6594304B2 JP 2016523293 A JP2016523293 A JP 2016523293A JP 2016523293 A JP2016523293 A JP 2016523293A JP 6594304 B2 JP6594304 B2 JP 6594304B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- processing apparatus
- substrate
- telescopic
- semiconductor processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361892849P | 2013-10-18 | 2013-10-18 | |
| US61/892,849 | 2013-10-18 | ||
| US201361904908P | 2013-11-15 | 2013-11-15 | |
| US61/904,908 | 2013-11-15 | ||
| PCT/US2014/060893 WO2015057959A1 (en) | 2013-10-18 | 2014-10-16 | Processing apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016540374A JP2016540374A (ja) | 2016-12-22 |
| JP2016540374A5 JP2016540374A5 (enExample) | 2017-11-24 |
| JP6594304B2 true JP6594304B2 (ja) | 2019-10-23 |
Family
ID=52828696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016523293A Active JP6594304B2 (ja) | 2013-10-18 | 2014-10-16 | 処理装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10777438B2 (enExample) |
| JP (1) | JP6594304B2 (enExample) |
| KR (1) | KR102316440B1 (enExample) |
| CN (1) | CN105814677B (enExample) |
| WO (1) | WO2015057959A1 (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12444651B2 (en) | 2009-08-04 | 2025-10-14 | Novellus Systems, Inc. | Tungsten feature fill with nucleation inhibition |
| US9653353B2 (en) * | 2009-08-04 | 2017-05-16 | Novellus Systems, Inc. | Tungsten feature fill |
| US10256142B2 (en) | 2009-08-04 | 2019-04-09 | Novellus Systems, Inc. | Tungsten feature fill with nucleation inhibition |
| US11437269B2 (en) | 2012-03-27 | 2022-09-06 | Novellus Systems, Inc. | Tungsten feature fill with nucleation inhibition |
| US10381266B2 (en) | 2012-03-27 | 2019-08-13 | Novellus Systems, Inc. | Tungsten feature fill with nucleation inhibition |
| WO2015057959A1 (en) * | 2013-10-18 | 2015-04-23 | Brooks Automation, Inc. | Processing apparatus |
| US9997405B2 (en) | 2014-09-30 | 2018-06-12 | Lam Research Corporation | Feature fill with nucleation inhibition |
| WO2016069731A1 (en) * | 2014-10-28 | 2016-05-06 | Festo Corporation | Universal end of arm robot tool |
| US9953984B2 (en) | 2015-02-11 | 2018-04-24 | Lam Research Corporation | Tungsten for wordline applications |
| US10170320B2 (en) | 2015-05-18 | 2019-01-01 | Lam Research Corporation | Feature fill with multi-stage nucleation inhibition |
| US9978605B2 (en) | 2015-05-27 | 2018-05-22 | Lam Research Corporation | Method of forming low resistivity fluorine free tungsten film without nucleation |
| US9972504B2 (en) | 2015-08-07 | 2018-05-15 | Lam Research Corporation | Atomic layer etching of tungsten for enhanced tungsten deposition fill |
| US9978610B2 (en) | 2015-08-21 | 2018-05-22 | Lam Research Corporation | Pulsing RF power in etch process to enhance tungsten gapfill performance |
| US9799544B2 (en) | 2015-10-23 | 2017-10-24 | Applied Materials, Inc. | Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing |
| JP6663774B2 (ja) * | 2016-03-30 | 2020-03-13 | 東京エレクトロン株式会社 | 基板搬送方法及び基板処理システム |
| US10573522B2 (en) | 2016-08-16 | 2020-02-25 | Lam Research Corporation | Method for preventing line bending during metal fill process |
| US10566211B2 (en) | 2016-08-30 | 2020-02-18 | Lam Research Corporation | Continuous and pulsed RF plasma for etching metals |
| US11482434B2 (en) | 2016-10-18 | 2022-10-25 | Belting E-Town Semiconductor Technology Co., Ltd | Systems and methods for workpiece processing |
| WO2018075262A1 (en) * | 2016-10-18 | 2018-04-26 | Mattson Technology, Inc. | Systems and methods for workpiece processing |
| CN106671090B (zh) * | 2016-11-15 | 2023-09-05 | 宁波中科莱恩机器人有限公司 | 双夹具型二次元模内机器人 |
| US10211099B2 (en) | 2016-12-19 | 2019-02-19 | Lam Research Corporation | Chamber conditioning for remote plasma process |
| DE102017100507B4 (de) * | 2017-01-12 | 2021-11-25 | Ald Vacuum Technologies Gmbh | Vorrichtung und Verfahren zur Beschichtung von Werkstücken |
| EP3596752B1 (en) | 2017-03-15 | 2025-01-08 | Lam Research Corporation | Reduced footprint platform architecture with linear vacuum transfer module |
| JP6325174B1 (ja) | 2017-04-04 | 2018-05-16 | 株式会社Mujin | 制御装置、ピッキングシステム、物流システム、プログラム、制御方法、及び、生産方法 |
| CN110494257B (zh) | 2017-04-04 | 2020-12-18 | 牧今科技 | 控制装置、拾取系统、物流系统、程序、控制方法以及生产方法 |
| DE112017007394B4 (de) | 2017-04-04 | 2020-12-03 | Mujin, Inc. | Informationsverarbeitungsvorrichtung, Greifsystem, Verteilersystem, Programm und Informationsverarbeitungsverfahren |
| CN115385039A (zh) | 2017-04-04 | 2022-11-25 | 牧今科技 | 控制装置、信息处理装置、控制方法以及信息处理方法 |
| CN110520259B (zh) | 2017-04-04 | 2021-09-21 | 牧今科技 | 控制装置、拾取系统、物流系统、存储介质以及控制方法 |
| CN107009354B (zh) * | 2017-04-24 | 2020-05-12 | 上海宇航系统工程研究所 | 用于板块拼接的2sps+rrprr机器人抓取机构 |
| US10903107B2 (en) | 2017-07-11 | 2021-01-26 | Brooks Automation, Inc. | Semiconductor process transport apparatus comprising an adapter pendant |
| JP7609636B2 (ja) | 2017-08-14 | 2025-01-07 | ラム リサーチ コーポレーション | 3次元垂直nandワード線用の金属充填プロセス |
| US11020852B2 (en) * | 2017-10-05 | 2021-06-01 | Brooks Automation, Inc. | Substrate transport apparatus with independent accessory feedthrough |
| JP7295359B2 (ja) * | 2018-03-20 | 2023-06-21 | 東京エレクトロン株式会社 | 統合的な計測を伴う基板処理ツール並びに使用方法 |
| US11549175B2 (en) | 2018-05-03 | 2023-01-10 | Lam Research Corporation | Method of depositing tungsten and other metals in 3D NAND structures |
| US10943805B2 (en) | 2018-05-18 | 2021-03-09 | Applied Materials, Inc. | Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing |
| JP7231721B2 (ja) * | 2018-10-04 | 2023-03-01 | アプライド マテリアルズ インコーポレイテッド | 搬送システム |
| JP7008609B2 (ja) * | 2018-10-18 | 2022-01-25 | 東京エレクトロン株式会社 | 基板処理装置、及び搬送位置補正方法 |
| SG11202106002VA (en) | 2018-12-05 | 2021-07-29 | Lam Res Corp | Void free low stress fill |
| WO2020123987A1 (en) | 2018-12-14 | 2020-06-18 | Lam Research Corporation | Atomic layer deposition on 3d nand structures |
| US12261081B2 (en) | 2019-02-13 | 2025-03-25 | Lam Research Corporation | Tungsten feature fill with inhibition control |
| US12103176B2 (en) * | 2019-02-14 | 2024-10-01 | Persimmon Technologies Corporation | Linear robot with two-link arm |
| KR20210141762A (ko) | 2019-04-11 | 2021-11-23 | 램 리써치 코포레이션 | 고 단차 커버리지 (step coverage) 텅스텐 증착 |
| WO2020232074A1 (en) * | 2019-05-14 | 2020-11-19 | Mattson Technology, Inc. | Plasma processing apparatus having a focus ring adjustment assembly |
| US12237221B2 (en) | 2019-05-22 | 2025-02-25 | Lam Research Corporation | Nucleation-free tungsten deposition |
| KR20220047333A (ko) | 2019-08-12 | 2022-04-15 | 램 리써치 코포레이션 | 텅스텐 증착 |
| JP7511380B2 (ja) * | 2020-05-01 | 2024-07-05 | 東京エレクトロン株式会社 | 処理システム |
| US12255089B2 (en) * | 2020-07-02 | 2025-03-18 | Applied Materials, Inc. | Robot apparatus, systems, and methods for transporting substrates in electronic device manufacturing |
| US11521870B2 (en) | 2020-07-08 | 2022-12-06 | Applied Materials, Inc. | Annealing chamber |
| US11358809B1 (en) * | 2021-03-01 | 2022-06-14 | Applied Materials, Inc. | Vacuum robot apparatus for variable pitch access |
| EP4306260A4 (en) * | 2021-03-24 | 2025-01-22 | DMG Mori Co., Ltd. | SUPPORT SYSTEM |
| US12163228B2 (en) * | 2021-05-18 | 2024-12-10 | Mellanox Technologies, Ltd. | CVD system with substrate carrier and associated mechanisms for moving substrate therethrough |
| KR102307687B1 (ko) * | 2021-06-25 | 2021-10-05 | (주) 티로보틱스 | 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇 |
| JP7766480B2 (ja) * | 2021-12-02 | 2025-11-10 | 東京エレクトロン株式会社 | 剥離システムおよび剥離方法 |
| ES2989410T3 (es) * | 2022-03-08 | 2024-11-26 | Applied Mat Italia Srl | Línea de procesamiento para procesar un sustrato utilizado para la fabricación de una celda solar y procedimiento de explotación de una línea de procesamiento para procesar un sustrato utilizado para la fabricación de una celda solar |
| CN114553058A (zh) * | 2022-03-11 | 2022-05-27 | 史帅涛 | 一种多重磁悬浮装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
| US6749390B2 (en) * | 1997-12-15 | 2004-06-15 | Semitool, Inc. | Integrated tools with transfer devices for handling microelectronic workpieces |
| JPH10335413A (ja) * | 1997-05-29 | 1998-12-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| DE19725527A1 (de) * | 1997-06-17 | 1998-12-24 | Philips Patentverwaltung | Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung |
| US7959395B2 (en) * | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
| US7988398B2 (en) * | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
| JP2004090186A (ja) * | 2002-09-02 | 2004-03-25 | Aitec Corp | クリーン搬送ロボット |
| JP2004106105A (ja) * | 2002-09-18 | 2004-04-08 | Seiko Instruments Inc | 搬送ロボット |
| JP4283559B2 (ja) | 2003-02-24 | 2009-06-24 | 東京エレクトロン株式会社 | 搬送装置及び真空処理装置並びに常圧搬送装置 |
| JP2004349503A (ja) * | 2003-05-22 | 2004-12-09 | Tokyo Electron Ltd | 被処理体の処理システム及び処理方法 |
| JP4023543B2 (ja) * | 2003-05-29 | 2007-12-19 | 東京エレクトロン株式会社 | 基板搬送装置および基板搬送方法ならびに真空処理装置 |
| JP2005317656A (ja) | 2004-04-27 | 2005-11-10 | Tokyo Electron Ltd | 真空処理装置 |
| KR20070089197A (ko) * | 2004-11-22 | 2007-08-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 배치 처리 챔버를 사용한 기판 처리 기기 |
| JP4841183B2 (ja) | 2005-06-28 | 2011-12-21 | 東京エレクトロン株式会社 | 基板処理装置,搬送装置,搬送装置の制御方法 |
| US20080107507A1 (en) | 2005-11-07 | 2008-05-08 | Bufano Michael L | Reduced capacity carrier, transport, load port, buffer system |
| JP2011199121A (ja) | 2010-03-23 | 2011-10-06 | Ulvac Japan Ltd | 搬送装置 |
| US9862554B2 (en) * | 2011-10-26 | 2018-01-09 | Brooks Automation, Inc. | Semiconductor wafer handling and transport |
| TWI684229B (zh) * | 2013-07-08 | 2020-02-01 | 美商布魯克斯自動機械公司 | 具有即時基板定心的處理裝置 |
| WO2015057959A1 (en) * | 2013-10-18 | 2015-04-23 | Brooks Automation, Inc. | Processing apparatus |
| US10134621B2 (en) * | 2013-12-17 | 2018-11-20 | Brooks Automation, Inc. | Substrate transport apparatus |
-
2014
- 2014-10-16 WO PCT/US2014/060893 patent/WO2015057959A1/en not_active Ceased
- 2014-10-16 KR KR1020167013021A patent/KR102316440B1/ko active Active
- 2014-10-16 US US15/103,268 patent/US10777438B2/en active Active
- 2014-10-16 JP JP2016523293A patent/JP6594304B2/ja active Active
- 2014-10-16 CN CN201480069864.7A patent/CN105814677B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160072217A (ko) | 2016-06-22 |
| US10777438B2 (en) | 2020-09-15 |
| CN105814677B (zh) | 2019-06-18 |
| CN105814677A (zh) | 2016-07-27 |
| US20160293467A1 (en) | 2016-10-06 |
| JP2016540374A (ja) | 2016-12-22 |
| KR102316440B1 (ko) | 2021-10-22 |
| WO2015057959A1 (en) | 2015-04-23 |
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