CN105814677B - 处理设备 - Google Patents

处理设备 Download PDF

Info

Publication number
CN105814677B
CN105814677B CN201480069864.7A CN201480069864A CN105814677B CN 105814677 B CN105814677 B CN 105814677B CN 201480069864 A CN201480069864 A CN 201480069864A CN 105814677 B CN105814677 B CN 105814677B
Authority
CN
China
Prior art keywords
processing apparatus
semiconductor processing
transfer
substrate
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480069864.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN105814677A (zh
Inventor
R.T.卡夫尼
U.吉尔克里斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borucos Automation Usa Co ltd
Borukos Automation Holding Co ltd
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of CN105814677A publication Critical patent/CN105814677A/zh
Application granted granted Critical
Publication of CN105814677B publication Critical patent/CN105814677B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201480069864.7A 2013-10-18 2014-10-16 处理设备 Active CN105814677B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361892849P 2013-10-18 2013-10-18
US61/892849 2013-10-18
US201361904908P 2013-11-15 2013-11-15
US61/904908 2013-11-15
PCT/US2014/060893 WO2015057959A1 (en) 2013-10-18 2014-10-16 Processing apparatus

Publications (2)

Publication Number Publication Date
CN105814677A CN105814677A (zh) 2016-07-27
CN105814677B true CN105814677B (zh) 2019-06-18

Family

ID=52828696

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480069864.7A Active CN105814677B (zh) 2013-10-18 2014-10-16 处理设备

Country Status (5)

Country Link
US (1) US10777438B2 (enExample)
JP (1) JP6594304B2 (enExample)
KR (1) KR102316440B1 (enExample)
CN (1) CN105814677B (enExample)
WO (1) WO2015057959A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022243891A1 (en) * 2021-05-18 2022-11-24 Mellanox Technologies, Ltd. Cvd system with substrate carrier and associated mechanisms for moving substrate therethrough

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10256142B2 (en) 2009-08-04 2019-04-09 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US12444651B2 (en) 2009-08-04 2025-10-14 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US10381266B2 (en) 2012-03-27 2019-08-13 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US11437269B2 (en) 2012-03-27 2022-09-06 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
CN110004429B (zh) 2012-03-27 2021-08-31 诺发系统公司 钨特征填充
JP6594304B2 (ja) * 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US9997405B2 (en) 2014-09-30 2018-06-12 Lam Research Corporation Feature fill with nucleation inhibition
WO2016069731A1 (en) * 2014-10-28 2016-05-06 Festo Corporation Universal end of arm robot tool
US9953984B2 (en) 2015-02-11 2018-04-24 Lam Research Corporation Tungsten for wordline applications
US10170320B2 (en) 2015-05-18 2019-01-01 Lam Research Corporation Feature fill with multi-stage nucleation inhibition
US9978605B2 (en) 2015-05-27 2018-05-22 Lam Research Corporation Method of forming low resistivity fluorine free tungsten film without nucleation
US9972504B2 (en) 2015-08-07 2018-05-15 Lam Research Corporation Atomic layer etching of tungsten for enhanced tungsten deposition fill
US9978610B2 (en) 2015-08-21 2018-05-22 Lam Research Corporation Pulsing RF power in etch process to enhance tungsten gapfill performance
US9799544B2 (en) 2015-10-23 2017-10-24 Applied Materials, Inc. Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
JP6663774B2 (ja) * 2016-03-30 2020-03-13 東京エレクトロン株式会社 基板搬送方法及び基板処理システム
US10573522B2 (en) 2016-08-16 2020-02-25 Lam Research Corporation Method for preventing line bending during metal fill process
US10566211B2 (en) 2016-08-30 2020-02-18 Lam Research Corporation Continuous and pulsed RF plasma for etching metals
KR102650824B1 (ko) * 2016-10-18 2024-03-26 매슨 테크놀로지 인크 워크피스 처리를 위한 시스템 및 방법
US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
CN106671090B (zh) * 2016-11-15 2023-09-05 宁波中科莱恩机器人有限公司 双夹具型二次元模内机器人
US10211099B2 (en) 2016-12-19 2019-02-19 Lam Research Corporation Chamber conditioning for remote plasma process
DE102017100507B4 (de) * 2017-01-12 2021-11-25 Ald Vacuum Technologies Gmbh Vorrichtung und Verfahren zur Beschichtung von Werkstücken
CN118538644A (zh) * 2017-03-15 2024-08-23 朗姆研究公司 采用线性真空传送模块减少占用面积平台架构
DE112017007394B4 (de) 2017-04-04 2020-12-03 Mujin, Inc. Informationsverarbeitungsvorrichtung, Greifsystem, Verteilersystem, Programm und Informationsverarbeitungsverfahren
DE112017007397B4 (de) * 2017-04-04 2021-09-30 Mujin, Inc. Steuervorrichtung, Greifsystem, Verteilersystem, Programm, Steuerverfahren und Herstellungsverfahren
CN115385039A (zh) 2017-04-04 2022-11-25 牧今科技 控制装置、信息处理装置、控制方法以及信息处理方法
JP6444499B1 (ja) 2017-04-04 2018-12-26 株式会社Ｍｕｊｉｎ 制御装置、ピッキングシステム、物流システム、プログラム、及び、制御方法
CN110494257B (zh) 2017-04-04 2020-12-18 牧今科技 控制装置、拾取系统、物流系统、程序、控制方法以及生产方法
CN107009354B (zh) * 2017-04-24 2020-05-12 上海宇航系统工程研究所 用于板块拼接的2sps+rrprr机器人抓取机构
US10903107B2 (en) * 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
US11348795B2 (en) 2017-08-14 2022-05-31 Lam Research Corporation Metal fill process for three-dimensional vertical NAND wordline
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough
KR102655137B1 (ko) * 2018-03-20 2024-04-04 도쿄엘렉트론가부시키가이샤 계측 통합형 기판 프로세싱 툴 및 그 이용 방법
KR102806630B1 (ko) 2018-05-03 2025-05-12 램 리써치 코포레이션 3d nand 구조체들에 텅스텐 및 다른 금속들을 증착하는 방법
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
CN112840447B (zh) 2018-10-04 2025-11-21 应用材料公司 运输系统
JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
KR102828798B1 (ko) 2018-12-05 2025-07-02 램 리써치 코포레이션 보이드 프리 (void free) 저응력 (low stress) 충진
JP7649741B2 (ja) 2018-12-14 2025-03-21 ラム リサーチ コーポレーション ３ｄ ｎａｎｄ構造上の原子層堆積
SG11202108725XA (en) 2019-02-13 2021-09-29 Lam Res Corp Tungsten feature fill with inhibition control
JP7576555B2 (ja) * 2019-02-14 2024-10-31 パーシモン テクノロジーズ コーポレイション ２リンクアームを有するリニアロボット
KR20210141762A (ko) 2019-04-11 2021-11-23 램 리써치 코포레이션 고 단차 커버리지 (step coverage) 텅스텐 증착
WO2020232074A1 (en) 2019-05-14 2020-11-19 Mattson Technology, Inc. Plasma processing apparatus having a focus ring adjustment assembly
US12237221B2 (en) 2019-05-22 2025-02-25 Lam Research Corporation Nucleation-free tungsten deposition
WO2021030836A1 (en) 2019-08-12 2021-02-18 Lam Research Corporation Tungsten deposition
JP7511380B2 (ja) * 2020-05-01 2024-07-05 東京エレクトロン株式会社 処理システム
US12255089B2 (en) 2020-07-02 2025-03-18 Applied Materials, Inc. Robot apparatus, systems, and methods for transporting substrates in electronic device manufacturing
US11521870B2 (en) 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access
US20240173810A1 (en) * 2021-03-24 2024-05-30 Dmg Mori Co., Ltd. Conveyance system
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
JP7766480B2 (ja) * 2021-12-02 2025-11-10 東京エレクトロン株式会社 剥離システムおよび剥離方法
WO2023169658A1 (en) * 2022-03-08 2023-09-14 Applied Materials Italia S.R.L. Processing line for processing a substrate used for the manufacture of a solar cell and method of operating a processing line for processing a substrate used for the manufacture of a solar cell
CN114553058A (zh) * 2022-03-11 2022-05-27 史帅涛 一种多重磁悬浮装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US6749390B2 (en) * 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
JPH10335413A (ja) 1997-05-29 1998-12-18 Dainippon Screen Mfg Co Ltd 基板処理装置
DE19725527A1 (de) 1997-06-17 1998-12-24 Philips Patentverwaltung Reaktor zur Verarbeitung von Wafern mit einer Schutzvorrichtung
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
JP2004090186A (ja) * 2002-09-02 2004-03-25 Aitec Corp クリーン搬送ロボット
JP2004106105A (ja) 2002-09-18 2004-04-08 Seiko Instruments Inc 搬送ロボット
JP4283559B2 (ja) 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
JP2004349503A (ja) * 2003-05-22 2004-12-09 Tokyo Electron Ltd 被処理体の処理システム及び処理方法
JP4023543B2 (ja) 2003-05-29 2007-12-19 東京エレクトロン株式会社 基板搬送装置および基板搬送方法ならびに真空処理装置
JP2005317656A (ja) 2004-04-27 2005-11-10 Tokyo Electron Ltd 真空処理装置
CN101061253B (zh) * 2004-11-22 2010-12-22 应用材料股份有限公司 使用批式制程腔室的基材处理装置
JP4841183B2 (ja) 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
US20080107507A1 (en) 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
JP2011199121A (ja) * 2010-03-23 2011-10-06 Ulvac Japan Ltd 搬送装置
CN104011845B (zh) * 2011-10-26 2018-05-11 布鲁克斯自动化公司 半导体晶片搬运和运输
TWI684229B (zh) * 2013-07-08 2020-02-01 美商布魯克斯自動機械公司 具有即時基板定心的處理裝置
JP6594304B2 (ja) * 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US10134621B2 (en) * 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022243891A1 (en) * 2021-05-18 2022-11-24 Mellanox Technologies, Ltd. Cvd system with substrate carrier and associated mechanisms for moving substrate therethrough

Also Published As

Publication number Publication date
US10777438B2 (en) 2020-09-15
JP2016540374A (ja) 2016-12-22
CN105814677A (zh) 2016-07-27
JP6594304B2 (ja) 2019-10-23
WO2015057959A1 (en) 2015-04-23
KR20160072217A (ko) 2016-06-22
US20160293467A1 (en) 2016-10-06
KR102316440B1 (ko) 2021-10-22

Similar Documents

Publication Publication Date Title
CN105814677B (zh) 处理设备
US20250069939A1 (en) Substrate processing apparatus
CN105981154B (zh) 衬底运输设备
KR102359364B1 (ko) 기판 프로세싱 장치
JP6705750B2 (ja) 基板搬送装置
JP2020010059A (ja) 基板搬送システム、基板処理装置、及び基板搬送方法
US11894252B2 (en) Substrate transport apparatus
TWI700765B (zh) 以轉移設備轉移工件的方法
CN112470266A (zh) 衬底输送设备
TW201840389A (zh) 用於基板輸送設備位置補償之方法及設備
TW202531686A (zh) 基材運送裝置
TW202013569A (zh) 基板運送裝置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220311

Address after: Massachusetts

Patentee after: Borukos automation Holding Co.,Ltd.

Address before: Massachusetts

Patentee before: BROOKS AUTOMATION, Inc.

Effective date of registration: 20220311

Address after: Massachusetts

Patentee after: Borucos automation USA Co.,Ltd.

Address before: Massachusetts

Patentee before: Borukos automation Holding Co.,Ltd.

TR01 Transfer of patent right