JP2016535819A5 - - Google Patents

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Publication number
JP2016535819A5
JP2016535819A5 JP2016521931A JP2016521931A JP2016535819A5 JP 2016535819 A5 JP2016535819 A5 JP 2016535819A5 JP 2016521931 A JP2016521931 A JP 2016521931A JP 2016521931 A JP2016521931 A JP 2016521931A JP 2016535819 A5 JP2016535819 A5 JP 2016535819A5
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acid
ammonium
bis
acids
group
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JP2016521931A
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English (en)
Japanese (ja)
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JP2016535819A (ja
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Priority claimed from US14/103,303 external-priority patent/US20150104952A1/en
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Priority claimed from PCT/US2014/059848 external-priority patent/WO2015054464A1/en
Publication of JP2016535819A publication Critical patent/JP2016535819A/ja
Publication of JP2016535819A5 publication Critical patent/JP2016535819A5/ja
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JP2016521931A 2013-10-11 2014-10-09 ハードマスクを選択的に除去するための除去組成物及びその方法 Pending JP2016535819A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361889968P 2013-10-11 2013-10-11
US61/889,968 2013-10-11
US14/103,303 2013-12-11
US14/103,303 US20150104952A1 (en) 2013-10-11 2013-12-11 Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper
USPCT/US2013/074356 2013-12-11
PCT/US2014/059848 WO2015054464A1 (en) 2013-10-11 2014-10-09 Removal composition for selectively removing hard mask and methods thereof
PCT/US2013/074356 WO2015053800A2 (en) 2013-10-11 2014-11-14 Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper

Publications (2)

Publication Number Publication Date
JP2016535819A JP2016535819A (ja) 2016-11-17
JP2016535819A5 true JP2016535819A5 (https=) 2017-11-09

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Family Applications (3)

Application Number Title Priority Date Filing Date
JP2016522060A Active JP6523269B2 (ja) 2013-10-11 2014-10-09 ハードマスクを選択的に除去するための除去組成物
JP2016521931A Pending JP2016535819A (ja) 2013-10-11 2014-10-09 ハードマスクを選択的に除去するための除去組成物及びその方法
JP2016521999A Pending JP2017502491A (ja) 2013-10-11 2014-11-14 低k誘電材料及び銅を含む半導体デバイス基板から金属ハードマスク及びその他の残留物を選択的に除去するための方法及び組成物

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JP2016522060A Active JP6523269B2 (ja) 2013-10-11 2014-10-09 ハードマスクを選択的に除去するための除去組成物

Family Applications After (1)

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JP2016521999A Pending JP2017502491A (ja) 2013-10-11 2014-11-14 低k誘電材料及び銅を含む半導体デバイス基板から金属ハードマスク及びその他の残留物を選択的に除去するための方法及び組成物

Country Status (6)

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US (4) US20150104952A1 (https=)
JP (3) JP6523269B2 (https=)
KR (3) KR102334603B1 (https=)
CN (3) CN105612599B (https=)
TW (3) TW201522574A (https=)
WO (1) WO2015053800A2 (https=)

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