JP2016533040A5 - - Google Patents
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- Publication number
- JP2016533040A5 JP2016533040A5 JP2016543334A JP2016543334A JP2016533040A5 JP 2016533040 A5 JP2016533040 A5 JP 2016533040A5 JP 2016543334 A JP2016543334 A JP 2016543334A JP 2016543334 A JP2016543334 A JP 2016543334A JP 2016533040 A5 JP2016533040 A5 JP 2016533040A5
- Authority
- JP
- Japan
- Prior art keywords
- parts
- welding
- aligning
- welded
- inert gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 5
- 238000004140 cleaning Methods 0.000 claims 3
- 239000006260 foam Substances 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- 238000002485 combustion reaction Methods 0.000 claims 1
- 239000013530 defoamer Substances 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- -1 wet cleaning Substances 0.000 claims 1
- 238000001465 metallisation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13184769.1 | 2013-09-17 | ||
| EP13184769 | 2013-09-17 | ||
| PCT/EP2014/058604 WO2015039771A1 (en) | 2013-09-17 | 2014-04-28 | Method for ultrasonic welding with particles trapping |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016533040A JP2016533040A (ja) | 2016-10-20 |
| JP2016533040A5 true JP2016533040A5 (enExample) | 2017-05-18 |
| JP6718819B2 JP6718819B2 (ja) | 2020-07-08 |
Family
ID=49165665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016543334A Active JP6718819B2 (ja) | 2013-09-17 | 2014-04-28 | 粒子捕捉を用いる超音波溶接のための方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9975194B2 (enExample) |
| EP (1) | EP3046717B1 (enExample) |
| JP (1) | JP6718819B2 (enExample) |
| KR (1) | KR102147561B1 (enExample) |
| CN (1) | CN105531068B (enExample) |
| WO (1) | WO2015039771A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018202615A1 (en) * | 2017-05-02 | 2018-11-08 | Abb Schweiz Ag | Resin encapsulated power semiconductor module with exposed terminal areas |
| JP7608749B2 (ja) * | 2020-08-20 | 2025-01-07 | 株式会社大林組 | 作業方法及び泡状体製造装置 |
| KR102376232B1 (ko) * | 2020-10-28 | 2022-03-17 | 동명대학교 산학협력단 | 초음파 용접 방법 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3393102A (en) | 1965-01-15 | 1968-07-16 | Lincoln Electric Co | Arc welding flux |
| US3586122A (en) * | 1970-04-27 | 1971-06-22 | Branson Instr | Sonic apparatus with sonic energy barrier means |
| JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
| KR900003157B1 (ko) * | 1986-04-02 | 1990-05-09 | 가부시끼가이샤 히다찌세이샤꾸쇼 | 스루호울 도금의 전처리 방법 |
| US4770730A (en) * | 1987-09-29 | 1988-09-13 | Tachi-S. Co., Ltd. | Ultrasonic welding method for soft elastic foam body |
| JPH02105513A (ja) * | 1988-10-14 | 1990-04-18 | Nec Corp | ヒューズ付きチップ状固体電解コンデンサ |
| JP2564415B2 (ja) * | 1990-04-18 | 1996-12-18 | 株式会社日立製作所 | 空気流量検出器 |
| US5239806A (en) * | 1990-11-02 | 1993-08-31 | Ak Technology, Inc. | Thermoplastic semiconductor package and method of producing it |
| JP2662131B2 (ja) * | 1991-12-26 | 1997-10-08 | 松下電器産業株式会社 | ボンディング装置 |
| AU675937B2 (en) * | 1992-04-10 | 1997-02-27 | W.L. Gore & Associates, Inc. | A method of ultrasonically welding articles of porous polytetrafluoroethylene |
| DE69431023T2 (de) * | 1993-09-01 | 2003-02-06 | Kabushiki Kaisha Toshiba, Kawasaki | Halbleiteraufbau und Verfahren zur Herstellung |
| JP3297254B2 (ja) * | 1995-07-05 | 2002-07-02 | 株式会社東芝 | 半導体パッケージおよびその製造方法 |
| KR100438256B1 (ko) * | 1995-12-18 | 2004-08-25 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체장치 및 그 제조방법 |
| JP3610999B2 (ja) * | 1996-06-07 | 2005-01-19 | 松下電器産業株式会社 | 半導体素子の実装方法 |
| US5926694A (en) * | 1996-07-11 | 1999-07-20 | Pfu Limited | Semiconductor device and a manufacturing method thereof |
| JP2924830B2 (ja) * | 1996-11-15 | 1999-07-26 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| JP3233059B2 (ja) * | 1997-03-07 | 2001-11-26 | 株式会社村田製作所 | 超音波センサ |
| US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
| US5969461A (en) * | 1998-04-08 | 1999-10-19 | Cts Corporation | Surface acoustic wave device package and method |
| JP2000068327A (ja) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
| KR20000057810A (ko) * | 1999-01-28 | 2000-09-25 | 가나이 쓰토무 | 반도체 장치 |
| JP4338834B2 (ja) | 1999-08-06 | 2009-10-07 | 日本テキサス・インスツルメンツ株式会社 | 超音波振動を用いた半導体チップの実装方法 |
| JP4592845B2 (ja) * | 1999-09-21 | 2010-12-08 | パナソニック株式会社 | 電池 |
| JP4564118B2 (ja) * | 1999-10-26 | 2010-10-20 | パナソニック株式会社 | 電池及びその製造方法 |
| JP2001178839A (ja) * | 1999-12-27 | 2001-07-03 | Taiho Ind Co Ltd | 高熱粉粒体の処理方法 |
| JP2001308145A (ja) * | 2000-04-25 | 2001-11-02 | Fujitsu Ltd | 半導体チップの実装方法 |
| CN1159620C (zh) * | 2000-11-10 | 2004-07-28 | 株式会社村上开明堂 | 固态电致变色器件和使用这种器件的反射镜系统和crt显示器 |
| WO2002071470A1 (fr) * | 2001-03-02 | 2002-09-12 | Toray Engineering Co., Ltd. | Procede et dispositif de montage de puce |
| JP4199460B2 (ja) * | 2002-01-23 | 2008-12-17 | パナソニック株式会社 | 角形密閉式電池 |
| US20060091184A1 (en) * | 2004-10-28 | 2006-05-04 | Art Bayot | Method of mitigating voids during solder reflow |
| WO2007091931A1 (en) * | 2006-02-10 | 2007-08-16 | Sca Hygiene Products Ab | Device and means of processing a material by means of an ultrasonic device |
| JP2006186401A (ja) * | 2006-03-30 | 2006-07-13 | Denso Corp | 半導体装置及び半導体装置の製造方法 |
| JP2006186402A (ja) * | 2006-03-30 | 2006-07-13 | Denso Corp | 半導体装置及び半導体装置の製造方法 |
| US20080060741A1 (en) * | 2006-09-07 | 2008-03-13 | Privitera Marc P | Ultrasonically Bonded Nonwoven Permeable Pouch |
| KR100874925B1 (ko) * | 2007-06-04 | 2008-12-19 | 삼성전자주식회사 | 반도체 패키지, 그 제조 방법, 이를 포함하는 카드 및 이를포함하는 시스템 |
| US8813986B2 (en) * | 2007-09-06 | 2014-08-26 | Covidien Lp | Touchless auto-drop sharps container |
| US20100084748A1 (en) * | 2008-06-04 | 2010-04-08 | National Semiconductor Corporation | Thin foil for use in packaging integrated circuits |
| FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
| JP2010040615A (ja) * | 2008-08-01 | 2010-02-18 | Hitachi Ltd | 半導体装置 |
| US8622261B2 (en) * | 2008-08-14 | 2014-01-07 | Hitachi Metals, Ltd. | Molten metal supply cylinder, molten metal supply apparatus incorporating such a supply cylinder and molten metal supply method |
| WO2014000975A1 (en) | 2012-06-26 | 2014-01-03 | Abb Technology Ag | Device and method for ultrasonic welding |
| CN102800833B (zh) * | 2012-08-31 | 2015-03-18 | 江苏宏微科技股份有限公司 | 功率模块电极端子及其焊接方法 |
| CN103143832A (zh) * | 2013-02-26 | 2013-06-12 | 芜湖新宝超声波设备有限公司 | 一种超声波焊接机 |
-
2014
- 2014-04-28 KR KR1020167007050A patent/KR102147561B1/ko active Active
- 2014-04-28 WO PCT/EP2014/058604 patent/WO2015039771A1/en not_active Ceased
- 2014-04-28 EP EP14720125.5A patent/EP3046717B1/en active Active
- 2014-04-28 JP JP2016543334A patent/JP6718819B2/ja active Active
- 2014-04-28 CN CN201480051289.8A patent/CN105531068B/zh active Active
-
2016
- 2016-03-11 US US15/067,779 patent/US9975194B2/en active Active
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