KR102147561B1 - 입자들 트래핑을 이용한 초음파 용접을 위한 방법 - Google Patents

입자들 트래핑을 이용한 초음파 용접을 위한 방법 Download PDF

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Publication number
KR102147561B1
KR102147561B1 KR1020167007050A KR20167007050A KR102147561B1 KR 102147561 B1 KR102147561 B1 KR 102147561B1 KR 1020167007050 A KR1020167007050 A KR 1020167007050A KR 20167007050 A KR20167007050 A KR 20167007050A KR 102147561 B1 KR102147561 B1 KR 102147561B1
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South Korea
Prior art keywords
components
welding
power semiconductor
ultrasonic welding
semiconductor module
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Korean (ko)
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KR20160054491A (ko
Inventor
벤카테쉬 시바수브라마니암
다비 기용
도미닉 트뤼쎌
마르쿠스 투트
자무엘 하르트만
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에이비비 슈바이쯔 아게
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0261—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using ultrasonic or sonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Optics & Photonics (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020167007050A 2013-09-17 2014-04-28 입자들 트래핑을 이용한 초음파 용접을 위한 방법 Active KR102147561B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13184769 2013-09-17
EP13184769.1 2013-09-17
PCT/EP2014/058604 WO2015039771A1 (en) 2013-09-17 2014-04-28 Method for ultrasonic welding with particles trapping

Publications (2)

Publication Number Publication Date
KR20160054491A KR20160054491A (ko) 2016-05-16
KR102147561B1 true KR102147561B1 (ko) 2020-08-25

Family

ID=49165665

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167007050A Active KR102147561B1 (ko) 2013-09-17 2014-04-28 입자들 트래핑을 이용한 초음파 용접을 위한 방법

Country Status (6)

Country Link
US (1) US9975194B2 (enExample)
EP (1) EP3046717B1 (enExample)
JP (1) JP6718819B2 (enExample)
KR (1) KR102147561B1 (enExample)
CN (1) CN105531068B (enExample)
WO (1) WO2015039771A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018202615A1 (en) * 2017-05-02 2018-11-08 Abb Schweiz Ag Resin encapsulated power semiconductor module with exposed terminal areas
JP7608749B2 (ja) * 2020-08-20 2025-01-07 株式会社大林組 作業方法及び泡状体製造装置
KR102376232B1 (ko) * 2020-10-28 2022-03-17 동명대학교 산학협력단 초음파 용접 방법

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JP2010040615A (ja) * 2008-08-01 2010-02-18 Hitachi Ltd 半導体装置

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Also Published As

Publication number Publication date
US20160193678A1 (en) 2016-07-07
US9975194B2 (en) 2018-05-22
CN105531068B (zh) 2018-11-23
WO2015039771A1 (en) 2015-03-26
CN105531068A (zh) 2016-04-27
KR20160054491A (ko) 2016-05-16
JP6718819B2 (ja) 2020-07-08
JP2016533040A (ja) 2016-10-20
EP3046717B1 (en) 2019-12-11
EP3046717A1 (en) 2016-07-27

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