JP6718819B2 - 粒子捕捉を用いる超音波溶接のための方法 - Google Patents

粒子捕捉を用いる超音波溶接のための方法 Download PDF

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Publication number
JP6718819B2
JP6718819B2 JP2016543334A JP2016543334A JP6718819B2 JP 6718819 B2 JP6718819 B2 JP 6718819B2 JP 2016543334 A JP2016543334 A JP 2016543334A JP 2016543334 A JP2016543334 A JP 2016543334A JP 6718819 B2 JP6718819 B2 JP 6718819B2
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Prior art keywords
welding
parts
foam
cleaning
particles
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JP2016543334A
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English (en)
Japanese (ja)
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JP2016533040A5 (enExample
JP2016533040A (ja
Inventor
シバスブラマニアム，ベンカテッシュ
ギヨン，ダビド
トリューセル，ドミニク
トゥート，マルクス
ハートマン，サミュエル
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ABB Schweiz AG
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ABB Schweiz AG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0261—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using ultrasonic or sonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Optics & Photonics (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2016543334A 2013-09-17 2014-04-28 粒子捕捉を用いる超音波溶接のための方法 Active JP6718819B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13184769.1 2013-09-17
EP13184769 2013-09-17
PCT/EP2014/058604 WO2015039771A1 (en) 2013-09-17 2014-04-28 Method for ultrasonic welding with particles trapping

Publications (3)

Publication Number Publication Date
JP2016533040A JP2016533040A (ja) 2016-10-20
JP2016533040A5 JP2016533040A5 (enExample) 2017-05-18
JP6718819B2 true JP6718819B2 (ja) 2020-07-08

Family

ID=49165665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016543334A Active JP6718819B2 (ja) 2013-09-17 2014-04-28 粒子捕捉を用いる超音波溶接のための方法

Country Status (6)

Country Link
US (1) US9975194B2 (enExample)
EP (1) EP3046717B1 (enExample)
JP (1) JP6718819B2 (enExample)
KR (1) KR102147561B1 (enExample)
CN (1) CN105531068B (enExample)
WO (1) WO2015039771A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018202615A1 (en) * 2017-05-02 2018-11-08 Abb Schweiz Ag Resin encapsulated power semiconductor module with exposed terminal areas
JP7608749B2 (ja) * 2020-08-20 2025-01-07 株式会社大林組 作業方法及び泡状体製造装置
KR102376232B1 (ko) * 2020-10-28 2022-03-17 동명대학교 산학협력단 초음파 용접 방법

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3393102A (en) 1965-01-15 1968-07-16 Lincoln Electric Co Arc welding flux
US3586122A (en) * 1970-04-27 1971-06-22 Branson Instr Sonic apparatus with sonic energy barrier means
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
KR900003157B1 (ko) * 1986-04-02 1990-05-09 가부시끼가이샤 히다찌세이샤꾸쇼 스루호울 도금의 전처리 방법
US4770730A (en) * 1987-09-29 1988-09-13 Tachi-S. Co., Ltd. Ultrasonic welding method for soft elastic foam body
JPH02105513A (ja) * 1988-10-14 1990-04-18 Nec Corp ヒューズ付きチップ状固体電解コンデンサ
JP2564415B2 (ja) * 1990-04-18 1996-12-18 株式会社日立製作所 空気流量検出器
US5239806A (en) * 1990-11-02 1993-08-31 Ak Technology, Inc. Thermoplastic semiconductor package and method of producing it
JP2662131B2 (ja) * 1991-12-26 1997-10-08 松下電器産業株式会社 ボンディング装置
AU675937B2 (en) * 1992-04-10 1997-02-27 W.L. Gore & Associates, Inc. A method of ultrasonically welding articles of porous polytetrafluoroethylene
DE69431023T2 (de) * 1993-09-01 2003-02-06 Kabushiki Kaisha Toshiba, Kawasaki Halbleiteraufbau und Verfahren zur Herstellung
JP3297254B2 (ja) * 1995-07-05 2002-07-02 株式会社東芝 半導体パッケージおよびその製造方法
KR100438256B1 (ko) * 1995-12-18 2004-08-25 마츠시타 덴끼 산교 가부시키가이샤 반도체장치 및 그 제조방법
JP3610999B2 (ja) * 1996-06-07 2005-01-19 松下電器産業株式会社 半導体素子の実装方法
US5926694A (en) * 1996-07-11 1999-07-20 Pfu Limited Semiconductor device and a manufacturing method thereof
JP2924830B2 (ja) * 1996-11-15 1999-07-26 日本電気株式会社 半導体装置及びその製造方法
JP3233059B2 (ja) * 1997-03-07 2001-11-26 株式会社村田製作所 超音波センサ
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
US5969461A (en) * 1998-04-08 1999-10-19 Cts Corporation Surface acoustic wave device package and method
JP2000068327A (ja) * 1998-08-20 2000-03-03 Matsushita Electric Ind Co Ltd 部品の実装方法と装置
KR20000057810A (ko) * 1999-01-28 2000-09-25 가나이 쓰토무 반도체 장치
JP4338834B2 (ja) 1999-08-06 2009-10-07 日本テキサス・インスツルメンツ株式会社 超音波振動を用いた半導体チップの実装方法
JP4592845B2 (ja) * 1999-09-21 2010-12-08 パナソニック株式会社 電池
JP4564118B2 (ja) * 1999-10-26 2010-10-20 パナソニック株式会社 電池及びその製造方法
JP2001178839A (ja) * 1999-12-27 2001-07-03 Taiho Ind Co Ltd 高熱粉粒体の処理方法
JP2001308145A (ja) * 2000-04-25 2001-11-02 Fujitsu Ltd 半導体チップの実装方法
CN1159620C (zh) * 2000-11-10 2004-07-28 株式会社村上开明堂 固态电致变色器件和使用这种器件的反射镜系统和crt显示器
WO2002071470A1 (fr) * 2001-03-02 2002-09-12 Toray Engineering Co., Ltd. Procede et dispositif de montage de puce
JP4199460B2 (ja) * 2002-01-23 2008-12-17 パナソニック株式会社 角形密閉式電池
US20060091184A1 (en) * 2004-10-28 2006-05-04 Art Bayot Method of mitigating voids during solder reflow
WO2007091931A1 (en) * 2006-02-10 2007-08-16 Sca Hygiene Products Ab Device and means of processing a material by means of an ultrasonic device
JP2006186401A (ja) * 2006-03-30 2006-07-13 Denso Corp 半導体装置及び半導体装置の製造方法
JP2006186402A (ja) * 2006-03-30 2006-07-13 Denso Corp 半導体装置及び半導体装置の製造方法
US20080060741A1 (en) * 2006-09-07 2008-03-13 Privitera Marc P Ultrasonically Bonded Nonwoven Permeable Pouch
KR100874925B1 (ko) * 2007-06-04 2008-12-19 삼성전자주식회사 반도체 패키지, 그 제조 방법, 이를 포함하는 카드 및 이를포함하는 시스템
US8813986B2 (en) * 2007-09-06 2014-08-26 Covidien Lp Touchless auto-drop sharps container
US20100084748A1 (en) * 2008-06-04 2010-04-08 National Semiconductor Corporation Thin foil for use in packaging integrated circuits
FR2934609B1 (fr) * 2008-07-30 2011-07-22 Jet Metal Technologies Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede.
JP2010040615A (ja) * 2008-08-01 2010-02-18 Hitachi Ltd 半導体装置
US8622261B2 (en) * 2008-08-14 2014-01-07 Hitachi Metals, Ltd. Molten metal supply cylinder, molten metal supply apparatus incorporating such a supply cylinder and molten metal supply method
WO2014000975A1 (en) 2012-06-26 2014-01-03 Abb Technology Ag Device and method for ultrasonic welding
CN102800833B (zh) * 2012-08-31 2015-03-18 江苏宏微科技股份有限公司 功率模块电极端子及其焊接方法
CN103143832A (zh) * 2013-02-26 2013-06-12 芜湖新宝超声波设备有限公司 一种超声波焊接机

Also Published As

Publication number Publication date
WO2015039771A1 (en) 2015-03-26
EP3046717B1 (en) 2019-12-11
JP2016533040A (ja) 2016-10-20
US9975194B2 (en) 2018-05-22
KR20160054491A (ko) 2016-05-16
US20160193678A1 (en) 2016-07-07
EP3046717A1 (en) 2016-07-27
KR102147561B1 (ko) 2020-08-25
CN105531068B (zh) 2018-11-23
CN105531068A (zh) 2016-04-27

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