CN105531068B - 带有颗粒捕集的用于超声波焊接的方法 - Google Patents
带有颗粒捕集的用于超声波焊接的方法 Download PDFInfo
- Publication number
- CN105531068B CN105531068B CN201480051289.8A CN201480051289A CN105531068B CN 105531068 B CN105531068 B CN 105531068B CN 201480051289 A CN201480051289 A CN 201480051289A CN 105531068 B CN105531068 B CN 105531068B
- Authority
- CN
- China
- Prior art keywords
- welding
- trapping
- foam
- cleaning
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0261—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using ultrasonic or sonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13184769.1 | 2013-09-17 | ||
| EP13184769 | 2013-09-17 | ||
| PCT/EP2014/058604 WO2015039771A1 (en) | 2013-09-17 | 2014-04-28 | Method for ultrasonic welding with particles trapping |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105531068A CN105531068A (zh) | 2016-04-27 |
| CN105531068B true CN105531068B (zh) | 2018-11-23 |
Family
ID=49165665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480051289.8A Active CN105531068B (zh) | 2013-09-17 | 2014-04-28 | 带有颗粒捕集的用于超声波焊接的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9975194B2 (enExample) |
| EP (1) | EP3046717B1 (enExample) |
| JP (1) | JP6718819B2 (enExample) |
| KR (1) | KR102147561B1 (enExample) |
| CN (1) | CN105531068B (enExample) |
| WO (1) | WO2015039771A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3613075B1 (en) * | 2017-05-02 | 2020-11-18 | ABB Schweiz AG | Resin encapsulated power semiconductor module with exposed terminal areas |
| JP7608749B2 (ja) * | 2020-08-20 | 2025-01-07 | 株式会社大林組 | 作業方法及び泡状体製造装置 |
| KR102376232B1 (ko) * | 2020-10-28 | 2022-03-17 | 동명대학교 산학협력단 | 초음파 용접 방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001178839A (ja) * | 1999-12-27 | 2001-07-03 | Taiho Ind Co Ltd | 高熱粉粒体の処理方法 |
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| US3393102A (en) | 1965-01-15 | 1968-07-16 | Lincoln Electric Co | Arc welding flux |
| US3586122A (en) * | 1970-04-27 | 1971-06-22 | Branson Instr | Sonic apparatus with sonic energy barrier means |
| JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
| KR900003157B1 (ko) * | 1986-04-02 | 1990-05-09 | 가부시끼가이샤 히다찌세이샤꾸쇼 | 스루호울 도금의 전처리 방법 |
| US4770730A (en) * | 1987-09-29 | 1988-09-13 | Tachi-S. Co., Ltd. | Ultrasonic welding method for soft elastic foam body |
| JPH02105513A (ja) * | 1988-10-14 | 1990-04-18 | Nec Corp | ヒューズ付きチップ状固体電解コンデンサ |
| JP2564415B2 (ja) * | 1990-04-18 | 1996-12-18 | 株式会社日立製作所 | 空気流量検出器 |
| US5239806A (en) * | 1990-11-02 | 1993-08-31 | Ak Technology, Inc. | Thermoplastic semiconductor package and method of producing it |
| JP2662131B2 (ja) * | 1991-12-26 | 1997-10-08 | 松下電器産業株式会社 | ボンディング装置 |
| EP0634971B1 (en) * | 1992-04-10 | 1998-05-27 | W.L. Gore & Associates, Inc. | A method of ultrasonically welding articles of porous polytetrafluoroethylene |
| EP0644587B1 (en) * | 1993-09-01 | 2002-07-24 | Kabushiki Kaisha Toshiba | Semiconductor package and fabrication method |
| JP3297254B2 (ja) * | 1995-07-05 | 2002-07-02 | 株式会社東芝 | 半導体パッケージおよびその製造方法 |
| KR100438256B1 (ko) * | 1995-12-18 | 2004-08-25 | 마츠시타 덴끼 산교 가부시키가이샤 | 반도체장치 및 그 제조방법 |
| JP3610999B2 (ja) * | 1996-06-07 | 2005-01-19 | 松下電器産業株式会社 | 半導体素子の実装方法 |
| US5926694A (en) * | 1996-07-11 | 1999-07-20 | Pfu Limited | Semiconductor device and a manufacturing method thereof |
| JP2924830B2 (ja) * | 1996-11-15 | 1999-07-26 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| JP3233059B2 (ja) * | 1997-03-07 | 2001-11-26 | 株式会社村田製作所 | 超音波センサ |
| US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
| US5969461A (en) * | 1998-04-08 | 1999-10-19 | Cts Corporation | Surface acoustic wave device package and method |
| JP2000068327A (ja) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 部品の実装方法と装置 |
| KR20000057810A (ko) * | 1999-01-28 | 2000-09-25 | 가나이 쓰토무 | 반도체 장치 |
| JP4338834B2 (ja) | 1999-08-06 | 2009-10-07 | 日本テキサス・インスツルメンツ株式会社 | 超音波振動を用いた半導体チップの実装方法 |
| JP4592845B2 (ja) * | 1999-09-21 | 2010-12-08 | パナソニック株式会社 | 電池 |
| JP4564118B2 (ja) * | 1999-10-26 | 2010-10-20 | パナソニック株式会社 | 電池及びその製造方法 |
| JP2001308145A (ja) * | 2000-04-25 | 2001-11-02 | Fujitsu Ltd | 半導体チップの実装方法 |
| CN1159620C (zh) * | 2000-11-10 | 2004-07-28 | 株式会社村上开明堂 | 固态电致变色器件和使用这种器件的反射镜系统和crt显示器 |
| US6993832B2 (en) * | 2001-03-02 | 2006-02-07 | Toray Engineering Co., Ltd. | Chip mounting device |
| JP4199460B2 (ja) * | 2002-01-23 | 2008-12-17 | パナソニック株式会社 | 角形密閉式電池 |
| US20060091184A1 (en) * | 2004-10-28 | 2006-05-04 | Art Bayot | Method of mitigating voids during solder reflow |
| WO2007091931A1 (en) * | 2006-02-10 | 2007-08-16 | Sca Hygiene Products Ab | Device and means of processing a material by means of an ultrasonic device |
| JP2006186402A (ja) * | 2006-03-30 | 2006-07-13 | Denso Corp | 半導体装置及び半導体装置の製造方法 |
| JP2006186401A (ja) * | 2006-03-30 | 2006-07-13 | Denso Corp | 半導体装置及び半導体装置の製造方法 |
| US20080060741A1 (en) * | 2006-09-07 | 2008-03-13 | Privitera Marc P | Ultrasonically Bonded Nonwoven Permeable Pouch |
| KR100874925B1 (ko) * | 2007-06-04 | 2008-12-19 | 삼성전자주식회사 | 반도체 패키지, 그 제조 방법, 이를 포함하는 카드 및 이를포함하는 시스템 |
| US8813986B2 (en) * | 2007-09-06 | 2014-08-26 | Covidien Lp | Touchless auto-drop sharps container |
| US20100084748A1 (en) * | 2008-06-04 | 2010-04-08 | National Semiconductor Corporation | Thin foil for use in packaging integrated circuits |
| FR2934609B1 (fr) * | 2008-07-30 | 2011-07-22 | Jet Metal Technologies | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
| JP2010040615A (ja) * | 2008-08-01 | 2010-02-18 | Hitachi Ltd | 半導体装置 |
| CN102123811A (zh) * | 2008-08-14 | 2011-07-13 | 日立金属株式会社 | 熔融金属供给筒、内置了该供给筒的熔融金属供给装置和熔融金属供给方法 |
| WO2014000975A1 (en) | 2012-06-26 | 2014-01-03 | Abb Technology Ag | Device and method for ultrasonic welding |
| CN102800833B (zh) * | 2012-08-31 | 2015-03-18 | 江苏宏微科技股份有限公司 | 功率模块电极端子及其焊接方法 |
| CN103143832A (zh) * | 2013-02-26 | 2013-06-12 | 芜湖新宝超声波设备有限公司 | 一种超声波焊接机 |
-
2014
- 2014-04-28 EP EP14720125.5A patent/EP3046717B1/en active Active
- 2014-04-28 CN CN201480051289.8A patent/CN105531068B/zh active Active
- 2014-04-28 JP JP2016543334A patent/JP6718819B2/ja active Active
- 2014-04-28 KR KR1020167007050A patent/KR102147561B1/ko active Active
- 2014-04-28 WO PCT/EP2014/058604 patent/WO2015039771A1/en not_active Ceased
-
2016
- 2016-03-11 US US15/067,779 patent/US9975194B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001178839A (ja) * | 1999-12-27 | 2001-07-03 | Taiho Ind Co Ltd | 高熱粉粒体の処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3046717A1 (en) | 2016-07-27 |
| KR20160054491A (ko) | 2016-05-16 |
| CN105531068A (zh) | 2016-04-27 |
| US20160193678A1 (en) | 2016-07-07 |
| WO2015039771A1 (en) | 2015-03-26 |
| JP2016533040A (ja) | 2016-10-20 |
| JP6718819B2 (ja) | 2020-07-08 |
| EP3046717B1 (en) | 2019-12-11 |
| KR102147561B1 (ko) | 2020-08-25 |
| US9975194B2 (en) | 2018-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180514 Address after: Baden, Switzerland Applicant after: ABB Switzerland Co.,Ltd. Address before: Zurich Applicant before: ABB TECHNOLOGY Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210624 Address after: Baden, Switzerland Patentee after: ABB grid Switzerland AG Address before: Baden, Switzerland Patentee before: ABB Switzerland Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Swiss Baden Patentee after: Hitachi energy Switzerland AG Address before: Swiss Baden Patentee before: ABB grid Switzerland AG |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240115 Address after: Zurich, SUI Patentee after: Hitachi Energy Co.,Ltd. Address before: Swiss Baden Patentee before: Hitachi energy Switzerland AG |
|
| TR01 | Transfer of patent right |