JP6718819B2 - 粒子捕捉を用いる超音波溶接のための方法 - Google Patents
粒子捕捉を用いる超音波溶接のための方法 Download PDFInfo
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/0261—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using ultrasonic or sonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
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- Thermal Sciences (AREA)
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Description
本発明の目的は、散乱粒子に関して改善された汚染挙動を提供する、溶接によって、特に超音波溶接によって2つの部品を接続する方法を提供することである。
a)溶接される上記部品を位置合わせして溶接界面を形成するステップと、
b)位置合わせされた上記部品に溶接工具を位置合わせするステップと、
c)上記溶接界面を少なくとも部分的に取囲む捕捉材料を除去可能なように配置するステップとを含み、それによって上記捕捉材料は発泡体であり、上記方法はさらに、
d)上記溶接工具を作動させることによって上記部品を接続するステップを含む。
図1は、発明に係る方法を示す概略図である。詳細には、図1は、パワー半導体モジュール製造の分野において超音波溶接によって2つの部品を接続する方法を示す。特に、基板10が示されており、基板10の上にメタライゼーション12が設けられている。さらに、メタライゼーション12に溶接される端子14が示されている。端子14と、メタライゼーション12を含む基板10とが位置合わせされて溶接界面16を形成する。さらに、ソノトロードなどの溶接工具18が位置合わせされ、端子14と接触し得る。溶接プロセスを実行するために、ソノトロードが作動され得る。
Claims (11)
- パワー半導体モジュールを製造するために超音波溶接によって2つの部品を接続する方法であって、前記方法は、
a)溶接される前記部品を位置合わせして溶接界面(16)を形成するステップと、
b)位置合わせされた前記部品に溶接工具(18)を位置合わせするステップと、
c)前記溶接界面(16)を少なくとも部分的に取囲む捕捉材料(20)を除去可能なように配置するステップとを備え、前記捕捉材料(20)は発泡体であり、前記方法はさらに、
d)前記溶接工具(18)を作動させることによって前記部品を接続する溶接ステップと、
e)前記溶接ステップの後に洗浄手順を実行して捕捉された粒子とともに前記捕捉材料を除去する洗浄ステップとを備える、方法。 - 前記発泡体のポケットは不活性ガスまたは界面活性剤で充填される、請求項1に記載の方法。
- ステップc)はステップb)の前に実行される、請求項1から2のいずれか一項に記載の方法。
- ステップc)はステップb)の後に実行される、請求項1から2のいずれか一項に記載の方法。
- 前記洗浄手順は、溶剤の塗布、消泡剤の塗布、湿式洗浄、空気吸込、空気吹込、蒸発または燃焼を備える、請求項1に記載の方法。
- 前記方法は、
f)表面張力低下材料によって前記パワー半導体モジュールの少なくとも1つの表面を前処理するさらなるステップを備える、請求項1から5のいずれか一項に記載の方法。 - 前記少なくとも1つの表面は高分子材料でコーティングされる、請求項6に記載の方法。
- ステップd)は、10℃以上80℃以下の範囲内の温度で実行される、請求項1から7のいずれか一項に記載の方法。
- ステップd)は、1mバール以上6バール以下の範囲内の圧力で実行される、請求項1から8のいずれか一項に記載の方法。
- ステップd)は、不活性ガスを含む雰囲気下で実行される、請求項1から9のいずれか一項に記載の方法。
- 溶接される前記部品は、金属またはポリマーから形成される、請求項1から10のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13184769.1 | 2013-09-17 | ||
EP13184769 | 2013-09-17 | ||
PCT/EP2014/058604 WO2015039771A1 (en) | 2013-09-17 | 2014-04-28 | Method for ultrasonic welding with particles trapping |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016533040A JP2016533040A (ja) | 2016-10-20 |
JP2016533040A5 JP2016533040A5 (ja) | 2017-05-18 |
JP6718819B2 true JP6718819B2 (ja) | 2020-07-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016543334A Active JP6718819B2 (ja) | 2013-09-17 | 2014-04-28 | 粒子捕捉を用いる超音波溶接のための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9975194B2 (ja) |
EP (1) | EP3046717B1 (ja) |
JP (1) | JP6718819B2 (ja) |
KR (1) | KR102147561B1 (ja) |
CN (1) | CN105531068B (ja) |
WO (1) | WO2015039771A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018202615A1 (en) | 2017-05-02 | 2018-11-08 | Abb Schweiz Ag | Resin encapsulated power semiconductor module with exposed terminal areas |
KR102376232B1 (ko) * | 2020-10-28 | 2022-03-17 | 동명대학교 산학협력단 | 초음파 용접 방법 |
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CN103143832A (zh) * | 2013-02-26 | 2013-06-12 | 芜湖新宝超声波设备有限公司 | 一种超声波焊接机 |
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JP2016533040A (ja) | 2016-10-20 |
KR102147561B1 (ko) | 2020-08-25 |
CN105531068B (zh) | 2018-11-23 |
US9975194B2 (en) | 2018-05-22 |
WO2015039771A1 (en) | 2015-03-26 |
CN105531068A (zh) | 2016-04-27 |
US20160193678A1 (en) | 2016-07-07 |
KR20160054491A (ko) | 2016-05-16 |
EP3046717A1 (en) | 2016-07-27 |
EP3046717B1 (en) | 2019-12-11 |
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