JP2006181641A5 - - Google Patents

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Publication number
JP2006181641A5
JP2006181641A5 JP2005332752A JP2005332752A JP2006181641A5 JP 2006181641 A5 JP2006181641 A5 JP 2006181641A5 JP 2005332752 A JP2005332752 A JP 2005332752A JP 2005332752 A JP2005332752 A JP 2005332752A JP 2006181641 A5 JP2006181641 A5 JP 2006181641A5
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JP
Japan
Prior art keywords
processing
processing chamber
pressure
gas
joining
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Withdrawn
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JP2005332752A
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English (en)
Japanese (ja)
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JP2006181641A (ja
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Priority to JP2005332752A priority Critical patent/JP2006181641A/ja
Priority claimed from JP2005332752A external-priority patent/JP2006181641A/ja
Priority to US11/291,838 priority patent/US20060118598A1/en
Publication of JP2006181641A publication Critical patent/JP2006181641A/ja
Publication of JP2006181641A5 publication Critical patent/JP2006181641A5/ja
Withdrawn legal-status Critical Current

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JP2005332752A 2004-12-02 2005-11-17 接合装置及び接合方法 Withdrawn JP2006181641A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005332752A JP2006181641A (ja) 2004-12-02 2005-11-17 接合装置及び接合方法
US11/291,838 US20060118598A1 (en) 2004-12-02 2005-12-02 Bonding apparatus and bonding method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004349454 2004-12-02
JP2005332752A JP2006181641A (ja) 2004-12-02 2005-11-17 接合装置及び接合方法

Publications (2)

Publication Number Publication Date
JP2006181641A JP2006181641A (ja) 2006-07-13
JP2006181641A5 true JP2006181641A5 (enExample) 2007-07-19

Family

ID=36573079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005332752A Withdrawn JP2006181641A (ja) 2004-12-02 2005-11-17 接合装置及び接合方法

Country Status (2)

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US (1) US20060118598A1 (enExample)
JP (1) JP2006181641A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008155245A (ja) * 2006-12-22 2008-07-10 Matsushita Electric Works Ltd 接合方法
JP5263923B2 (ja) * 2007-11-29 2013-08-14 国立大学法人 新潟大学 拡散接合方法及びその装置
JP5424201B2 (ja) * 2009-08-27 2014-02-26 アユミ工業株式会社 加熱溶融処理装置および加熱溶融処理方法
RU2397053C1 (ru) * 2009-09-11 2010-08-20 Открытое акционерное общество "Научно-исследовательский институт физических измерений" Установка для диффузионной сварки
KR101073558B1 (ko) * 2009-10-08 2011-10-17 삼성모바일디스플레이주식회사 기판 합착 장치 및 기판 합착 방법
JP2012227328A (ja) 2011-04-19 2012-11-15 Sony Corp 半導体装置、半導体装置の製造方法、固体撮像装置及び電子機器
TW201301413A (zh) * 2011-06-20 2013-01-01 華新麗華股份有限公司 晶片結合設備
TW201301412A (zh) * 2011-06-20 2013-01-01 華新麗華股份有限公司 晶片結合方法
WO2013161875A1 (ja) * 2012-04-25 2013-10-31 オリジン電気株式会社 半田付け装置及び半田付け製品の製造方法
DE112012005906A5 (de) * 2012-05-30 2014-10-30 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Bonden von Substraten
JP2014188536A (ja) * 2013-03-26 2014-10-06 National Institute For Materials Science 金属材の拡散接合方法および金属材の拡散接合装置
US9576928B2 (en) * 2015-02-27 2017-02-21 Kulicke And Soffa Industries, Inc. Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
JP6304189B2 (ja) * 2015-10-15 2018-04-04 トヨタ自動車株式会社 エンジンの燃料噴射制御装置
JP6625728B2 (ja) * 2016-03-17 2019-12-25 株式会社Ｊｃｕ プラズマ生成装置
RU2646517C1 (ru) * 2017-02-02 2018-03-05 Закрытое акционерное общество "Элитрон" Установка для диффузионной сварки
RU2680170C1 (ru) * 2017-11-15 2019-02-18 ООО "Авиационно-космические технологии" Устройство диффузионной сварки
CN109802030B (zh) * 2019-01-25 2020-02-21 楼显华 一种led元件及其生产方法
KR102707392B1 (ko) * 2019-04-29 2024-09-20 삼성전자주식회사 접합헤드 및 이를 구비하는 접합 장치
JP6879482B1 (ja) * 2020-01-09 2021-06-02 株式会社オリジン 酸化物除去済部材の製造方法及び酸化物除去装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516031A (en) * 1991-02-19 1996-05-14 Hitachi, Ltd. Soldering method and apparatus for use in connecting electronic circuit devices
US5271545A (en) * 1993-03-31 1993-12-21 Seco/Warwick Corporation Muffle convection brazing/annealing system
US5573174A (en) * 1994-08-15 1996-11-12 Pekol; Robert Automatic reflow soldering system
JP3693441B2 (ja) * 1996-12-27 2005-09-07 富士通株式会社 記録媒体の製造方法
US6152353A (en) * 1999-01-14 2000-11-28 Celestica International Inc. Printed circuit board header attachment station
JP3397313B2 (ja) * 1999-12-20 2003-04-14 富士通株式会社 半導体装置の製造方法及び電子部品の実装方法
US7296727B2 (en) * 2001-06-27 2007-11-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic components
US6806118B2 (en) * 2002-02-07 2004-10-19 Fujitsu Limited Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure

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