JP2006181641A - 接合装置及び接合方法 - Google Patents

接合装置及び接合方法 Download PDF

Info

Publication number
JP2006181641A
JP2006181641A JP2005332752A JP2005332752A JP2006181641A JP 2006181641 A JP2006181641 A JP 2006181641A JP 2005332752 A JP2005332752 A JP 2005332752A JP 2005332752 A JP2005332752 A JP 2005332752A JP 2006181641 A JP2006181641 A JP 2006181641A
Authority
JP
Japan
Prior art keywords
processing chamber
bonding
processing
joining
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005332752A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006181641A5 (enExample
Inventor
Hideki Tateishi
秀樹 立石
Yusuke Chikamori
祐介 近森
Naoaki Kogure
直明 小榑
Yukio Fukunaga
由紀夫 福永
Hiroyuki Kamiyama
浩幸 上山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2005332752A priority Critical patent/JP2006181641A/ja
Priority to US11/291,838 priority patent/US20060118598A1/en
Publication of JP2006181641A publication Critical patent/JP2006181641A/ja
Publication of JP2006181641A5 publication Critical patent/JP2006181641A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2005332752A 2004-12-02 2005-11-17 接合装置及び接合方法 Withdrawn JP2006181641A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005332752A JP2006181641A (ja) 2004-12-02 2005-11-17 接合装置及び接合方法
US11/291,838 US20060118598A1 (en) 2004-12-02 2005-12-02 Bonding apparatus and bonding method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004349454 2004-12-02
JP2005332752A JP2006181641A (ja) 2004-12-02 2005-11-17 接合装置及び接合方法

Publications (2)

Publication Number Publication Date
JP2006181641A true JP2006181641A (ja) 2006-07-13
JP2006181641A5 JP2006181641A5 (enExample) 2007-07-19

Family

ID=36573079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005332752A Withdrawn JP2006181641A (ja) 2004-12-02 2005-11-17 接合装置及び接合方法

Country Status (2)

Country Link
US (1) US20060118598A1 (enExample)
JP (1) JP2006181641A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008155245A (ja) * 2006-12-22 2008-07-10 Matsushita Electric Works Ltd 接合方法
RU2397053C1 (ru) * 2009-09-11 2010-08-20 Открытое акционерное общество "Научно-исследовательский институт физических измерений" Установка для диффузионной сварки
JP2014188536A (ja) * 2013-03-26 2014-10-06 National Institute For Materials Science 金属材の拡散接合方法および金属材の拡散接合装置
US9236412B2 (en) 2011-04-19 2016-01-12 Sony Corporation Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus
JP2017075574A (ja) * 2015-10-15 2017-04-20 トヨタ自動車株式会社 エンジンの燃料噴射制御装置
RU2646517C1 (ru) * 2017-02-02 2018-03-05 Закрытое акционерное общество "Элитрон" Установка для диффузионной сварки
RU2680170C1 (ru) * 2017-11-15 2019-02-18 ООО "Авиационно-космические технологии" Устройство диффузионной сварки
KR20200126269A (ko) * 2019-04-29 2020-11-06 삼성전자주식회사 접합헤드 및 이를 구비하는 접합 장치
RU2809742C1 (ru) * 2023-01-24 2023-12-15 Общество с ограниченной ответственностью "НОВА СПБ" Установка для диффузионной сварки

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5263923B2 (ja) * 2007-11-29 2013-08-14 国立大学法人 新潟大学 拡散接合方法及びその装置
JP5424201B2 (ja) * 2009-08-27 2014-02-26 アユミ工業株式会社 加熱溶融処理装置および加熱溶融処理方法
KR101073558B1 (ko) * 2009-10-08 2011-10-17 삼성모바일디스플레이주식회사 기판 합착 장치 및 기판 합착 방법
TW201301413A (zh) * 2011-06-20 2013-01-01 華新麗華股份有限公司 晶片結合設備
TW201301412A (zh) * 2011-06-20 2013-01-01 華新麗華股份有限公司 晶片結合方法
WO2013161875A1 (ja) * 2012-04-25 2013-10-31 オリジン電気株式会社 半田付け装置及び半田付け製品の製造方法
DE112012005906A5 (de) * 2012-05-30 2014-10-30 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Bonden von Substraten
US9576928B2 (en) * 2015-02-27 2017-02-21 Kulicke And Soffa Industries, Inc. Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
JP6625728B2 (ja) * 2016-03-17 2019-12-25 株式会社Ｊｃｕ プラズマ生成装置
CN109802030B (zh) * 2019-01-25 2020-02-21 楼显华 一种led元件及其生产方法
JP6879482B1 (ja) * 2020-01-09 2021-06-02 株式会社オリジン 酸化物除去済部材の製造方法及び酸化物除去装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516031A (en) * 1991-02-19 1996-05-14 Hitachi, Ltd. Soldering method and apparatus for use in connecting electronic circuit devices
US5271545A (en) * 1993-03-31 1993-12-21 Seco/Warwick Corporation Muffle convection brazing/annealing system
US5573174A (en) * 1994-08-15 1996-11-12 Pekol; Robert Automatic reflow soldering system
JP3693441B2 (ja) * 1996-12-27 2005-09-07 富士通株式会社 記録媒体の製造方法
US6152353A (en) * 1999-01-14 2000-11-28 Celestica International Inc. Printed circuit board header attachment station
JP3397313B2 (ja) * 1999-12-20 2003-04-14 富士通株式会社 半導体装置の製造方法及び電子部品の実装方法
US7296727B2 (en) * 2001-06-27 2007-11-20 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic components
US6806118B2 (en) * 2002-02-07 2004-10-19 Fujitsu Limited Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008155245A (ja) * 2006-12-22 2008-07-10 Matsushita Electric Works Ltd 接合方法
RU2397053C1 (ru) * 2009-09-11 2010-08-20 Открытое акционерное общество "Научно-исследовательский институт физических измерений" Установка для диффузионной сварки
US9236412B2 (en) 2011-04-19 2016-01-12 Sony Corporation Semiconductor device, manufacturing method thereof, solid-state imaging device, and electronic apparatus
US11948833B2 (en) 2011-04-19 2024-04-02 Sony Group Corporation Multilayer light detecting device and electronic apparatus
JP2014188536A (ja) * 2013-03-26 2014-10-06 National Institute For Materials Science 金属材の拡散接合方法および金属材の拡散接合装置
JP2017075574A (ja) * 2015-10-15 2017-04-20 トヨタ自動車株式会社 エンジンの燃料噴射制御装置
RU2646517C1 (ru) * 2017-02-02 2018-03-05 Закрытое акционерное общество "Элитрон" Установка для диффузионной сварки
RU2680170C1 (ru) * 2017-11-15 2019-02-18 ООО "Авиационно-космические технологии" Устройство диффузионной сварки
KR20200126269A (ko) * 2019-04-29 2020-11-06 삼성전자주식회사 접합헤드 및 이를 구비하는 접합 장치
KR102707392B1 (ko) 2019-04-29 2024-09-20 삼성전자주식회사 접합헤드 및 이를 구비하는 접합 장치
RU2809742C1 (ru) * 2023-01-24 2023-12-15 Общество с ограниченной ответственностью "НОВА СПБ" Установка для диффузионной сварки
RU239163U1 (ru) * 2025-03-25 2025-11-25 Федеральное государственное бюджетное образовательное учреждение высшего образования "Саратовский государственный технический университет имени Гагарина Ю.А." Устройство для диффузионной сварки

Also Published As

Publication number Publication date
US20060118598A1 (en) 2006-06-08

Similar Documents

Publication Publication Date Title
JP2006181641A (ja) 接合装置及び接合方法
TWI482254B (zh) Bonding system, bonding method and computer memory media
KR100809126B1 (ko) 피처리체 처리 장치
TW201933427A (zh) 接合系統及接合方法
JP4027072B2 (ja) 減圧プラズマ処理装置及びその方法
JP2005039185A5 (enExample)
JP2005294800A (ja) 接合方法及びこの方法により作成されるデバイス並びに表面活性化装置及びこの装置を備えた接合装置
CN100440475C (zh) 算出搬送机构的搬送偏差的方法及半导体处理装置
JP4669600B2 (ja) 実装装置
TWI360195B (enExample)
JP4377035B2 (ja) 実装方法および装置
JP3948325B2 (ja) フィルム基板処理方法
JP7268931B2 (ja) 接合方法、基板接合装置および基板接合システム
JP2008004601A (ja) 基板搬送装置およびそれを用いた基板搬送方法
JP6120749B2 (ja) 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
JPS63141342A (ja) 半導体ウエハ処理方法及びその装置
JP2004231331A (ja) 基板の搬送方法及び基板の搬送装置
JP2006287181A5 (enExample)
TW202326897A (zh) 半導體製造裝置及其製造方法
JP5385024B2 (ja) 半導体製造装置及び半導体製造方法
JP3970732B2 (ja) 接合方法および装置
JP4440284B2 (ja) 減圧プラズマ処理装置及びその方法
TWI905426B (zh) 接合方法及接合裝置
JP4701933B2 (ja) プラズマｃｖｄ装置
JP2006024697A (ja) ハンドリングツール及びこのツールを用いた部品搬送装置並びに方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070605

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070605

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20090807