|
US2757320A
(en)
*
|
1953-10-15 |
1956-07-31 |
Westinghouse Electric Corp |
Frequency sensitive control device
|
|
US3656162A
(en)
*
|
1969-09-19 |
1972-04-11 |
Litton Systems Inc |
Diplexer for radio communication
|
|
JPS5291446U
(enExample)
|
1975-12-29 |
1977-07-08 |
|
|
|
JP3139327B2
(ja)
|
1995-05-31 |
2001-02-26 |
株式会社村田製作所 |
高周波複合部品
|
|
US5548255A
(en)
|
1995-06-23 |
1996-08-20 |
Microphase Corporation |
Compact diplexer connection circuit
|
|
JPH0945866A
(ja)
|
1995-08-02 |
1997-02-14 |
Hitachi Ltd |
マイクロ波集積回路
|
|
JPH0992539A
(ja)
|
1995-09-22 |
1997-04-04 |
Uniden Corp |
立体渦巻状インダクタ及びそれを用いた誘導結合フィルタ
|
|
US6366564B1
(en)
|
1996-09-26 |
2002-04-02 |
Matsushita Electric Industrial Co., Ltd. |
Diplexer duplexer and two-channel mobile communications equipment
|
|
US5886597A
(en)
|
1997-03-28 |
1999-03-23 |
Virginia Tech Intellectual Properties, Inc. |
Circuit structure including RF/wideband resonant vias
|
|
JPH11112264A
(ja)
*
|
1997-10-08 |
1999-04-23 |
Murata Mfg Co Ltd |
フィルタ
|
|
US6013939A
(en)
|
1997-10-31 |
2000-01-11 |
National Scientific Corp. |
Monolithic inductor with magnetic flux lines guided away from substrate
|
|
US6417754B1
(en)
*
|
1997-12-08 |
2002-07-09 |
The Regents Of The University Of California |
Three-dimensional coil inductor
|
|
JP3255105B2
(ja)
*
|
1998-01-22 |
2002-02-12 |
株式会社村田製作所 |
高周波複合部品
|
|
US6180976B1
(en)
|
1999-02-02 |
2001-01-30 |
Conexant Systems, Inc. |
Thin-film capacitors and methods for forming the same
|
|
JP2001136045A
(ja)
|
1999-08-23 |
2001-05-18 |
Murata Mfg Co Ltd |
積層型複合電子部品
|
|
JP2001119209A
(ja)
|
1999-10-15 |
2001-04-27 |
Murata Mfg Co Ltd |
積層型フィルタモジュール
|
|
KR100316693B1
(ko)
|
1999-12-22 |
2001-12-20 |
박종섭 |
이동통신 기지국의 rf블록
|
|
JP2002008942A
(ja)
|
2000-06-16 |
2002-01-11 |
Fujitsu Ltd |
コンデンサ装置、コンデンサ装置の製造方法及びコンデンサ装置が実装されたモジュール
|
|
KR100860281B1
(ko)
|
2000-08-04 |
2008-09-25 |
미츠비시 마테리알 가부시키가이샤 |
안테나
|
|
KR100382765B1
(ko)
|
2001-06-15 |
2003-05-09 |
삼성전자주식회사 |
송수신용 수동소자와 그 집적모듈 및 그 제조방법
|
|
JP2003014592A
(ja)
|
2001-06-28 |
2003-01-15 |
Nippon Shooter Ltd |
オンライン式ジャグ真空化装置およびその真空化方法
|
|
CN1630946A
(zh)
|
2001-07-12 |
2005-06-22 |
株式会社日立制作所 |
电子电路部件
|
|
US6597258B2
(en)
|
2001-08-30 |
2003-07-22 |
Spectrum Astro |
High performance diplexer and method
|
|
JP2003100553A
(ja)
|
2001-09-26 |
2003-04-04 |
Toshiba Corp |
受動素子部品及び受動素子内蔵基板
|
|
JP3998984B2
(ja)
|
2002-01-18 |
2007-10-31 |
富士通株式会社 |
回路基板及びその製造方法
|
|
JP2003258675A
(ja)
*
|
2002-02-27 |
2003-09-12 |
Kyocera Corp |
通信制御方法
|
|
JP4103502B2
(ja)
|
2002-08-28 |
2008-06-18 |
株式会社トッパンNecサーキットソリューションズ |
多層配線板及びその製造方法
|
|
KR100691725B1
(ko)
|
2002-12-11 |
2007-03-12 |
다이니폰 인사츠 가부시키가이샤 |
다층 배선기판 및 그 제조 방법
|
|
JP2004200227A
(ja)
|
2002-12-16 |
2004-07-15 |
Alps Electric Co Ltd |
プリントインダクタ
|
|
JP2004281847A
(ja)
*
|
2003-03-18 |
2004-10-07 |
Tdk Corp |
積層複合電子部品
|
|
JP2004281850A
(ja)
|
2003-03-18 |
2004-10-07 |
Tdk Corp |
積層複合電子部品
|
|
US7044390B2
(en)
|
2003-06-02 |
2006-05-16 |
Stmicroelectronics, Inc. |
Smart card emulator and related methods using buffering interface
|
|
US8046508B2
(en)
|
2004-04-21 |
2011-10-25 |
Stmicroelectronics, Inc. |
Smart card with self-detachment features and related methods
|
|
WO2006070807A1
(ja)
|
2004-12-28 |
2006-07-06 |
Ngk Spark Plug Co., Ltd. |
配線基板及び配線基板の製造方法
|
|
JP2006279604A
(ja)
|
2005-03-29 |
2006-10-12 |
Tdk Corp |
弾性表面波装置
|
|
EP1889359B1
(en)
*
|
2005-06-08 |
2013-01-16 |
The Regents of the University of California |
Linear variable voltage diode capacitor and adaptive matching networks
|
|
US7323948B2
(en)
|
2005-08-23 |
2008-01-29 |
International Business Machines Corporation |
Vertical LC tank device
|
|
WO2007061308A1
(en)
|
2005-11-24 |
2007-05-31 |
Technische Universiteit Delft |
Varactor element and low distortion varactor circuit arrangement
|
|
JP5055768B2
(ja)
|
2006-01-16 |
2012-10-24 |
富士通セミコンダクター株式会社 |
半導体装置及びその製造方法
|
|
CN100382065C
(zh)
|
2006-03-31 |
2008-04-16 |
北京飞天诚信科技有限公司 |
基于usb接口的智能卡读写器及其控制方法
|
|
US7498918B2
(en)
|
2006-04-04 |
2009-03-03 |
United Microelectronics Corp. |
Inductor structure
|
|
EP1850491A3
(en)
|
2006-04-26 |
2012-02-22 |
Hitachi Metals, Ltd. |
High-frequency circuit, high-frequency device and communications apparatus
|
|
US7843302B2
(en)
|
2006-05-08 |
2010-11-30 |
Ibiden Co., Ltd. |
Inductor and electric power supply using it
|
|
US7825745B1
(en)
|
2006-09-12 |
2010-11-02 |
Rf Magic Inc. |
Variable bandwidth tunable silicon duplexer
|
|
TWI333684B
(en)
|
2006-11-07 |
2010-11-21 |
Unimicron Technology Corp |
Package substrate having embedded capacitor
|
|
EP2092738B1
(en)
|
2006-12-04 |
2017-08-23 |
Thomson Licensing DTV |
Tuning device with diplexer input
|
|
DE102006058068B4
(de)
|
2006-12-07 |
2018-04-05 |
Infineon Technologies Ag |
Halbleiterbauelement mit Halbleiterchip und passivem Spulen-Bauelement sowie Verfahren zu dessen Herstellung
|
|
JP2008171965A
(ja)
|
2007-01-11 |
2008-07-24 |
Fuji Electric Device Technology Co Ltd |
超小型電力変換装置
|
|
JP2008182340A
(ja)
|
2007-01-23 |
2008-08-07 |
Ngk Spark Plug Co Ltd |
ダイプレクサ及びそれを用いたマルチプレクサ
|
|
US7821359B2
(en)
|
2007-07-09 |
2010-10-26 |
John Messalingua Associates, Inc. |
Band-stop filters
|
|
TWI345243B
(en)
*
|
2007-08-14 |
2011-07-11 |
Ind Tech Res Inst |
Inter-helix inductor devices
|
|
EP2200179B1
(en)
*
|
2007-10-23 |
2012-08-29 |
Murata Manufacturing Co., Ltd. |
Laminated electronic component and method for manufacturing the same
|
|
JP4605404B2
(ja)
*
|
2007-11-12 |
2011-01-05 |
Tdk株式会社 |
電子部品
|
|
JP2009159328A
(ja)
*
|
2007-12-26 |
2009-07-16 |
Ngk Spark Plug Co Ltd |
マルチプレクサ、トリプレクサ及びダイプレクサ
|
|
US20090219908A1
(en)
|
2008-02-29 |
2009-09-03 |
Ahmadreza Rofougaran |
Method and system for processing signals via diplexers embedded in an integrated circuit package
|
|
WO2009118694A1
(en)
|
2008-03-25 |
2009-10-01 |
Nxp B.V. |
Integrated 3d high density and high quality inductive element
|
|
WO2009128047A1
(en)
|
2008-04-18 |
2009-10-22 |
Nxp B.V. |
High density inductor, having a high quality factor
|
|
US8442586B2
(en)
|
2008-05-08 |
2013-05-14 |
Texas Instruments Incorporated |
Determining USB/ISO interface and power supply voltage in mobile device
|
|
EP2175455B1
(en)
|
2008-10-13 |
2012-12-12 |
Vodafone Holding GmbH |
Method for providing controlled access to a memory card and memory card
|
|
US8143696B2
(en)
|
2009-03-18 |
2012-03-27 |
Agere Systems Inc. |
Integrated circuit inductors with reduced magnetic coupling
|
|
US7955942B2
(en)
|
2009-05-18 |
2011-06-07 |
Stats Chippac, Ltd. |
Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame
|
|
US8143952B2
(en)
|
2009-10-08 |
2012-03-27 |
Qualcomm Incorporated |
Three dimensional inductor and transformer
|
|
US8344478B2
(en)
|
2009-10-23 |
2013-01-01 |
Maxim Integrated Products, Inc. |
Inductors having inductor axis parallel to substrate surface
|
|
US8391316B2
(en)
|
2009-11-06 |
2013-03-05 |
Broadcom Corporation |
Front-end system for processing composite wideband signals and method for utilizing same
|
|
JP2011159953A
(ja)
*
|
2010-01-05 |
2011-08-18 |
Fujitsu Ltd |
電子回路及び電子機器
|
|
US20110248405A1
(en)
|
2010-04-09 |
2011-10-13 |
Qualcomm Incorporated |
Selective Patterning for Low Cost through Vias
|
|
US8384507B2
(en)
*
|
2010-06-01 |
2013-02-26 |
Qualcomm Incorporated |
Through via inductor or transformer in a high-resistance substrate with programmability
|
|
US8362591B2
(en)
|
2010-06-08 |
2013-01-29 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Integrated circuits and methods of forming the same
|
|
WO2012040063A1
(en)
|
2010-09-23 |
2012-03-29 |
Qualcomm Mems Technologies, Inc. |
Integrated passives and power amplifier
|
|
US8405135B2
(en)
|
2010-10-05 |
2013-03-26 |
International Business Machines Corporation |
3D via capacitor with a floating conductive plate for improved reliability
|
|
JP2012100180A
(ja)
*
|
2010-11-05 |
2012-05-24 |
Hitachi Media Electoronics Co Ltd |
チューナブルフィルタ、チューナブルデュプレクサ、及び、それらを用いた移動通信端末
|
|
CN102569249B
(zh)
|
2010-12-08 |
2014-01-22 |
财团法人工业技术研究院 |
立体式电感
|
|
US8736399B2
(en)
|
2011-04-06 |
2014-05-27 |
M/A-Com Technology Solutions Holdings, Inc. |
Triplexer topology
|
|
JP5780298B2
(ja)
|
2011-04-18 |
2015-09-16 |
株式会社村田製作所 |
アンテナ装置および通信端末装置
|
|
US9002309B2
(en)
|
2011-05-27 |
2015-04-07 |
Qualcomm Incorporated |
Tunable multi-band receiver
|
|
US8803615B2
(en)
*
|
2012-01-23 |
2014-08-12 |
Qualcomm Incorporated |
Impedance matching circuit with tunable notch filters for power amplifier
|
|
US20130207745A1
(en)
|
2012-02-13 |
2013-08-15 |
Qualcomm Incorporated |
3d rf l-c filters using through glass vias
|
|
US20130223412A1
(en)
|
2012-02-24 |
2013-08-29 |
Qualcomm Incorporated |
Method and system to improve frame early termination success rate
|
|
US9203373B2
(en)
|
2013-01-11 |
2015-12-01 |
Qualcomm Incorporated |
Diplexer design using through glass via technology
|
|
US9935166B2
(en)
|
2013-03-15 |
2018-04-03 |
Qualcomm Incorporated |
Capacitor with a dielectric between a via and a plate of the capacitor
|
|
US9634640B2
(en)
|
2013-05-06 |
2017-04-25 |
Qualcomm Incorporated |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
|
|
US9264013B2
(en)
|
2013-06-04 |
2016-02-16 |
Qualcomm Incorporated |
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
|