JP2018526933A5 - - Google Patents

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Publication number
JP2018526933A5
JP2018526933A5 JP2018512862A JP2018512862A JP2018526933A5 JP 2018526933 A5 JP2018526933 A5 JP 2018526933A5 JP 2018512862 A JP2018512862 A JP 2018512862A JP 2018512862 A JP2018512862 A JP 2018512862A JP 2018526933 A5 JP2018526933 A5 JP 2018526933A5
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JP
Japan
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signal
input
output
chip
flip
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JP2018512862A
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Japanese (ja)
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JP6648262B2 (ja
JP2018526933A (ja
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Priority claimed from US14/853,802 external-priority patent/US9443810B1/en
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JP2018512862A 2015-09-14 2016-08-30 一体型キャビティフィルタを使用するフリップチップ、ならびに関連する構成要素、システム、および方法 Active JP6648262B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/853,802 US9443810B1 (en) 2015-09-14 2015-09-14 Flip-chip employing integrated cavity filter, and related components, systems, and methods
US14/853,802 2015-09-14
PCT/US2016/049440 WO2017048500A1 (en) 2015-09-14 2016-08-30 Flip-chip employing integrated cavity filter, and related components, systems, and methods

Publications (3)

Publication Number Publication Date
JP2018526933A JP2018526933A (ja) 2018-09-13
JP2018526933A5 true JP2018526933A5 (enExample) 2019-12-26
JP6648262B2 JP6648262B2 (ja) 2020-02-14

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ID=56881442

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JP2018512862A Active JP6648262B2 (ja) 2015-09-14 2016-08-30 一体型キャビティフィルタを使用するフリップチップ、ならびに関連する構成要素、システム、および方法

Country Status (11)

Country Link
US (2) US9443810B1 (enExample)
EP (1) EP3350874B1 (enExample)
JP (1) JP6648262B2 (enExample)
KR (1) KR102118558B1 (enExample)
CN (1) CN108028453B (enExample)
BR (1) BR112018004941B1 (enExample)
CA (1) CA2993991A1 (enExample)
ES (1) ES2763034T3 (enExample)
HU (1) HUE046872T2 (enExample)
TW (1) TWI588913B (enExample)
WO (1) WO2017048500A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9443810B1 (en) 2015-09-14 2016-09-13 Qualcomm Incorporated Flip-chip employing integrated cavity filter, and related components, systems, and methods
WO2017171807A1 (en) * 2016-03-31 2017-10-05 Intel Corporation Semiconductor package with electromagnetic interference shielding using metal layers and vias
EP3679385B1 (en) * 2017-09-07 2022-10-26 Amherst College Loop-gap resonators for spin resonance spectroscopy
WO2019070265A1 (en) * 2017-10-05 2019-04-11 Google Llc LOW-DIMENSIONAL RESONATOR IN RETURNED CHIP GEOMETRY
WO2019079123A1 (en) * 2017-10-17 2019-04-25 Commscope Technologies Llc VERTICAL TRANSITIONS FOR MICROWAVE AND MILLIMETER WAVE COMMUNICATION SYSTEMS HAVING MULTILAYER SUBSTRATES
JP6965732B2 (ja) * 2017-12-26 2021-11-10 Tdk株式会社 バンドパスフィルタ
CN109219299B (zh) * 2018-10-31 2023-08-18 重庆山淞信息技术有限公司 一种多滤波功能的滤波器
CN109768357B (zh) * 2019-02-25 2020-12-08 广东曼克维通信科技有限公司 一种传输零点可控的基片集成波导滤波器
CN114285391B (zh) * 2021-03-23 2025-12-16 偲百创(深圳)科技有限公司 射频滤波器及其制造方法
CN115938408B (zh) * 2021-08-26 2025-06-03 株式会社东芝 盘装置

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US6130483A (en) 1997-03-05 2000-10-10 Kabushiki Kaisha Toshiba MMIC module using flip-chip mounting
US6297716B1 (en) * 1999-12-16 2001-10-02 Lockheed Martin Corporation Q-switched cavity multiplier
JP2002026611A (ja) * 2000-07-07 2002-01-25 Nec Corp フィルタ
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
DE102004014018B3 (de) 2004-03-19 2005-08-11 Forschungsverbund Berlin E.V. Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen
JP5371997B2 (ja) 2008-09-05 2013-12-18 三菱電機株式会社 高周波回路パッケージおよびセンサモジュール
WO2010139366A1 (en) 2009-06-04 2010-12-09 Telefonaktiebolaget L M Ericsson (Publ) A package resonator cavity
KR101077011B1 (ko) 2009-06-09 2011-10-26 서울대학교산학협력단 미세가공 공동 공진기와 그 제조 방법 및 이를 이용한 대역통과 필터와 발진기
US8301092B2 (en) * 2009-06-09 2012-10-30 Broadcom Corporation Method and system for a low noise amplifier utilizing a leaky wave antenna
JP5499879B2 (ja) * 2010-04-26 2014-05-21 三菱電機株式会社 高周波フィルタ
US9398694B2 (en) * 2011-01-18 2016-07-19 Sony Corporation Method of manufacturing a package for embedding one or more electronic components
US8749056B2 (en) * 2011-05-26 2014-06-10 Infineon Technologies Ag Module and method of manufacturing a module
CN202120888U (zh) * 2011-06-21 2012-01-18 成都嘉纳海威科技有限责任公司 一种超宽带多功能变频芯片
US8866291B2 (en) 2012-02-10 2014-10-21 Raytheon Company Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
US9123983B1 (en) * 2012-07-20 2015-09-01 Hittite Microwave Corporation Tunable bandpass filter integrated circuit
CN203434139U (zh) * 2013-08-16 2014-02-12 深圳华远微电科技有限公司 倒装芯片式滤波器封装结构
US10062494B2 (en) * 2014-11-03 2018-08-28 Qorvo Us, Inc. Apparatus with 3D inductors
US9443810B1 (en) 2015-09-14 2016-09-13 Qualcomm Incorporated Flip-chip employing integrated cavity filter, and related components, systems, and methods

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