CN105191123B - 三维(3d)集成电路(ic)(3dic)中的可调谐共用器以及相关组件和方法 - Google Patents
三维(3d)集成电路(ic)(3dic)中的可调谐共用器以及相关组件和方法 Download PDFInfo
- Publication number
- CN105191123B CN105191123B CN201480025365.8A CN201480025365A CN105191123B CN 105191123 B CN105191123 B CN 105191123B CN 201480025365 A CN201480025365 A CN 201480025365A CN 105191123 B CN105191123 B CN 105191123B
- Authority
- CN
- China
- Prior art keywords
- inductor
- varactor
- duplexer
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000001413 cellular effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 34
- 238000005516 engineering process Methods 0.000 description 9
- 238000013461 design Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 230000002776 aggregation Effects 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 239000000969 carrier Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011017 operating method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 101100154785 Mus musculus Tulp2 gene Proteins 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/461—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source particularly adapted for use in common antenna systems
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Transceivers (AREA)
- Filters And Equalizers (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/887,568 | 2013-05-06 | ||
| US13/887,568 US9634640B2 (en) | 2013-05-06 | 2013-05-06 | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| PCT/US2014/036524 WO2014182556A1 (en) | 2013-05-06 | 2014-05-02 | Tunable diplexers in three-dimensional (3d) integrated circuits (ic) (3dic) and related components and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105191123A CN105191123A (zh) | 2015-12-23 |
| CN105191123B true CN105191123B (zh) | 2019-03-05 |
Family
ID=50896553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480025365.8A Expired - Fee Related CN105191123B (zh) | 2013-05-06 | 2014-05-02 | 三维(3d)集成电路(ic)(3dic)中的可调谐共用器以及相关组件和方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9634640B2 (enExample) |
| EP (1) | EP2995002A1 (enExample) |
| JP (1) | JP2016526287A (enExample) |
| KR (1) | KR20160005064A (enExample) |
| CN (1) | CN105191123B (enExample) |
| WO (1) | WO2014182556A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070200803A1 (en) * | 2005-07-27 | 2007-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Display device, and driving method and electronic device thereof |
| US9203373B2 (en) | 2013-01-11 | 2015-12-01 | Qualcomm Incorporated | Diplexer design using through glass via technology |
| US9935166B2 (en) | 2013-03-15 | 2018-04-03 | Qualcomm Incorporated | Capacitor with a dielectric between a via and a plate of the capacitor |
| US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9264013B2 (en) | 2013-06-04 | 2016-02-16 | Qualcomm Incorporated | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
| US9800338B2 (en) * | 2014-07-25 | 2017-10-24 | Arris Enterprises Llc | Configurable diplex filter with tunable inductors |
| US10256863B2 (en) | 2016-01-11 | 2019-04-09 | Qualcomm Incorporated | Monolithic integration of antenna switch and diplexer |
| US10103703B2 (en) | 2016-05-20 | 2018-10-16 | Qualcomm Incorporated | Double-sided circuit |
| JP6881406B2 (ja) * | 2018-08-31 | 2021-06-02 | 株式会社村田製作所 | 方向性結合器 |
| US11652468B2 (en) * | 2020-07-07 | 2023-05-16 | Qualcomm Incorporated | High performance tunable filter |
| US11342246B2 (en) * | 2020-07-21 | 2022-05-24 | Qualcomm Incorporated | Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices |
| US11201602B1 (en) * | 2020-09-17 | 2021-12-14 | Analog Devices, Inc. | Apparatus and methods for tunable filtering |
| US11770115B2 (en) | 2020-10-16 | 2023-09-26 | Qualcomm Incorporated | Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methods |
| CN115084068A (zh) | 2021-03-12 | 2022-09-20 | 京东方科技集团股份有限公司 | 半导体装置及其制造方法 |
| CN115084069B (zh) | 2021-03-12 | 2025-02-07 | 京东方科技集团股份有限公司 | 半导体装置及其制造方法 |
| CN115241163B (zh) * | 2021-04-23 | 2025-03-25 | 京东方科技集团股份有限公司 | 可调滤波器及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101436694A (zh) * | 2007-11-12 | 2009-05-20 | Tdk株式会社 | 电子部件 |
| CN101821943A (zh) * | 2007-10-23 | 2010-09-01 | 株式会社村田制作所 | 层叠型电子元器件及其制造方法 |
Family Cites Families (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2757320A (en) * | 1953-10-15 | 1956-07-31 | Westinghouse Electric Corp | Frequency sensitive control device |
| US3656162A (en) * | 1969-09-19 | 1972-04-11 | Litton Systems Inc | Diplexer for radio communication |
| JPS5291446U (enExample) | 1975-12-29 | 1977-07-08 | ||
| JP3139327B2 (ja) | 1995-05-31 | 2001-02-26 | 株式会社村田製作所 | 高周波複合部品 |
| US5548255A (en) | 1995-06-23 | 1996-08-20 | Microphase Corporation | Compact diplexer connection circuit |
| JPH0945866A (ja) | 1995-08-02 | 1997-02-14 | Hitachi Ltd | マイクロ波集積回路 |
| JPH0992539A (ja) | 1995-09-22 | 1997-04-04 | Uniden Corp | 立体渦巻状インダクタ及びそれを用いた誘導結合フィルタ |
| US6366564B1 (en) | 1996-09-26 | 2002-04-02 | Matsushita Electric Industrial Co., Ltd. | Diplexer duplexer and two-channel mobile communications equipment |
| US5886597A (en) | 1997-03-28 | 1999-03-23 | Virginia Tech Intellectual Properties, Inc. | Circuit structure including RF/wideband resonant vias |
| JPH11112264A (ja) * | 1997-10-08 | 1999-04-23 | Murata Mfg Co Ltd | フィルタ |
| US6013939A (en) | 1997-10-31 | 2000-01-11 | National Scientific Corp. | Monolithic inductor with magnetic flux lines guided away from substrate |
| US6417754B1 (en) * | 1997-12-08 | 2002-07-09 | The Regents Of The University Of California | Three-dimensional coil inductor |
| JP3255105B2 (ja) * | 1998-01-22 | 2002-02-12 | 株式会社村田製作所 | 高周波複合部品 |
| US6180976B1 (en) | 1999-02-02 | 2001-01-30 | Conexant Systems, Inc. | Thin-film capacitors and methods for forming the same |
| JP2001136045A (ja) | 1999-08-23 | 2001-05-18 | Murata Mfg Co Ltd | 積層型複合電子部品 |
| JP2001119209A (ja) | 1999-10-15 | 2001-04-27 | Murata Mfg Co Ltd | 積層型フィルタモジュール |
| KR100316693B1 (ko) | 1999-12-22 | 2001-12-20 | 박종섭 | 이동통신 기지국의 rf블록 |
| JP2002008942A (ja) | 2000-06-16 | 2002-01-11 | Fujitsu Ltd | コンデンサ装置、コンデンサ装置の製造方法及びコンデンサ装置が実装されたモジュール |
| KR100860281B1 (ko) | 2000-08-04 | 2008-09-25 | 미츠비시 마테리알 가부시키가이샤 | 안테나 |
| KR100382765B1 (ko) | 2001-06-15 | 2003-05-09 | 삼성전자주식회사 | 송수신용 수동소자와 그 집적모듈 및 그 제조방법 |
| JP2003014592A (ja) | 2001-06-28 | 2003-01-15 | Nippon Shooter Ltd | オンライン式ジャグ真空化装置およびその真空化方法 |
| CN1630946A (zh) | 2001-07-12 | 2005-06-22 | 株式会社日立制作所 | 电子电路部件 |
| US6597258B2 (en) | 2001-08-30 | 2003-07-22 | Spectrum Astro | High performance diplexer and method |
| JP2003100553A (ja) | 2001-09-26 | 2003-04-04 | Toshiba Corp | 受動素子部品及び受動素子内蔵基板 |
| JP3998984B2 (ja) | 2002-01-18 | 2007-10-31 | 富士通株式会社 | 回路基板及びその製造方法 |
| JP2003258675A (ja) * | 2002-02-27 | 2003-09-12 | Kyocera Corp | 通信制御方法 |
| JP4103502B2 (ja) | 2002-08-28 | 2008-06-18 | 株式会社トッパンNecサーキットソリューションズ | 多層配線板及びその製造方法 |
| KR100691725B1 (ko) | 2002-12-11 | 2007-03-12 | 다이니폰 인사츠 가부시키가이샤 | 다층 배선기판 및 그 제조 방법 |
| JP2004200227A (ja) | 2002-12-16 | 2004-07-15 | Alps Electric Co Ltd | プリントインダクタ |
| JP2004281847A (ja) * | 2003-03-18 | 2004-10-07 | Tdk Corp | 積層複合電子部品 |
| JP2004281850A (ja) | 2003-03-18 | 2004-10-07 | Tdk Corp | 積層複合電子部品 |
| US7044390B2 (en) | 2003-06-02 | 2006-05-16 | Stmicroelectronics, Inc. | Smart card emulator and related methods using buffering interface |
| US8046508B2 (en) | 2004-04-21 | 2011-10-25 | Stmicroelectronics, Inc. | Smart card with self-detachment features and related methods |
| WO2006070807A1 (ja) | 2004-12-28 | 2006-07-06 | Ngk Spark Plug Co., Ltd. | 配線基板及び配線基板の製造方法 |
| JP2006279604A (ja) | 2005-03-29 | 2006-10-12 | Tdk Corp | 弾性表面波装置 |
| EP1889359B1 (en) * | 2005-06-08 | 2013-01-16 | The Regents of the University of California | Linear variable voltage diode capacitor and adaptive matching networks |
| US7323948B2 (en) | 2005-08-23 | 2008-01-29 | International Business Machines Corporation | Vertical LC tank device |
| WO2007061308A1 (en) | 2005-11-24 | 2007-05-31 | Technische Universiteit Delft | Varactor element and low distortion varactor circuit arrangement |
| JP5055768B2 (ja) | 2006-01-16 | 2012-10-24 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
| CN100382065C (zh) | 2006-03-31 | 2008-04-16 | 北京飞天诚信科技有限公司 | 基于usb接口的智能卡读写器及其控制方法 |
| US7498918B2 (en) | 2006-04-04 | 2009-03-03 | United Microelectronics Corp. | Inductor structure |
| EP1850491A3 (en) | 2006-04-26 | 2012-02-22 | Hitachi Metals, Ltd. | High-frequency circuit, high-frequency device and communications apparatus |
| US7843302B2 (en) | 2006-05-08 | 2010-11-30 | Ibiden Co., Ltd. | Inductor and electric power supply using it |
| US7825745B1 (en) | 2006-09-12 | 2010-11-02 | Rf Magic Inc. | Variable bandwidth tunable silicon duplexer |
| TWI333684B (en) | 2006-11-07 | 2010-11-21 | Unimicron Technology Corp | Package substrate having embedded capacitor |
| EP2092738B1 (en) | 2006-12-04 | 2017-08-23 | Thomson Licensing DTV | Tuning device with diplexer input |
| DE102006058068B4 (de) | 2006-12-07 | 2018-04-05 | Infineon Technologies Ag | Halbleiterbauelement mit Halbleiterchip und passivem Spulen-Bauelement sowie Verfahren zu dessen Herstellung |
| JP2008171965A (ja) | 2007-01-11 | 2008-07-24 | Fuji Electric Device Technology Co Ltd | 超小型電力変換装置 |
| JP2008182340A (ja) | 2007-01-23 | 2008-08-07 | Ngk Spark Plug Co Ltd | ダイプレクサ及びそれを用いたマルチプレクサ |
| US7821359B2 (en) | 2007-07-09 | 2010-10-26 | John Messalingua Associates, Inc. | Band-stop filters |
| TWI345243B (en) * | 2007-08-14 | 2011-07-11 | Ind Tech Res Inst | Inter-helix inductor devices |
| JP2009159328A (ja) * | 2007-12-26 | 2009-07-16 | Ngk Spark Plug Co Ltd | マルチプレクサ、トリプレクサ及びダイプレクサ |
| US20090219908A1 (en) | 2008-02-29 | 2009-09-03 | Ahmadreza Rofougaran | Method and system for processing signals via diplexers embedded in an integrated circuit package |
| WO2009118694A1 (en) | 2008-03-25 | 2009-10-01 | Nxp B.V. | Integrated 3d high density and high quality inductive element |
| WO2009128047A1 (en) | 2008-04-18 | 2009-10-22 | Nxp B.V. | High density inductor, having a high quality factor |
| US8442586B2 (en) | 2008-05-08 | 2013-05-14 | Texas Instruments Incorporated | Determining USB/ISO interface and power supply voltage in mobile device |
| EP2175455B1 (en) | 2008-10-13 | 2012-12-12 | Vodafone Holding GmbH | Method for providing controlled access to a memory card and memory card |
| US8143696B2 (en) | 2009-03-18 | 2012-03-27 | Agere Systems Inc. | Integrated circuit inductors with reduced magnetic coupling |
| US7955942B2 (en) | 2009-05-18 | 2011-06-07 | Stats Chippac, Ltd. | Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame |
| US8143952B2 (en) | 2009-10-08 | 2012-03-27 | Qualcomm Incorporated | Three dimensional inductor and transformer |
| US8344478B2 (en) | 2009-10-23 | 2013-01-01 | Maxim Integrated Products, Inc. | Inductors having inductor axis parallel to substrate surface |
| US8391316B2 (en) | 2009-11-06 | 2013-03-05 | Broadcom Corporation | Front-end system for processing composite wideband signals and method for utilizing same |
| JP2011159953A (ja) * | 2010-01-05 | 2011-08-18 | Fujitsu Ltd | 電子回路及び電子機器 |
| US20110248405A1 (en) | 2010-04-09 | 2011-10-13 | Qualcomm Incorporated | Selective Patterning for Low Cost through Vias |
| US8384507B2 (en) * | 2010-06-01 | 2013-02-26 | Qualcomm Incorporated | Through via inductor or transformer in a high-resistance substrate with programmability |
| US8362591B2 (en) | 2010-06-08 | 2013-01-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuits and methods of forming the same |
| WO2012040063A1 (en) | 2010-09-23 | 2012-03-29 | Qualcomm Mems Technologies, Inc. | Integrated passives and power amplifier |
| US8405135B2 (en) | 2010-10-05 | 2013-03-26 | International Business Machines Corporation | 3D via capacitor with a floating conductive plate for improved reliability |
| JP2012100180A (ja) * | 2010-11-05 | 2012-05-24 | Hitachi Media Electoronics Co Ltd | チューナブルフィルタ、チューナブルデュプレクサ、及び、それらを用いた移動通信端末 |
| CN102569249B (zh) | 2010-12-08 | 2014-01-22 | 财团法人工业技术研究院 | 立体式电感 |
| US8736399B2 (en) | 2011-04-06 | 2014-05-27 | M/A-Com Technology Solutions Holdings, Inc. | Triplexer topology |
| JP5780298B2 (ja) | 2011-04-18 | 2015-09-16 | 株式会社村田製作所 | アンテナ装置および通信端末装置 |
| US9002309B2 (en) | 2011-05-27 | 2015-04-07 | Qualcomm Incorporated | Tunable multi-band receiver |
| US8803615B2 (en) * | 2012-01-23 | 2014-08-12 | Qualcomm Incorporated | Impedance matching circuit with tunable notch filters for power amplifier |
| US20130207745A1 (en) | 2012-02-13 | 2013-08-15 | Qualcomm Incorporated | 3d rf l-c filters using through glass vias |
| US20130223412A1 (en) | 2012-02-24 | 2013-08-29 | Qualcomm Incorporated | Method and system to improve frame early termination success rate |
| US9203373B2 (en) | 2013-01-11 | 2015-12-01 | Qualcomm Incorporated | Diplexer design using through glass via technology |
| US9935166B2 (en) | 2013-03-15 | 2018-04-03 | Qualcomm Incorporated | Capacitor with a dielectric between a via and a plate of the capacitor |
| US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9264013B2 (en) | 2013-06-04 | 2016-02-16 | Qualcomm Incorporated | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
-
2013
- 2013-05-06 US US13/887,568 patent/US9634640B2/en not_active Expired - Fee Related
-
2014
- 2014-05-02 CN CN201480025365.8A patent/CN105191123B/zh not_active Expired - Fee Related
- 2014-05-02 KR KR1020157033907A patent/KR20160005064A/ko not_active Withdrawn
- 2014-05-02 EP EP14728764.3A patent/EP2995002A1/en not_active Withdrawn
- 2014-05-02 WO PCT/US2014/036524 patent/WO2014182556A1/en not_active Ceased
- 2014-05-02 JP JP2016512967A patent/JP2016526287A/ja not_active Ceased
-
2016
- 2016-03-24 US US15/079,789 patent/US9813043B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101821943A (zh) * | 2007-10-23 | 2010-09-01 | 株式会社村田制作所 | 层叠型电子元器件及其制造方法 |
| CN101436694A (zh) * | 2007-11-12 | 2009-05-20 | Tdk株式会社 | 电子部件 |
Non-Patent Citations (2)
| Title |
|---|
| A Monolithic Low-Distortion Low-Loss Silicon-on-Glass Varactor-Tuned Filter With Optimized Biasing;Koen Buisman ET AL;《IEEE Microwave and Wireless Components Letters》;20070228;全文 |
| Tunable Duplexer Having Multilayer Structure Using LTCC;Kouki Saitou ET AL;《Microwave Symposium Digest,2003 IEEE MTT-S International》;20031231;附图1,附图3-6,表1,正文第I节第4段以及第II节第1-3段 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9634640B2 (en) | 2017-04-25 |
| WO2014182556A1 (en) | 2014-11-13 |
| US20140327496A1 (en) | 2014-11-06 |
| KR20160005064A (ko) | 2016-01-13 |
| JP2016526287A (ja) | 2016-09-01 |
| US20160204758A1 (en) | 2016-07-14 |
| US9813043B2 (en) | 2017-11-07 |
| EP2995002A1 (en) | 2016-03-16 |
| CN105191123A (zh) | 2015-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105191123B (zh) | 三维(3d)集成电路(ic)(3dic)中的可调谐共用器以及相关组件和方法 | |
| EP3005562B1 (en) | Systems for reducing magnetic coupling in integrated circuits (ics), and related components and methods | |
| JP5982585B2 (ja) | ガラス貫通ビア技術を使用するダイプレクサ構成 | |
| CN106233623B (zh) | 频率复用器 | |
| JP2019525478A (ja) | 裏面半導体成長 | |
| EP3378160A1 (en) | Multiplexer design using a 2d passive on glass filter integrated with a 3d through glass via filter | |
| US9876513B2 (en) | LC filter layer stacking by layer transfer to make 3D multiplexer structures | |
| JP7051814B2 (ja) | 改善されたパッシブオンガラス(pog)マルチプレクサ性能のための多密度mimキャパシタ | |
| Zeng et al. | Flexible design of generalized strongly coupled resonator triplet filters by regulating redundant resonant modes | |
| JP6921180B2 (ja) | デュアル側面接触キャパシタを形成するための裏面シリサイド化の利用 | |
| US9780048B1 (en) | Side-assembled passive devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190305 Termination date: 20200502 |