JP2016511534A5 - - Google Patents
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- JP2016511534A5 JP2016511534A5 JP2015553855A JP2015553855A JP2016511534A5 JP 2016511534 A5 JP2016511534 A5 JP 2016511534A5 JP 2015553855 A JP2015553855 A JP 2015553855A JP 2015553855 A JP2015553855 A JP 2015553855A JP 2016511534 A5 JP2016511534 A5 JP 2016511534A5
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361754298P | 2013-01-18 | 2013-01-18 | |
| US61/754,298 | 2013-01-18 | ||
| US201361871061P | 2013-08-28 | 2013-08-28 | |
| US61/871,061 | 2013-08-28 | ||
| PCT/US2014/012080 WO2014168665A2 (en) | 2013-01-18 | 2014-01-17 | Methods for making a superconducting device with at least one enclosure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016511534A JP2016511534A (ja) | 2016-04-14 |
| JP2016511534A5 true JP2016511534A5 (enExample) | 2017-02-16 |
| JP6360499B2 JP6360499B2 (ja) | 2018-07-18 |
Family
ID=51690101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015553855A Active JP6360499B2 (ja) | 2013-01-18 | 2014-01-17 | 少なくとも１つの囲いを有する超伝導デバイスを製造するための方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10424712B2 (enExample) |
| EP (1) | EP2946414B1 (enExample) |
| JP (1) | JP6360499B2 (enExample) |
| KR (1) | KR102192270B1 (enExample) |
| CA (1) | CA2898608C (enExample) |
| SG (1) | SG11201505617UA (enExample) |
| WO (1) | WO2014168665A2 (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014163728A2 (en) | 2013-01-18 | 2014-10-09 | Yale University | Superconducting device with at least one enclosure |
| US9177814B2 (en) * | 2013-03-15 | 2015-11-03 | International Business Machines Corporation | Suspended superconducting qubits |
| JP6894378B2 (ja) | 2015-02-27 | 2021-06-30 | イェール ユニバーシティーＹａｌｅ Ｕｎｉｖｅｒｓｉｔｙ | 平面キュービットを非平面共振器に連結するための技術ならびに関連する系および方法 |
| US9836699B1 (en) | 2015-04-27 | 2017-12-05 | Rigetti & Co. | Microwave integrated quantum circuits with interposer |
| US9971970B1 (en) | 2015-04-27 | 2018-05-15 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with VIAS and methods for making the same |
| WO2017155531A1 (en) * | 2016-03-10 | 2017-09-14 | Technische Universiteit Delft | Superconducting microwave-frequency vias for mult-planar quantum circuits |
| US20190267692A1 (en) * | 2016-08-15 | 2019-08-29 | Intel Corporation | Stripline and microstrip transmission lines for qubits |
| KR101874187B1 (ko) * | 2016-08-24 | 2018-07-03 | 한양대학교 산학협력단 | 조건 반사 동작을 수행하는 신경 소자 및 이의 구동 방법 |
| KR102173099B1 (ko) * | 2016-09-14 | 2020-11-02 | 구글 엘엘씨 | 로컬 진공 캐비티를 사용한 양자 장치들에서의 소산 및 주파수 노이즈 감소 |
| US10957841B2 (en) | 2016-09-15 | 2021-03-23 | Google Llc | Capping layer for reducing ion mill damage |
| US11436516B2 (en) | 2017-03-13 | 2022-09-06 | Google Llc | Integrating circuit elements in a stacked quantum computing device |
| US11276727B1 (en) | 2017-06-19 | 2022-03-15 | Rigetti & Co, Llc | Superconducting vias for routing electrical signals through substrates and their methods of manufacture |
| US11121301B1 (en) * | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
| US10398031B2 (en) * | 2017-09-29 | 2019-08-27 | International Business Machines Corporation | Integrating Josephson amplifiers or Josephson mixers into printed circuit boards |
| US10256392B1 (en) | 2018-03-23 | 2019-04-09 | International Business Machines Corporation | Vertical transmon qubit device |
| US10672971B2 (en) | 2018-03-23 | 2020-06-02 | International Business Machines Corporation | Vertical transmon qubit device with microstrip waveguides |
| US10243132B1 (en) | 2018-03-23 | 2019-03-26 | International Business Machines Corporation | Vertical josephson junction superconducting device |
| US10497746B1 (en) * | 2018-05-25 | 2019-12-03 | International Business Machines Corporation | Three-dimensional integration for qubits on crystalline dielectric |
| US10505096B1 (en) | 2018-05-25 | 2019-12-10 | International Business Machines Corporation | Three-dimensional integration for qubits on multiple height crystalline dielectric |
| US10615223B2 (en) * | 2018-06-12 | 2020-04-07 | International Business Machines Corporation | Vertical silicon-on-metal superconducting quantum interference device |
| US10546992B2 (en) | 2018-06-28 | 2020-01-28 | International Business Machines Corporation | Buried electrode geometry for lowering surface losses in superconducting microwave circuits |
| US10615826B2 (en) * | 2018-07-30 | 2020-04-07 | United States Of America As Represented By The Secretary Of The Navy | Josephson junction-based transceiver |
| GB201813188D0 (en) * | 2018-08-13 | 2018-09-26 | Univ Oxford Innovation Ltd | Superconducting quantum computing circuit package |
| JP7133842B2 (ja) * | 2018-10-09 | 2022-09-09 | 国立研究開発法人科学技術振興機構 | 超伝導複合量子計算回路 |
| US11121302B2 (en) | 2018-10-11 | 2021-09-14 | SeeQC, Inc. | System and method for superconducting multi-chip module |
| US11223355B2 (en) | 2018-12-12 | 2022-01-11 | Yale University | Inductively-shunted transmon qubit for superconducting circuits |
| US10665581B1 (en) | 2019-01-23 | 2020-05-26 | Sandisk Technologies Llc | Three-dimensional semiconductor chip containing memory die bonded to both sides of a support die and methods of making the same |
| US10879260B2 (en) | 2019-02-28 | 2020-12-29 | Sandisk Technologies Llc | Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same |
| TWI705587B (zh) * | 2019-10-31 | 2020-09-21 | 國立研究開發法人科學技術振興機構 | 超導複合量子計算電路 |
| JP7133854B2 (ja) * | 2019-10-31 | 2022-09-09 | 国立研究開発法人科学技術振興機構 | 超伝導複合量子計算回路 |
| TWI778409B (zh) * | 2019-10-31 | 2022-09-21 | 國立研究開發法人科學技術振興機構 | 超導複合量子計算電路 |
| US11177549B2 (en) | 2019-11-06 | 2021-11-16 | International Business Machines Corporation | Method of growing titanium nitride on silicon substrate free from silicon nitride interface by using a titanium seed layer |
| US11094873B2 (en) | 2019-11-14 | 2021-08-17 | International Business Machines Corporation | Transmon qubits with self defined junctions |
| EP4070392A4 (en) | 2019-12-05 | 2024-01-03 | D-Wave Systems Inc. | Systems and methods for fabricating superconducting integrated circuits |
| WO2021146028A1 (en) * | 2020-01-17 | 2021-07-22 | D-Wave Systems Inc. | Systems and methods for fabricating superconducting integrated circuits |
| US11552236B2 (en) | 2020-01-24 | 2023-01-10 | International Business Machines Corporation | Superconducting qubit capacitance and frequency of operation tuning |
| EP4107796A4 (en) | 2020-02-21 | 2024-02-28 | Applied Materials, Inc. | Method of making high critical temperature metal nitride layer |
| US11600761B2 (en) | 2020-02-21 | 2023-03-07 | Applied Materials, Inc. | High critical temperature metal nitride layer with oxide or oxynitride seed layer |
| WO2021178042A1 (en) * | 2020-03-02 | 2021-09-10 | Massachusetts Institute Of Technology | Qubit circuits with deep, in-substrate components |
| US12022749B2 (en) | 2020-03-04 | 2024-06-25 | International Business Machines Corporation | Flux bias line local heating device |
| US11937516B2 (en) * | 2020-03-04 | 2024-03-19 | International Business Machines Corporation | Fabrication of a flux bias line local heating device |
| WO2021231224A1 (en) | 2020-05-11 | 2021-11-18 | D-Wave Systems Inc. | Kinetic inductance devices, methods for fabricating kinetic inductance devices, and articles employing the same |
| FR3114444B1 (fr) * | 2020-09-21 | 2022-09-30 | Commissariat Energie Atomique | Puce à routage bifonctionnel et procédé de fabrication associé |
| FR3114443B1 (fr) * | 2020-09-21 | 2022-12-23 | Commissariat Energie Atomique | Structure d’intégration à routage bifonctionnel et assemblage comprenant une telle structure |
| US11678591B2 (en) * | 2020-09-29 | 2023-06-13 | International Business Machines Corporation | Vacuum encapsulated Josephson junction |
| US11460877B2 (en) * | 2020-12-12 | 2022-10-04 | Anyon Systems Inc. | Hybrid photonics-solid state quantum computer |
| US12033981B2 (en) | 2020-12-16 | 2024-07-09 | International Business Machines Corporation | Create a protected layer for interconnects and devices in a packaged quantum structure |
| JP7728194B2 (ja) * | 2022-02-02 | 2025-08-22 | 株式会社東芝 | 電子回路、計算装置、及び、電子回路の製造方法 |
| CN116889124A (zh) * | 2021-02-18 | 2023-10-13 | 耶鲁大学 | 多模式超导腔谐振器 |
| EP4295401A4 (en) * | 2021-02-19 | 2024-12-25 | Rigetti & Co, LLC | CIRCUIT CONNECTION IN A CAP PLATE OF A SUPERCONDUCTING QUANTUM PROCESSING UNIT (QPU) |
| AU2022289736A1 (en) | 2021-06-11 | 2024-02-01 | Caleb JORDAN | System and method of flux bias for superconducting quantum circuits |
| US11664801B1 (en) | 2021-12-08 | 2023-05-30 | International Business Machines Corporation | Multi-qubit architectures with mode-selective charge coupling between novel fluxonium-molecule qubits |
| US11937518B2 (en) | 2022-05-20 | 2024-03-19 | Northrop Grumman Systems Corporation | Magnetic flux mitigation in superconducting circuits |
| EP4385944A1 (en) * | 2022-12-14 | 2024-06-19 | Imec VZW | A method for bonding and interconnecting micro-electronic components |
| FR3154282A1 (fr) * | 2023-10-11 | 2025-04-18 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif électronique à composant cryogénique et son procédé de réalisation |
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| JP6894378B2 (ja) | 2015-02-27 | 2021-06-30 | イェール ユニバーシティーＹａｌｅ Ｕｎｉｖｅｒｓｉｔｙ | 平面キュービットを非平面共振器に連結するための技術ならびに関連する系および方法 |
| US9836699B1 (en) | 2015-04-27 | 2017-12-05 | Rigetti & Co. | Microwave integrated quantum circuits with interposer |
| US9503063B1 (en) | 2015-09-16 | 2016-11-22 | International Business Machines Corporation | Mechanically tunable superconducting qubit |
-
2014
- 2014-01-17 CA CA2898608A patent/CA2898608C/en active Active
- 2014-01-17 US US14/761,914 patent/US10424712B2/en active Active
- 2014-01-17 SG SG11201505617UA patent/SG11201505617UA/en unknown
- 2014-01-17 WO PCT/US2014/012080 patent/WO2014168665A2/en not_active Ceased
- 2014-01-17 JP JP2015553855A patent/JP6360499B2/ja active Active
- 2014-01-17 KR KR1020157022222A patent/KR102192270B1/ko active Active
- 2014-01-17 EP EP14783459.2A patent/EP2946414B1/en active Active
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