SG11201505617UA - Methods for making a superconducting device with at least one enclosure - Google Patents
Methods for making a superconducting device with at least one enclosureInfo
- Publication number
- SG11201505617UA SG11201505617UA SG11201505617UA SG11201505617UA SG11201505617UA SG 11201505617U A SG11201505617U A SG 11201505617UA SG 11201505617U A SG11201505617U A SG 11201505617UA SG 11201505617U A SG11201505617U A SG 11201505617UA SG 11201505617U A SG11201505617U A SG 11201505617UA
- Authority
- SG
- Singapore
- Prior art keywords
- enclosure
- making
- methods
- superconducting device
- superconducting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0156—Manufacture or treatment of devices comprising Nb or an alloy of Nb with one or more of the elements of group 4, e.g. Ti, Zr, Hf
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
- H10N60/81—Containers; Mountings
- H10N60/815—Containers; Mountings for Josephson-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361754298P | 2013-01-18 | 2013-01-18 | |
US201361871061P | 2013-08-28 | 2013-08-28 | |
PCT/US2014/012080 WO2014168665A2 (en) | 2013-01-18 | 2014-01-17 | Methods for making a superconducting device with at least one enclosure |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201505617UA true SG11201505617UA (en) | 2015-09-29 |
Family
ID=51690101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201505617UA SG11201505617UA (en) | 2013-01-18 | 2014-01-17 | Methods for making a superconducting device with at least one enclosure |
Country Status (8)
Country | Link |
---|---|
US (1) | US10424712B2 (en) |
EP (1) | EP2946414A4 (en) |
JP (1) | JP6360499B2 (en) |
KR (1) | KR102192270B1 (en) |
CA (1) | CA2898608C (en) |
HK (1) | HK1218021A1 (en) |
SG (1) | SG11201505617UA (en) |
WO (1) | WO2014168665A2 (en) |
Families Citing this family (46)
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JP6461009B2 (en) | 2013-01-18 | 2019-01-30 | イェール ユニバーシティーYale University | Superconducting device having at least one enclosure |
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US9836699B1 (en) | 2015-04-27 | 2017-12-05 | Rigetti & Co. | Microwave integrated quantum circuits with interposer |
US10068181B1 (en) | 2015-04-27 | 2018-09-04 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafer and methods for making the same |
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US11276727B1 (en) | 2017-06-19 | 2022-03-15 | Rigetti & Co, Llc | Superconducting vias for routing electrical signals through substrates and their methods of manufacture |
US11121301B1 (en) * | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
US10398031B2 (en) | 2017-09-29 | 2019-08-27 | International Business Machines Corporation | Integrating Josephson amplifiers or Josephson mixers into printed circuit boards |
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US10672971B2 (en) * | 2018-03-23 | 2020-06-02 | International Business Machines Corporation | Vertical transmon qubit device with microstrip waveguides |
US10243132B1 (en) | 2018-03-23 | 2019-03-26 | International Business Machines Corporation | Vertical josephson junction superconducting device |
US10505096B1 (en) * | 2018-05-25 | 2019-12-10 | International Business Machines Corporation | Three-dimensional integration for qubits on multiple height crystalline dielectric |
US10497746B1 (en) | 2018-05-25 | 2019-12-03 | International Business Machines Corporation | Three-dimensional integration for qubits on crystalline dielectric |
US10615223B2 (en) * | 2018-06-12 | 2020-04-07 | International Business Machines Corporation | Vertical silicon-on-metal superconducting quantum interference device |
US10546992B2 (en) | 2018-06-28 | 2020-01-28 | International Business Machines Corporation | Buried electrode geometry for lowering surface losses in superconducting microwave circuits |
US10615826B2 (en) * | 2018-07-30 | 2020-04-07 | United States Of America As Represented By The Secretary Of The Navy | Josephson junction-based transceiver |
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JP7133842B2 (en) | 2018-10-09 | 2022-09-09 | 国立研究開発法人科学技術振興機構 | Superconducting composite quantum computing circuit |
US11223355B2 (en) | 2018-12-12 | 2022-01-11 | Yale University | Inductively-shunted transmon qubit for superconducting circuits |
US10665581B1 (en) | 2019-01-23 | 2020-05-26 | Sandisk Technologies Llc | Three-dimensional semiconductor chip containing memory die bonded to both sides of a support die and methods of making the same |
US10879260B2 (en) | 2019-02-28 | 2020-12-29 | Sandisk Technologies Llc | Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same |
TWI778409B (en) * | 2019-10-31 | 2022-09-21 | 國立研究開發法人科學技術振興機構 | Superconducting Composite Quantum Computing Circuit |
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US11552236B2 (en) | 2020-01-24 | 2023-01-10 | International Business Machines Corporation | Superconducting qubit capacitance and frequency of operation tuning |
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US11699091B2 (en) * | 2020-03-02 | 2023-07-11 | Massachusetts Institute Of Technology | Qubit circuits with deep, in-substrate components |
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-
2014
- 2014-01-17 SG SG11201505617UA patent/SG11201505617UA/en unknown
- 2014-01-17 US US14/761,914 patent/US10424712B2/en active Active
- 2014-01-17 KR KR1020157022222A patent/KR102192270B1/en active IP Right Grant
- 2014-01-17 EP EP14783459.2A patent/EP2946414A4/en active Pending
- 2014-01-17 CA CA2898608A patent/CA2898608C/en active Active
- 2014-01-17 WO PCT/US2014/012080 patent/WO2014168665A2/en active Application Filing
- 2014-01-17 JP JP2015553855A patent/JP6360499B2/en active Active
-
2016
- 2016-05-23 HK HK16105867.1A patent/HK1218021A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP2946414A2 (en) | 2015-11-25 |
KR20150127046A (en) | 2015-11-16 |
CA2898608A1 (en) | 2014-10-16 |
HK1218021A1 (en) | 2017-01-27 |
JP2016511534A (en) | 2016-04-14 |
KR102192270B1 (en) | 2020-12-18 |
EP2946414A4 (en) | 2016-09-14 |
JP6360499B2 (en) | 2018-07-18 |
WO2014168665A3 (en) | 2014-12-31 |
CA2898608C (en) | 2022-01-11 |
US20150372217A1 (en) | 2015-12-24 |
WO2014168665A2 (en) | 2014-10-16 |
US10424712B2 (en) | 2019-09-24 |
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