JP2016208031A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016208031A5 JP2016208031A5 JP2016083292A JP2016083292A JP2016208031A5 JP 2016208031 A5 JP2016208031 A5 JP 2016208031A5 JP 2016083292 A JP2016083292 A JP 2016083292A JP 2016083292 A JP2016083292 A JP 2016083292A JP 2016208031 A5 JP2016208031 A5 JP 2016208031A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layers
- layer
- halogen
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562150053P | 2015-04-20 | 2015-04-20 | |
| US62/150,053 | 2015-04-20 | ||
| US14/749,291 US9806252B2 (en) | 2015-04-20 | 2015-06-24 | Dry plasma etch method to pattern MRAM stack |
| US14/749,291 | 2015-06-24 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016208031A JP2016208031A (ja) | 2016-12-08 |
| JP2016208031A5 true JP2016208031A5 (enExample) | 2019-05-30 |
| JP6804864B2 JP6804864B2 (ja) | 2020-12-23 |
Family
ID=57130027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016083292A Active JP6804864B2 (ja) | 2015-04-20 | 2016-04-19 | Mramスタックをパターニングする乾式プラズマ・エッチング法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9806252B2 (enExample) |
| JP (1) | JP6804864B2 (enExample) |
| KR (2) | KR102515411B1 (enExample) |
| CN (3) | CN110379918B (enExample) |
| SG (1) | SG10201603090VA (enExample) |
| TW (2) | TWI690097B (enExample) |
Families Citing this family (102)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12444651B2 (en) | 2009-08-04 | 2025-10-14 | Novellus Systems, Inc. | Tungsten feature fill with nucleation inhibition |
| US10297459B2 (en) | 2013-09-20 | 2019-05-21 | Lam Research Corporation | Technique to deposit sidewall passivation for high aspect ratio cylinder etch |
| US9837254B2 (en) | 2014-08-12 | 2017-12-05 | Lam Research Corporation | Differentially pumped reactive gas injector |
| US10825652B2 (en) | 2014-08-29 | 2020-11-03 | Lam Research Corporation | Ion beam etch without need for wafer tilt or rotation |
| US9406535B2 (en) | 2014-08-29 | 2016-08-02 | Lam Research Corporation | Ion injector and lens system for ion beam milling |
| US9536748B2 (en) | 2014-10-21 | 2017-01-03 | Lam Research Corporation | Use of ion beam etching to generate gate-all-around structure |
| US9887097B2 (en) | 2014-12-04 | 2018-02-06 | Lam Research Corporation | Technique to deposit sidewall passivation for high aspect ratio cylinder etch |
| US9576811B2 (en) | 2015-01-12 | 2017-02-21 | Lam Research Corporation | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) |
| US9806252B2 (en) | 2015-04-20 | 2017-10-31 | Lam Research Corporation | Dry plasma etch method to pattern MRAM stack |
| US9870899B2 (en) | 2015-04-24 | 2018-01-16 | Lam Research Corporation | Cobalt etch back |
| SG10201604524PA (en) | 2015-06-05 | 2017-01-27 | Lam Res Corp | ATOMIC LAYER ETCHING OF GaN AND OTHER III-V MATERIALS |
| US9972504B2 (en) | 2015-08-07 | 2018-05-15 | Lam Research Corporation | Atomic layer etching of tungsten for enhanced tungsten deposition fill |
| US10096487B2 (en) | 2015-08-19 | 2018-10-09 | Lam Research Corporation | Atomic layer etching of tungsten and other metals |
| US9984858B2 (en) | 2015-09-04 | 2018-05-29 | Lam Research Corporation | ALE smoothness: in and outside semiconductor industry |
| US10229837B2 (en) | 2016-02-04 | 2019-03-12 | Lam Research Corporation | Control of directionality in atomic layer etching |
| US10727073B2 (en) | 2016-02-04 | 2020-07-28 | Lam Research Corporation | Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces |
| US9991128B2 (en) * | 2016-02-05 | 2018-06-05 | Lam Research Corporation | Atomic layer etching in continuous plasma |
| US9779955B2 (en) * | 2016-02-25 | 2017-10-03 | Lam Research Corporation | Ion beam etching utilizing cryogenic wafer temperatures |
| KR20170122910A (ko) * | 2016-04-27 | 2017-11-07 | 성균관대학교산학협력단 | 원자층 식각방법 |
| US10269566B2 (en) | 2016-04-29 | 2019-04-23 | Lam Research Corporation | Etching substrates using ale and selective deposition |
| US9837312B1 (en) * | 2016-07-22 | 2017-12-05 | Lam Research Corporation | Atomic layer etching for enhanced bottom-up feature fill |
| CN110050331B (zh) * | 2016-12-09 | 2023-07-25 | Asm Ip 控股有限公司 | 热原子层蚀刻工艺 |
| US10566212B2 (en) | 2016-12-19 | 2020-02-18 | Lam Research Corporation | Designer atomic layer etching |
| US10283319B2 (en) | 2016-12-22 | 2019-05-07 | Asm Ip Holding B.V. | Atomic layer etching processes |
| US9917137B1 (en) * | 2017-01-11 | 2018-03-13 | International Business Machines Corporation | Integrated magnetic tunnel junction (MTJ) in back end of line (BEOL) interconnects |
| JP6969752B2 (ja) * | 2017-01-24 | 2021-11-24 | 国立大学法人東北大学 | トンネル磁気抵抗素子の製造方法 |
| KR102722138B1 (ko) * | 2017-02-13 | 2024-10-24 | 램 리써치 코포레이션 | 에어 갭들을 생성하는 방법 |
| US10546748B2 (en) * | 2017-02-17 | 2020-01-28 | Lam Research Corporation | Tin oxide films in semiconductor device manufacturing |
| US10559461B2 (en) | 2017-04-19 | 2020-02-11 | Lam Research Corporation | Selective deposition with atomic layer etch reset |
| US9997371B1 (en) | 2017-04-24 | 2018-06-12 | Lam Research Corporation | Atomic layer etch methods and hardware for patterning applications |
| US10832909B2 (en) | 2017-04-24 | 2020-11-10 | Lam Research Corporation | Atomic layer etch, reactive precursors and energetic sources for patterning applications |
| US10494715B2 (en) | 2017-04-28 | 2019-12-03 | Lam Research Corporation | Atomic layer clean for removal of photoresist patterning scum |
| US10796912B2 (en) | 2017-05-16 | 2020-10-06 | Lam Research Corporation | Eliminating yield impact of stochastics in lithography |
| US11062897B2 (en) | 2017-06-09 | 2021-07-13 | Lam Research Corporation | Metal doped carbon based hard mask removal in semiconductor fabrication |
| US10651372B2 (en) * | 2017-06-13 | 2020-05-12 | Tokyo Electron Limited | Process for patterning a magnetic tunnel junction |
| US10263179B2 (en) * | 2017-07-18 | 2019-04-16 | Nxp B.V. | Method of forming tunnel magnetoresistance (TMR) elements and TMR sensor element |
| US10276398B2 (en) | 2017-08-02 | 2019-04-30 | Lam Research Corporation | High aspect ratio selective lateral etch using cyclic passivation and etching |
| KR102368033B1 (ko) | 2017-09-20 | 2022-02-25 | 삼성전자주식회사 | 자기 저항 메모리 소자의 제조 방법 |
| JP2019057636A (ja) | 2017-09-21 | 2019-04-11 | 東芝メモリ株式会社 | 磁気記憶装置 |
| US10763083B2 (en) | 2017-10-06 | 2020-09-01 | Lam Research Corporation | High energy atomic layer etching |
| US10038138B1 (en) * | 2017-10-10 | 2018-07-31 | Headway Technologies, Inc. | High temperature volatilization of sidewall materials from patterned magnetic tunnel junctions |
| US20190131130A1 (en) * | 2017-10-31 | 2019-05-02 | Lam Research Corporation | Etching metal oxide substrates using ale and selective deposition |
| JP6833657B2 (ja) * | 2017-11-07 | 2021-02-24 | 東京エレクトロン株式会社 | 基板をプラズマエッチングする方法 |
| US10978351B2 (en) | 2017-11-17 | 2021-04-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Etch stop layer between substrate and isolation structure |
| US10734238B2 (en) * | 2017-11-21 | 2020-08-04 | Lam Research Corporation | Atomic layer deposition and etch in a single plasma chamber for critical dimension control |
| US10658174B2 (en) | 2017-11-21 | 2020-05-19 | Lam Research Corporation | Atomic layer deposition and etch for reducing roughness |
| US10515815B2 (en) | 2017-11-21 | 2019-12-24 | Lam Research Corporation | Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formation |
| TWI688130B (zh) | 2017-11-28 | 2020-03-11 | 財團法人工業技術研究院 | 自旋軌道磁性記憶體及其製造方法 |
| US10957779B2 (en) * | 2017-11-30 | 2021-03-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gate etch back with reduced loading effect |
| US10840436B2 (en) * | 2017-12-29 | 2020-11-17 | Spin Memory, Inc. | Perpendicular magnetic anisotropy interface tunnel junction devices and methods of manufacture |
| US10446394B2 (en) | 2018-01-26 | 2019-10-15 | Lam Research Corporation | Spacer profile control using atomic layer deposition in a multiple patterning process |
| CN110098320B (zh) * | 2018-01-30 | 2023-04-28 | 上海磁宇信息科技有限公司 | 一种刻蚀磁性隧道结导电硬掩模的方法 |
| JP7025952B2 (ja) * | 2018-02-16 | 2022-02-25 | 東京エレクトロン株式会社 | エッチングする方法及びプラズマ処理装置 |
| EP3776636B1 (en) | 2018-03-30 | 2025-05-07 | Lam Research Corporation | Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials |
| KR102735902B1 (ko) | 2018-06-13 | 2024-11-28 | 램 리써치 코포레이션 | 고 종횡비 구조체들의 효율적인 세정 및 에칭 |
| US10680169B2 (en) * | 2018-06-13 | 2020-06-09 | International Business Machines Corporation | Multilayer hardmask for high performance MRAM devices |
| US10741748B2 (en) | 2018-06-25 | 2020-08-11 | International Business Machines Corporation | Back end of line metallization structures |
| US10720487B2 (en) * | 2018-06-28 | 2020-07-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of semiconductor device with magnetic element |
| US10692759B2 (en) * | 2018-07-17 | 2020-06-23 | Applied Materials, Inc. | Methods for manufacturing an interconnect structure for semiconductor devices |
| TWI812762B (zh) * | 2018-07-30 | 2023-08-21 | 日商東京威力科創股份有限公司 | 處理被處理體之方法、處理裝置及處理系統 |
| US10879451B2 (en) * | 2018-08-14 | 2020-12-29 | Samsung Electronics Co., Ltd. | Magnetic tunnel junction device and magnetic resistance memory device |
| CA3109866A1 (en) * | 2018-08-29 | 2020-03-05 | Quantum-Si Incorporated | Sample well fabrication techniques and structures for integrated sensor devices |
| US10886461B2 (en) | 2018-09-18 | 2021-01-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Highly physical etch resistive photoresist mask to define large height sub 30nm via and metal hard mask for MRAM devices |
| US10763429B2 (en) | 2018-10-12 | 2020-09-01 | International Business Machines Corporation | Self-aligned ion beam etch sputter mask for magnetoresistive random access memory |
| US10714681B2 (en) * | 2018-10-19 | 2020-07-14 | International Business Machines Corporation | Embedded magnetic tunnel junction pillar having reduced height and uniform contact area |
| US10868239B2 (en) * | 2018-10-25 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gradient protection layer in MTJ manufacturing |
| US11002063B2 (en) * | 2018-10-26 | 2021-05-11 | Graffiti Shield, Inc. | Anti-graffiti laminate with visual indicia |
| US10971684B2 (en) * | 2018-10-30 | 2021-04-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Intercalated metal/dielectric structure for nonvolatile memory devices |
| CN111162005A (zh) | 2018-11-08 | 2020-05-15 | 江苏鲁汶仪器有限公司 | 多层磁性隧道结刻蚀方法和mram器件 |
| US11043251B2 (en) | 2018-11-30 | 2021-06-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetic tunnel junction device and method of forming same |
| US10497858B1 (en) * | 2018-12-21 | 2019-12-03 | Applied Materials, Inc. | Methods for forming structures for MRAM applications |
| US11056643B2 (en) * | 2019-01-03 | 2021-07-06 | International Business Machines Corporation | Magnetic tunnel junction (MTJ) hard mask encapsulation to prevent redeposition |
| US11121311B2 (en) * | 2019-01-24 | 2021-09-14 | International Business Machines Corporation | MTJ containing device encapsulation to prevent shorting |
| KR102811847B1 (ko) * | 2019-02-01 | 2025-05-22 | 램 리써치 코포레이션 | 가스 처리 및 펄싱을 사용한 이온 빔 에칭 |
| CN113519071B (zh) * | 2019-02-28 | 2025-04-22 | 朗姆研究公司 | 利用侧壁清洁的离子束蚀刻 |
| US10707413B1 (en) | 2019-03-28 | 2020-07-07 | International Business Machines Corporation | Formation of embedded magnetic random-access memory devices |
| US11744083B2 (en) | 2019-04-12 | 2023-08-29 | International Business Machines Corporation | Fabrication of embedded memory devices utilizing a self assembled monolayer |
| US20200343043A1 (en) * | 2019-04-29 | 2020-10-29 | Spin Memory, Inc. | Method for manufacturing a self-aligned magnetic memory element with ru hard mask |
| US10685849B1 (en) | 2019-05-01 | 2020-06-16 | Applied Materials, Inc. | Damage free metal conductor formation |
| US10833258B1 (en) | 2019-05-02 | 2020-11-10 | International Business Machines Corporation | MRAM device formation with in-situ encapsulation |
| JP2020191320A (ja) * | 2019-05-20 | 2020-11-26 | 東京エレクトロン株式会社 | 基板製造方法、及び、処理システム |
| JP7737789B2 (ja) | 2019-07-18 | 2025-09-11 | エーエスエム・アイピー・ホールディング・ベー・フェー | 半導体処理システム用シャワーヘッドデバイス |
| JP7602530B2 (ja) * | 2019-07-31 | 2024-12-18 | ラム リサーチ コーポレーション | Mramパターニングのための不揮発性材料の化学エッチング |
| US12080562B2 (en) * | 2019-09-17 | 2024-09-03 | Lam Research Corporation | Atomic layer etch and ion beam etch patterning |
| CN112563412B (zh) * | 2019-09-25 | 2023-06-23 | 浙江驰拓科技有限公司 | 磁性隧道结刻蚀方法 |
| JP2022550057A (ja) * | 2019-10-01 | 2022-11-30 | ラム リサーチ コーポレーション | 高アスペクト比フィーチャの製造中に劣化を防止するためのマスク封入 |
| US11177431B2 (en) | 2019-12-02 | 2021-11-16 | HeFeChip Corporation Limited | Magnetic memory device and method for manufacturing the same |
| US11217744B2 (en) * | 2019-12-10 | 2022-01-04 | HeFeChip Corporation Limited | Magnetic memory device with multiple sidewall spacers covering sidewall of MTJ element and method for manufacturing the same |
| US11574813B2 (en) | 2019-12-10 | 2023-02-07 | Asm Ip Holding B.V. | Atomic layer etching |
| US11488977B2 (en) | 2020-04-14 | 2022-11-01 | Yangtze Memory Technologies Co., Ltd. | Three-dimensional memory devices and methods for forming the same |
| TWI893134B (zh) * | 2020-06-19 | 2025-08-11 | 日商東京威力科創股份有限公司 | 蝕刻方法、基板處理裝置及基板處理系統 |
| US11961719B2 (en) * | 2020-06-25 | 2024-04-16 | Hitachi High-Tech Corporation | Vacuum processing method |
| US11514962B2 (en) * | 2020-11-12 | 2022-11-29 | International Business Machines Corporation | Two-bit magnetoresistive random-access memory cell |
| TWI773086B (zh) * | 2020-11-17 | 2022-08-01 | 大陸商長江存儲科技有限責任公司 | 用於形成立體(3d)記憶體元件的方法 |
| US12131914B2 (en) | 2020-12-17 | 2024-10-29 | Tokyo Electron Limited | Selective etching with fluorine, oxygen and noble gas containing plasmas |
| US20240021435A1 (en) * | 2021-01-15 | 2024-01-18 | Lam Research Corporation | Metal etch |
| JP7739434B2 (ja) | 2021-02-03 | 2025-09-16 | ラム リサーチ コーポレーション | 原子層エッチングにおけるエッチング選択性の制御 |
| US11894228B2 (en) | 2021-08-26 | 2024-02-06 | Applied Materials, Inc. | Treatments for controlling deposition defects |
| JP2024533108A (ja) * | 2021-09-07 | 2024-09-12 | ラム リサーチ コーポレーション | 三塩化ホウ素を使用した原子層エッチング |
| US12389803B2 (en) | 2021-11-24 | 2025-08-12 | International Business Machines Corporation | Magnetoresistive random-access memory (MRAM) with preserved underlying dielectric layer |
| CN116615087A (zh) * | 2022-02-07 | 2023-08-18 | 北京超弦存储器研究院 | 一种磁性隧道结及其制备方法 |
| US20240371655A1 (en) * | 2023-05-04 | 2024-11-07 | Tokyo Electron Limited | Protection Layer Formation during Plasma Etching Conductive Materials |
Family Cites Families (95)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH061769B2 (ja) | 1983-08-10 | 1994-01-05 | 株式会社日立製作所 | アルミナ膜のパターニング方法 |
| US5298451A (en) | 1991-04-30 | 1994-03-29 | Texas Instruments Incorporated | Recessed and sidewall-sealed poly-buffered LOCOS isolation methods |
| US5282925A (en) | 1992-11-09 | 1994-02-01 | International Business Machines Corporation | Device and method for accurate etching and removal of thin film |
| JPH06151382A (ja) | 1992-11-11 | 1994-05-31 | Toshiba Corp | ドライエッチング方法 |
| DE4241045C1 (de) | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
| JPH06326060A (ja) | 1993-05-12 | 1994-11-25 | Hitachi Ltd | 固体表面加工方法 |
| US6022806A (en) | 1994-03-15 | 2000-02-08 | Kabushiki Kaisha Toshiba | Method of forming a film in recess by vapor phase growth |
| US6124211A (en) * | 1994-06-14 | 2000-09-26 | Fsi International, Inc. | Cleaning method |
| US6083413A (en) * | 1995-10-19 | 2000-07-04 | Massachusetts Institute Of Technology | Metals removal process |
| US5766971A (en) | 1996-12-13 | 1998-06-16 | International Business Machines Corporation | Oxide strip that improves planarity |
| KR20010034127A (ko) | 1998-01-13 | 2001-04-25 | 조셉 제이. 스위니 | 이방성 플라티늄 프로화일을 위한 에칭 방법 |
| US6177353B1 (en) | 1998-09-15 | 2001-01-23 | Infineon Technologies North America Corp. | Metallization etching techniques for reducing post-etch corrosion of metal lines |
| KR20020030108A (ko) * | 1999-09-27 | 2002-04-22 | 추후제출 | 금속 함유층의 이방성 에칭용 탄화수소 가스 |
| US8696875B2 (en) | 1999-10-08 | 2014-04-15 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
| US6458694B2 (en) | 2000-01-24 | 2002-10-01 | Ebara Corporation | High energy sputtering method for forming interconnects |
| JP3662472B2 (ja) * | 2000-05-09 | 2005-06-22 | エム・エフエスアイ株式会社 | 基板表面の処理方法 |
| US6677242B1 (en) | 2000-08-12 | 2004-01-13 | Applied Materials Inc. | Integrated shallow trench isolation approach |
| US6527855B2 (en) | 2000-10-10 | 2003-03-04 | Rensselaer Polytechnic Institute | Atomic layer deposition of cobalt from cobalt metallorganic compounds |
| US20020058409A1 (en) | 2000-11-16 | 2002-05-16 | Ching-Te Lin | Elimination of overhang in liner/barrier/seed layers using post-deposition sputter etch |
| US6448192B1 (en) | 2001-04-16 | 2002-09-10 | Motorola, Inc. | Method for forming a high dielectric constant material |
| EP1384257A2 (en) | 2001-05-04 | 2004-01-28 | Tokyo Electron Limited | Ionized pvd with sequential deposition and etching |
| US8110489B2 (en) | 2001-07-25 | 2012-02-07 | Applied Materials, Inc. | Process for forming cobalt-containing materials |
| US7115516B2 (en) | 2001-10-09 | 2006-10-03 | Applied Materials, Inc. | Method of depositing a material layer |
| US7553427B2 (en) | 2002-05-14 | 2009-06-30 | Tokyo Electron Limited | Plasma etching of Cu-containing layers |
| US6884730B2 (en) | 2002-07-02 | 2005-04-26 | Headway Technologies, Inc. | Method of etching a film of magnetic material and method of manufacturing a thin-film magnetic head |
| US6933239B2 (en) * | 2003-01-13 | 2005-08-23 | Applied Materials, Inc. | Method for removing conductive residue |
| US6841484B2 (en) * | 2003-04-17 | 2005-01-11 | Chentsau Ying | Method of fabricating a magneto-resistive random access memory (MRAM) device |
| JP2004332045A (ja) * | 2003-05-07 | 2004-11-25 | Renesas Technology Corp | 多層膜材料のドライエッチング方法 |
| US7341946B2 (en) | 2003-11-10 | 2008-03-11 | Novellus Systems, Inc. | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
| US20050233555A1 (en) | 2004-04-19 | 2005-10-20 | Nagarajan Rajagopalan | Adhesion improvement for low k dielectrics to conductive materials |
| US7829152B2 (en) | 2006-10-05 | 2010-11-09 | Lam Research Corporation | Electroless plating method and apparatus |
| US7115522B2 (en) | 2004-07-09 | 2006-10-03 | Kabushiki Kaisha Toshiba | Method for manufacturing semiconductor device |
| CN100576474C (zh) | 2004-07-20 | 2009-12-30 | 应用材料股份有限公司 | 以钽前驱物taimata进行含钽材料的原子层沉积 |
| US7196955B2 (en) * | 2005-01-12 | 2007-03-27 | Hewlett-Packard Development Company, L.P. | Hardmasks for providing thermally assisted switching of magnetic memory elements |
| US7235492B2 (en) | 2005-01-31 | 2007-06-26 | Applied Materials, Inc. | Low temperature etchant for treatment of silicon-containing surfaces |
| JP4860219B2 (ja) * | 2005-02-14 | 2012-01-25 | 東京エレクトロン株式会社 | 基板の処理方法、電子デバイスの製造方法及びプログラム |
| US7214626B2 (en) * | 2005-08-24 | 2007-05-08 | United Microelectronics Corp. | Etching process for decreasing mask defect |
| US7795148B2 (en) * | 2006-03-28 | 2010-09-14 | Tokyo Electron Limited | Method for removing damaged dielectric material |
| US20070238301A1 (en) * | 2006-03-28 | 2007-10-11 | Cabral Stephen H | Batch processing system and method for performing chemical oxide removal |
| US7368393B2 (en) * | 2006-04-20 | 2008-05-06 | International Business Machines Corporation | Chemical oxide removal of plasma damaged SiCOH low k dielectrics |
| US7416989B1 (en) | 2006-06-30 | 2008-08-26 | Novellus Systems, Inc. | Adsorption based material removal process |
| US20080265243A1 (en) * | 2007-04-30 | 2008-10-30 | Ahn Kie Y | Magnetic floating gate flash memory structures |
| KR101330707B1 (ko) * | 2007-07-19 | 2013-11-19 | 삼성전자주식회사 | 반도체 장치의 형성 방법 |
| KR100905278B1 (ko) | 2007-07-19 | 2009-06-29 | 주식회사 아이피에스 | 박막증착장치, 박막증착방법 및 반도체 소자의 갭-필 방법 |
| US8247030B2 (en) | 2008-03-07 | 2012-08-21 | Tokyo Electron Limited | Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layer |
| US7948044B2 (en) * | 2008-04-09 | 2011-05-24 | Magic Technologies, Inc. | Low switching current MTJ element for ultra-high STT-RAM and a method for making the same |
| US8252194B2 (en) * | 2008-05-02 | 2012-08-28 | Micron Technology, Inc. | Methods of removing silicon oxide |
| US8124531B2 (en) | 2009-08-04 | 2012-02-28 | Novellus Systems, Inc. | Depositing tungsten into high aspect ratio features |
| US9034768B2 (en) | 2010-07-09 | 2015-05-19 | Novellus Systems, Inc. | Depositing tungsten into high aspect ratio features |
| US20110139748A1 (en) | 2009-12-15 | 2011-06-16 | University Of Houston | Atomic layer etching with pulsed plasmas |
| US8227344B2 (en) | 2010-02-26 | 2012-07-24 | Tokyo Electron Limited | Hybrid in-situ dry cleaning of oxidized surface layers |
| US9373500B2 (en) * | 2014-02-21 | 2016-06-21 | Lam Research Corporation | Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications |
| JP2012038815A (ja) * | 2010-08-04 | 2012-02-23 | Toshiba Corp | 磁気抵抗素子の製造方法 |
| JP5416280B2 (ja) | 2010-08-19 | 2014-02-12 | 株式会社アルバック | ドライエッチング方法及び半導体装置の製造方法 |
| US8546263B2 (en) * | 2011-04-27 | 2013-10-01 | Applied Materials, Inc. | Method of patterning of magnetic tunnel junctions |
| US9666414B2 (en) | 2011-10-27 | 2017-05-30 | Applied Materials, Inc. | Process chamber for etching low k and other dielectric films |
| US8808561B2 (en) | 2011-11-15 | 2014-08-19 | Lam Research Coporation | Inert-dominant pulsing in plasma processing systems |
| US20130129922A1 (en) | 2011-11-21 | 2013-05-23 | Qualcomm Mems Technologies, Inc. | Batch processing for electromechanical systems and equipment for same |
| US8633115B2 (en) | 2011-11-30 | 2014-01-21 | Applied Materials, Inc. | Methods for atomic layer etching |
| US8883028B2 (en) | 2011-12-28 | 2014-11-11 | Lam Research Corporation | Mixed mode pulsing etching in plasma processing systems |
| JP2013197524A (ja) * | 2012-03-22 | 2013-09-30 | Toshiba Corp | 磁気抵抗効果素子の製造方法 |
| JP2014049466A (ja) | 2012-08-29 | 2014-03-17 | Tokyo Electron Ltd | エッチング処理方法及び基板処理装置 |
| JP5918108B2 (ja) * | 2012-11-16 | 2016-05-18 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US9362133B2 (en) | 2012-12-14 | 2016-06-07 | Lam Research Corporation | Method for forming a mask by etching conformal film on patterned ashable hardmask |
| US20140349469A1 (en) | 2013-05-22 | 2014-11-27 | Qualcomm Mems Technologies, Inc. | Processing for electromechanical systems and equipment for same |
| US9362163B2 (en) | 2013-07-30 | 2016-06-07 | Lam Research Corporation | Methods and apparatuses for atomic layer cleaning of contacts and vias |
| US20150111374A1 (en) | 2013-10-18 | 2015-04-23 | International Business Machines Corporation | Surface treatment in a dep-etch-dep process |
| US9214334B2 (en) | 2014-02-18 | 2015-12-15 | Lam Research Corporation | High growth rate process for conformal aluminum nitride |
| US9564582B2 (en) * | 2014-03-07 | 2017-02-07 | Applied Materials, Inc. | Method of forming magnetic tunneling junctions |
| US9257638B2 (en) | 2014-03-27 | 2016-02-09 | Lam Research Corporation | Method to etch non-volatile metal materials |
| US9773683B2 (en) | 2014-06-09 | 2017-09-26 | American Air Liquide, Inc. | Atomic layer or cyclic plasma etching chemistries and processes |
| TWI593015B (zh) | 2014-07-10 | 2017-07-21 | 東京威力科創股份有限公司 | 基板之高精度蝕刻方法 |
| FR3023971B1 (fr) | 2014-07-18 | 2016-08-05 | Commissariat Energie Atomique | Procede de formation des espaceurs d'une grille d'un transistor |
| US9349637B2 (en) | 2014-08-21 | 2016-05-24 | Lam Research Corporation | Method for void-free cobalt gap fill |
| US9362131B2 (en) | 2014-08-29 | 2016-06-07 | Applied Materials, Inc. | Fast atomic layer etch process using an electron beam |
| US9627608B2 (en) | 2014-09-11 | 2017-04-18 | Lam Research Corporation | Dielectric repair for emerging memory devices |
| JP2018500767A (ja) | 2014-12-18 | 2018-01-11 | ザ リージェンツ オブ ザ ユニバーシティ オブ コロラド,ア ボディー コーポレイトTHE REGENTS OF THE UNIVERSITY OF COLORADO,a body corporate | 逐次的な自己制御熱反応を使用する原子層エッチング(ale)の新規の方法 |
| US9576811B2 (en) | 2015-01-12 | 2017-02-21 | Lam Research Corporation | Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch) |
| US9806252B2 (en) | 2015-04-20 | 2017-10-31 | Lam Research Corporation | Dry plasma etch method to pattern MRAM stack |
| US9870899B2 (en) | 2015-04-24 | 2018-01-16 | Lam Research Corporation | Cobalt etch back |
| SG10201604524PA (en) | 2015-06-05 | 2017-01-27 | Lam Res Corp | ATOMIC LAYER ETCHING OF GaN AND OTHER III-V MATERIALS |
| US9449843B1 (en) * | 2015-06-09 | 2016-09-20 | Applied Materials, Inc. | Selectively etching metals and metal nitrides conformally |
| US9922839B2 (en) | 2015-06-23 | 2018-03-20 | Lam Research Corporation | Low roughness EUV lithography |
| US9972504B2 (en) | 2015-08-07 | 2018-05-15 | Lam Research Corporation | Atomic layer etching of tungsten for enhanced tungsten deposition fill |
| US10096487B2 (en) | 2015-08-19 | 2018-10-09 | Lam Research Corporation | Atomic layer etching of tungsten and other metals |
| US9984858B2 (en) | 2015-09-04 | 2018-05-29 | Lam Research Corporation | ALE smoothness: in and outside semiconductor industry |
| KR102451098B1 (ko) | 2015-09-23 | 2022-10-05 | 삼성전자주식회사 | 자기 메모리 장치 및 이의 제조 방법 |
| KR20170050056A (ko) | 2015-10-29 | 2017-05-11 | 삼성전자주식회사 | 반도체 소자의 패턴 형성 방법 |
| US10727073B2 (en) | 2016-02-04 | 2020-07-28 | Lam Research Corporation | Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces |
| US9991128B2 (en) | 2016-02-05 | 2018-06-05 | Lam Research Corporation | Atomic layer etching in continuous plasma |
| US9837312B1 (en) | 2016-07-22 | 2017-12-05 | Lam Research Corporation | Atomic layer etching for enhanced bottom-up feature fill |
| US10566212B2 (en) | 2016-12-19 | 2020-02-18 | Lam Research Corporation | Designer atomic layer etching |
| US10559461B2 (en) | 2017-04-19 | 2020-02-11 | Lam Research Corporation | Selective deposition with atomic layer etch reset |
| US9997371B1 (en) | 2017-04-24 | 2018-06-12 | Lam Research Corporation | Atomic layer etch methods and hardware for patterning applications |
| US10832909B2 (en) | 2017-04-24 | 2020-11-10 | Lam Research Corporation | Atomic layer etch, reactive precursors and energetic sources for patterning applications |
-
2015
- 2015-06-24 US US14/749,291 patent/US9806252B2/en active Active
-
2016
- 2016-04-18 TW TW105111956A patent/TWI690097B/zh active
- 2016-04-18 TW TW109105630A patent/TWI762876B/zh active
- 2016-04-19 JP JP2016083292A patent/JP6804864B2/ja active Active
- 2016-04-19 KR KR1020160047545A patent/KR102515411B1/ko active Active
- 2016-04-19 SG SG10201603090VA patent/SG10201603090VA/en unknown
- 2016-04-20 CN CN201910500208.2A patent/CN110379918B/zh active Active
- 2016-04-20 CN CN201610248296.8A patent/CN106067513B/zh active Active
- 2016-04-20 CN CN201810953048.2A patent/CN109346393A/zh active Pending
-
2017
- 2017-09-28 US US15/719,497 patent/US10374144B2/en active Active
-
2019
- 2019-06-21 US US16/449,141 patent/US10749103B2/en active Active
-
2023
- 2023-03-24 KR KR1020230038474A patent/KR102648476B1/ko active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016208031A5 (enExample) | ||
| TWI690097B (zh) | 乾電漿蝕刻方法以使磁性隨機存取記憶體堆疊圖案化 | |
| JP6935985B2 (ja) | 原子スケールのald(原子層堆積)プロセスとale(原子層エッチング)プロセスとの統合 | |
| CN108122739A (zh) | 拓扑限制的等离子体增强循环沉积的方法 | |
| JP2017092475A5 (enExample) | ||
| TW201543567A (zh) | 無鹵素之氣相矽蝕刻 | |
| JP7602530B2 (ja) | Mramパターニングのための不揮発性材料の化学エッチング | |
| CN112997291A (zh) | 硫族化物材料的保形无损伤封装 | |
| TWI766866B (zh) | 蝕刻方法 | |
| Lim et al. | On the etching characteristics and mechanisms of HfO2 thin films in CF4/O2/Ar and CHF3/O2/Ar plasma for nano-devices | |
| Marchack et al. | Control of surface oxide formation in plasma-enhanced quasiatomic layer etching of tantalum nitride | |
| Hirata et al. | Damage recovery and low‐damage etching of ITO in H2/CO plasma: Effects of hydrogen or oxygen | |
| Garay et al. | Inductively coupled plasma reactive ion etching of CoFeB magnetic thin films in a CH3COOH/Ar gas mixture | |
| KR20140147133A (ko) | 비 휘발성 재료의 층별 에칭 | |
| Lee et al. | Etch characteristics of MgO thin films in Cl2/Ar, CH3OH/Ar and CH4/Ar plasmas | |
| Efremov et al. | Etching characteristics of Pb (Zr, Ti) O3, Pt, SiO2 and Si3N4 in an inductively coupled HBr/Ar plasma | |
| Lill et al. | Divide et impera: Towards new frontiers with atomic layer etching | |
| Kim | Kinetics of etching in inductively coupled plasmas | |
| US20250188608A1 (en) | Selective non-plasma deposition of mask protection material | |
| Chen et al. | Effect of alternating Ar and SF6/C4F8 gas flow in Si nano-structure plasma etching | |
| CN104953026A (zh) | 蚀刻非挥发性金属材料的方法 | |
| Woo et al. | Dry etching of TaN thin film using CH4/Ar inductively coupled plasma | |
| TW202125640A (zh) | 原子層蝕刻及離子束蝕刻圖案化 | |
| Samori et al. | RAS bias voltage coating | |
| Park et al. | Etching of poly-Si with atomic scale accuracy in inductively coupled Ar and He plasmas |