JP2016181583A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 153
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 239000012535 impurity Substances 0.000 claims abstract description 36
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 73
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- 239000011229 interlayer Substances 0.000 claims description 22
- 230000004888 barrier function Effects 0.000 claims description 21
- 238000009792 diffusion process Methods 0.000 claims description 18
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- 238000009751 slip forming Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 1
- 230000006378 damage Effects 0.000 abstract description 12
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 32
- 238000002513 implantation Methods 0.000 description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 19
- 238000005468 ion implantation Methods 0.000 description 15
- 229910021332 silicide Inorganic materials 0.000 description 12
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 12
- 125000004429 atom Chemical group 0.000 description 11
- 238000001039 wet etching Methods 0.000 description 11
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- 238000001312 dry etching Methods 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 9
- 239000000969 carrier Substances 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000005566 electron beam evaporation Methods 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明の第1の実施形態に係る半導体装置1は、図1に示すように、素子領域101及び素子領域101の周囲を囲む外周領域102が主面に定義されたn型の半導体基体10と、外周領域102に配置されたp型のガードリング20と、半導体基体10上に配置されたオーミック接合電極30とを備える。半導体装置1では、素子領域101に半導体素子が形成される。そして、外周領域102に配置されたガードリング20によって、素子領域101端部での電界集中を緩和する。これにより、電界集中に起因する半導体素子の破壊が防止される。
以上では、半導体装置1の素子領域101に形成される半導体素子がSBDである場合について説明した。しかし、半導体素子はSBDに限られない。
図17に示すように、SBDにPN接合領域を付加してショットキー接合とPN接合を併設したMPS(Merged PIN/Schottky)構造を素子領域101に形成した場合にも、本発明は有効である。MPS構造のダイオードは、高い順方向電流が印加されて順方向電圧が上がった際に、PINダイオードが動作し、PN接合からの少数キャリア注入によるドリフト領域の伝導度変調を積極的に利用し、順方向電圧の上昇を抑えることができる。すなわち順方向サージ電流耐量を向上させることができる。また、前記効果を利用し大電流仕様のデバイス構造としても活用されている。
上記のように本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
10…半導体基体
11…半導体基板
12…半導体層
20…ガードリング
21…低濃度p型領域
22…高濃度p型領域
25…p型領域
30…オーミック接合電極
31…第1の拡散バリアメタル層
32…第2の拡散バリアメタル層
40…ショットキー接合電極
50…パッド電極
60…裏面電極
70…層間絶縁膜
80…第1の保護膜
90…第2の保護膜
100…アクティブエリア
101…素子領域
102…外周領域
Claims (7)
- 素子領域及び前記素子領域の周囲を囲む外周領域が主面に定義されたn型の半導体基体と、
前記外周領域で前記半導体基体の上面に前記素子領域の周囲を囲んで配置された低濃度p型領域、及び前記低濃度p型領域よりも不純物濃度が高く且つ前記低濃度p型領域の内側に配置された高濃度p型領域を有し、前記高濃度p型領域が側面及び底面を前記低濃度p型領域に覆われて前記半導体基体のn型領域と接触していないp型のガードリングと、
前記高濃度p型領域とオーミック接合を形成するオーミック接合電極と
を備えることを特徴とする半導体装置。 - 前記半導体基体が炭化ケイ素からなることを特徴とする請求項1に記載の半導体装置。
- 前記素子領域の上面に配置された、前記半導体基体とショットキー接合を形成するショットキー接合電極を更に備えることを特徴とする請求項1又は2に記載の半導体装置。
- 前記オーミック接合電極の上面に配置されたパッド電極を更に備え、
前記オーミック接合電極が、
前記ショットキー接合電極の上面に配置され、前記ショットキー接合電極を構成する金属の拡散を防止する第1の拡散バリアメタル層と、
前記第1の拡散バリアメタル層の上に配置され、前記パッド電極を構成する金属の拡散を防止する第2の拡散バリアメタル層と
を備えることを特徴とする請求項3に記載の半導体装置。 - 前記ショットキー接合電極が配置された主面と対向する前記半導体基体の他方の主面に配置された裏面電極を更に有し、ショットキーバリアダイオードが前記素子領域に形成されていることを特徴とする請求項3又は4に記載の半導体装置。
- 前記外周領域の外縁部に前記素子領域を囲んで配置された層間絶縁膜を更に備え、
前記オーミック接合電極が、前記高濃度p型領域の上面から前記層間絶縁膜の側面及び上面に渡って連続的に形成されていることを特徴とする請求項1乃至5のいずれか1項に記載の半導体装置。 - 前記オーミック接合電極の外縁部が、前記層間絶縁膜の上面において前記ガードリングの外縁部よりも平面視で内側に位置していることを特徴とする請求項6に記載の半導体装置。
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JP2015060498A JP6477106B2 (ja) | 2015-03-24 | 2015-03-24 | 半導体装置 |
US14/747,212 US9391136B1 (en) | 2015-03-24 | 2015-06-23 | Semiconductor device |
CN201510358385.3A CN106024850B (zh) | 2015-03-24 | 2015-06-25 | 半导体装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018148012A (ja) * | 2017-03-06 | 2018-09-20 | サンケン電気株式会社 | 半導体装置 |
JP2019021689A (ja) * | 2017-07-12 | 2019-02-07 | 富士電機株式会社 | 半導体装置の製造方法 |
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JP6104858B2 (ja) * | 2014-08-20 | 2017-03-29 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
JP6673174B2 (ja) * | 2016-12-12 | 2020-03-25 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
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