JP6104858B2 - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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- JP6104858B2 JP6104858B2 JP2014167515A JP2014167515A JP6104858B2 JP 6104858 B2 JP6104858 B2 JP 6104858B2 JP 2014167515 A JP2014167515 A JP 2014167515A JP 2014167515 A JP2014167515 A JP 2014167515A JP 6104858 B2 JP6104858 B2 JP 6104858B2
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- 239000004065 semiconductor Substances 0.000 title claims description 161
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 239000000758 substrate Substances 0.000 claims description 104
- 238000009792 diffusion process Methods 0.000 claims description 57
- 238000005530 etching Methods 0.000 claims description 41
- 230000001629 suppression Effects 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 229910000765 intermetallic Inorganic materials 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910015363 Au—Sn Inorganic materials 0.000 description 17
- 229910002704 AlGaN Inorganic materials 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 6
- 230000000149 penetrating effect Effects 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/4175—Source or drain electrodes for field effect devices for lateral devices where the connection to the source or drain region is done through at least one part of the semiconductor substrate thickness, e.g. with connecting sink or with via-hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Junction Field-Effect Transistors (AREA)
- Manufacturing & Machinery (AREA)
Description
11・・・半導体基板
11a・・・SiC基板
11b・・・GaN層
11c・・・AlGaN層
12・・・ドレイン電極
12f・・・ドレインフィンガー部
12fc・・・接合層
12p・・・ドレインパッド部
12pc・・・接合層
12pp・・・パッド層
13・・・ソース電極
13f・・・ソースフィンガー部
13fc・・・接合層
13p・・・ソースパッド部
13pc・・・接合層
13pp・・・パッド層
13pd・・・拡散抑制層
14・・・ゲート電極
14f・・・ゲートフィンガー部
14fc・・・ソースフィンガー部
14p・・・ゲートパッド部
15・・・貫通孔
16・・・接地配線
17・・・保護膜
17a・・・開口部
18・・・Au−Sn半田
19・・・レジスト層
19a・・・開口部
Claims (7)
- 半導体基板と、
この半導体基板の表面上に設けられた、前記半導体基板の表面に接合する接合層と、この接合層上に設けられた拡散抑制層と、この拡散抑制層上に設けられたパッド層と、を有する電極を有する半導体素子と、
前記電極の直下の前記半導体基板を貫通し、前記拡散抑制層が露出するように設けられた貫通孔の内面を含む前記半導体基板の裏面上に設けられ、前記電極に電気的に接続され、前記貫通孔から露出した前記拡散抑制層に接するように設けられた配線と、
を具備し、
前記貫通孔に充填された半田と前記拡散抑制層との間に金属間化合物が形成される半導体装置。 - AuおよびSnを含む半田を介して実装基板に実装される半導体装置であって、
半導体基板と、
この半導体基板の表面上に設けられた、前記半導体基板の表面に接合する接合層と、この接合層上に設けられたNi層と、このNi層上に設けられたAu層と、を有する電極を有する半導体素子と、
前記電極の直下の前記半導体基板を貫通し、前記Ni層が露出するように設けられた貫通孔の内面を含む前記半導体基板の裏面上に設けられ、前記電極に電気的に接続され、前記貫通孔から露出した前記Ni層に接するように設けられた配線と、
を具備し、
前記貫通孔に充填された半田と前記Ni層との間に金属間化合物が形成される半導体装置。 - 前記半導体素子は高電子移動度トランジスタであるとともに、前記電極はソースフィンガー部およびソースパッド部からなるソース電極であり、
このソース電極が有する前記接合層は、前記ソースフィンガー部および前記ソースパッド部に設けられており、
前記ソース電極が有する前記拡散抑制層および前記パッド層は、前記ソースパッド部の前記接合層上に設けられており、
前記貫通孔は、前記ソースパッド部の直下の前記半導体基板に設けられている請求項1に記載の半導体装置。 - 半導体基板の表面上に接合層、拡散抑制層、およびパッド層をこの順に積層することにより電極を形成し、
前記半導体基板の厚さに相当する第1のエッチング量に所望のオーバーエッチング量を加えた第2のエッチング量で、前記電極の直下の前記半導体基板をエッチングし、
このエッチングによって前記半導体基板に形成され、前記拡散抑制層が露出するように設けられた貫通孔の内面を含む前記半導体基板の裏面上に、前記電極に電気的に接続され、前記貫通孔から露出した前記拡散抑制層に接するように配線を形成し、
前記貫通孔に充填された半田と前記拡散抑制層との間に金属間化合物が形成され、
前記拡散抑制層は、前記オーバーエッチング量より厚く形成される半導体装置の製造方法。 - 前記拡散抑制層は、前記オーバーエッチング量より厚く、かつ前記第2のエッチング量より薄く形成される請求項4に記載の半導体装置の製造方法。
- AuおよびSnを含む半田を介して実装基板に実装される半導体装置の製造方法であって、
半導体基板の表面上に接合層、Ni層、およびAu層をこの順に積層することにより電極を形成し、
前記半導体基板の厚さに相当する第1のエッチング量に所望のオーバーエッチング量を加えた第2のエッチング量で、前記電極の直下の前記半導体基板をエッチングし、
このエッチングによって前記半導体基板に形成され、前記Ni層が露出するように設けられた貫通孔の内面を含む前記半導体基板の裏面上に、前記電極に電気的に接続され、前記貫通孔から露出した前記Ni層に接するように配線を形成し、
前記貫通孔に充填された半田と前記Ni層との間に金属間化合物が形成され、
前記Ni層は、前記オーバーエッチング量より厚く形成される半導体装置の製造方法。 - 前記Ni層は、前記オーバーエッチング量より厚く、かつ前記第2のエッチング量より薄く形成される請求項6に記載の半導体装置の製造方法。
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US14/820,818 US9991349B2 (en) | 2014-08-20 | 2015-08-07 | Semiconductor device and method for manufacturing semiconductor device |
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US10217827B2 (en) * | 2016-05-11 | 2019-02-26 | Rfhic Corporation | High electron mobility transistor (HEMT) |
US10224285B2 (en) * | 2017-02-21 | 2019-03-05 | Raytheon Company | Nitride structure having gold-free contact and methods for forming such structures |
US10096550B2 (en) | 2017-02-21 | 2018-10-09 | Raytheon Company | Nitride structure having gold-free contact and methods for forming such structures |
JP7076576B2 (ja) * | 2018-12-27 | 2022-05-27 | 三菱電機株式会社 | 半導体素子構造 |
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JP2003303842A (ja) * | 2002-04-12 | 2003-10-24 | Nec Electronics Corp | 半導体装置およびその製造方法 |
JP5107138B2 (ja) * | 2008-05-29 | 2012-12-26 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
US8304271B2 (en) * | 2009-05-20 | 2012-11-06 | Jenn Hwa Huang | Integrated circuit having a bulk acoustic wave device and a transistor |
JP5970736B2 (ja) | 2012-04-27 | 2016-08-17 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
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JP6477106B2 (ja) * | 2015-03-24 | 2019-03-06 | サンケン電気株式会社 | 半導体装置 |
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EP2996155A1 (en) | 2016-03-16 |
US9991349B2 (en) | 2018-06-05 |
EP2996155B1 (en) | 2021-03-17 |
JP2016046306A (ja) | 2016-04-04 |
US20160056273A1 (en) | 2016-02-25 |
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