JP2016155377A - 光透過性フィルム - Google Patents
光透過性フィルム Download PDFInfo
- Publication number
- JP2016155377A JP2016155377A JP2016023802A JP2016023802A JP2016155377A JP 2016155377 A JP2016155377 A JP 2016155377A JP 2016023802 A JP2016023802 A JP 2016023802A JP 2016023802 A JP2016023802 A JP 2016023802A JP 2016155377 A JP2016155377 A JP 2016155377A
- Authority
- JP
- Japan
- Prior art keywords
- inorganic oxide
- oxide layer
- layer
- inorganic
- light transmissive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 12
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- 239000005416 organic matter Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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Abstract
【解決手段】光透過性フィルム1は、順に、透明基材2と、光透過性無機層4とを備える。透明基材2は、高分子フィルムからなる。光透過性無機層4は、順に、第1無機酸化物層5と、金属層6と、第2無機酸化物層7とを備える。光透過性無機層4は、導電性を有する。第1無機酸化物層5および第2無機酸化物層7は、水素原子を含有する。第2無機酸化物層7における水素原子の含有量H2の、第1無機酸化物層5における水素原子の含有量H1に対する比(H2/H1)が、0.10以上、10.00以下である。
【選択図】図1
Description
光透過性フィルム1は、所定の厚みを有するフィルム形状(シート形状を含む)をなし、厚み方向と直交する所定方向(前後方向および左右方向、すなわち、面方向)に延び、平坦な上面および平坦な下面(2つの主面)を有する。光透過性フィルム1は、例えば、光学装置(例えば、画像表示装置、調光装置)に備えられるタッチパネル用基材や調光パネルなどの一部品であり、つまり、光学装置ではない。すなわち、光透過性フィルム1は、光学装置などを作製するための部品であり、LCDモジュールなどの画像表示素子や、LEDなどの光源を含まず、部品単独で流通し、産業上利用可能なデバイスである。また、光透過性フィルム1は、透明導電性フィルムを含む。
透明基材2は、光透過性フィルム1の最下層であって、光透過性フィルム1の機械強度を確保する支持材である。透明基材2は、光透過性無機層4を、保護層3とともに、支持する。
保護層3は、光透過性無機層4の上面に擦り傷を生じにくくする(すなわち、優れた耐擦傷性を得る)ための、擦傷保護層である。また、保護層3は、図2が参照されるように、光透過性無機層4を後の工程で配線パターンに形成した後に、非パターン部9とパターン部10との相違が認識されないように(すなわち、配線パターンの視認を抑制するように)、光透過性フィルム1の光学物性を調整する光学調整層でもある。
光透過性無機層4は、図2が参照されるように、後の工程で配線パターンに形成して、パターン部10を形成するための導電層である。また、光透過性無機層4は、透明導電層を含んでいる。
第1無機酸化物層5は、後述する金属層6および第2無機酸化物層7とともに、光透過性無機層4に導電性を付与する導電層である。また、第1無機酸化物層5は、透明基材2に含有される水に由来する水素や、保護層3に含有される有機物に由来する炭素が、金属層6に侵出することを防止するバリヤ層でもある。さらに、第1無機酸化物層5は、後述する第2無機酸化物層7とともに、金属層6の可視光反射率を抑制し、光透過性無機層4の可視光透過率を向上させるための光学調整層でもある。
金属層6は、第1無機酸化物層5および第2無機酸化物層7とともに、光透過性無機層4に導電性を付与する導電層である。また、金属層6は、光透過性無機層4の比抵抗を低減する低比抵抗化層でもある。
第2無機酸化物層7は、第1無機酸化物層5および金属層6とともに、光透過性無機層4に導電性を付与する導電層である。また、第2無機酸化物層7は、環境中の酸素や水分などが金属層6に侵出することを防止するバリヤ層でもあり、金属層6の可視光反射率を抑制し、光透過性無機層4の可視光透過率を向上させるための光学調整層でもある。
第2無機酸化物層7は、光透過性無機層4における最上層であって、フィルム形状(シート形状を含む)を有しており、金属層6の上面全面に、金属層6の上面に接触するように、配置されている。
第2無機酸化物層7における水素原子の含有量H2と炭素原子の含有量C2との合計含有量(H2+C2)の、第1無機酸化物層5における水素原子の含有量H1と炭素原子の含有量C1との合計含有量(H1+C1)に対する比「(H2+C2)/(H1+C1)」は、水素原子の比(H2/H1)よりも大きい方が好ましく、{(H2+C2)/(H1+C1)}/(H2/H1)の値は、例えば、1.01以上であり、好ましくは、1.03以上であり、また、例えば、3.00以下、好ましくは、2.00以下、より好ましくは、1.50以下である。大気と接触する側に配置される第2無機酸化物層7は、第1無機酸化物層5と比して、大気中の酸素により結晶膜になりやすいが、十分な水素原子量の存在に加えて、さらに炭素原子を多く含有することで、非晶質性が維持され、エッチング性を担保しやすい傾向がある。この理由はいかなる理論にも限定されないが、炭素原子は、原子サイズが水素原子よりも大きく、無機酸化物層の結晶化を阻害しやすいためと推定される。水素原子と炭素原子の合計含有量の比(H2+C2)/(H1+C1)が、水素原子の比(H2/H1)よりも大きい場合、そうでない場合と比して、第1無機酸化物層5及び第2無機酸化物層7の水素原子量の含有量が小さい水準(例えば、10×1019atoms/cm3程度)であっても良好なエッチング性をより維持しやすい。他方、{(H2+C2)/(H1+C1)}/(H2/H1)の値が過剰に大きい場合(例えば、値が3.00超える場合)は、第2無機酸化物層7の膜質が劣化し、湿熱耐久性が悪化するおそれがある。
次に、光透過性フィルム1を製造する方法を説明する。
その後、図2に示すように、エッチングによって、光透過性無機層4を配線パターンに形成する。これによって、保護層3の上に、非パターン部9およびパターン部10を形成する。非パターン部9では、保護層3の上面がパターン部10から露出する。
この光透過性フィルム1によれば、第1無機酸化物層5および第2無機酸化物層7の両方を、エッチングにより確実にパターンニングすることができながら、オーバーエッチング部分11の形成を抑制することができる。
変形例において、上記した一実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。
(フィルム基材の用意、および、保護層の形成)
まず、長尺状ポリエチレンテレフタレート(PET)フィルムからなり、厚みが50μmである透明基材を用意した。なお、用意した透明基材における水分量は、19μg/cm2であり、また、水の、透明基材に対する含有量は、0.27質量%でもあった。
次いで、保護層付透明基材ロールを真空スパッタ装置に設置して静置し、未搬送時の気圧が4×10−3Paとなるまで真空排気した(脱ガス処理)。この時、スパッタリングガス(ArおよびO2)を導入しない状態で、保護層付透明基材の一部を搬送し、2×10−2Paまで気圧が上がることを確認した。これにより、保護層付透明基材ロールに十分な量のガスが残存していることを確認した。
Ag−Pd合金からなり、厚みが8nmである金属層を、スパッタリングにより、第1無機酸化物層の上面に形成した。
ITOからなり、厚みが40nmである第2無機酸化物層を、金属層の上面に、スパッタリングにより、形成した。
実施例2
保護層付透明基材ロールを真空スパッタ装置に設置した後における未搬送時の気圧を、4×10−4Paに変更し、12質量%の酸化スズと88質量%の酸化インジウムとの焼結体からなるターゲットを用いて第1無機酸化物層および第2無機酸化物層を形成し、光透過性無機層の形成に要した時間を、3.5分から0.7分に変更した以外は、実施例1と同様にして光透過性フィルムを得た。
Ag−Pdターゲットをスパッタリングする際の放電出力を25%小さくして、金属層の厚みを6nmに変更した以外は、実施例2と同様にして光透過性フィルムを得た。
Ag−Pdターゲットをスパッタリングする際の放電出力を25%大きくして、金属層の厚みを10nmに変更した以外は、実施例2と同様にして光透過性フィルムを得た。
保護層付透明基材ロールを真空スパッタ装置に設置した後における未搬送時の気圧を、4×10−3Paから、9×10−5Paに変更し、また、光透過性無機層の形成に要した時間を、3.5分から180分に変更した以外は、実施例1と同様にして光透過性フィルムを得た。
(1)厚み
保護層、第1金属酸化物層、金属層および第2金属酸化物の厚みを、透過型電子顕微鏡(日立製作所製 H−7650)を用いた断面観察により測定した。
二次イオン質量分析装置(装置名「PHI ADEPT−1010」、アルバック・ファイ社製)を用いて、二次イオン質量分析法により、第1無機酸化物層における水素原子および炭素原子の含有量(H1、C1)を測定した。具体的には、第1無機酸化物層の厚み方向中央部における水素原子の含有量(H1)および炭素原子の含有量(C1)を、二次イオン質量分析法により、測定した。
JIS K7194(1994年)の4探針法に準拠して測定した光透過性無機層の表面抵抗値と、(1)の厚みの測定にて求めた光透過性無機層の厚みとの積から光透過性無機層の比抵抗を算出した。その結果を表1に示す。
光透過性無機層4の上面全面に、感光性フィルム(DFR、商品名「RY3310」、日立化成社製)を配置し、次いで、図2が参照されるように、非パターン部およびパターン部が形成に対応するパターンを有するフォトマスクを露光し、その後、現像することにより、非パターン部に対応する感光性フィルムを除去した。これにより、パターン部となる光透過性無機層4の上面に、パターン部と同一パターンを有するエッチングレジスト13を形成した。その後、エッチングレジスト13から露出する光透過性無機層4を、40℃に加温したエッチング液(株式会社ADEKA社製、アデカケルミカ SET−500)に30秒浸漬することで、エッチングした。
○:第1無機酸化物層におけるオーバーエッチング部分の幅方向長さDが、10μm未満であった。
△:第1無機酸化物層におけるオーバーエッチング部分の幅方向長さDが、10μm以上、15μm未満であった。
×:第1無機酸化物層におけるオーバーエッチング部分の幅方向長さDが、15μm以上であった。
ヘーズメーター(スガ試験機社製、装置名「HGM−2DP)を用いて、全光線透過率を測定し、可視光透過率とした。
2 透明基材
4 光透過性無機層
5 第1無機酸化物層
6 金属層
7 第2無機酸化物層
保護層付透明基材ロールを真空スパッタ装置に設置した後における未搬送時の気圧を、4×10−4Paに変更し、12質量%の酸化スズと88質量%の酸化インジウムとの焼結体からなるターゲットを用いて第1無機酸化物層および第2無機酸化物層を形成し、光透過性無機層の形成に要した時間を、3.5分から0.7分に変更した以外は、実施例1と同様にして光透過性フィルムを得た。
Claims (6)
- 順に、透明基材と、光透過性無機層とを備え、
前記透明基材は、高分子フィルムからなり、
前記光透過性無機層は、順に、第1無機酸化物層と、金属層と、第2無機酸化物層とを備え、
前記光透過性無機層は、導電性を有し、
前記第1無機酸化物層および第2無機酸化物層は、水素原子を含有し、
前記第2無機酸化物層における水素原子の含有量H2の、前記第1無機酸化物層における水素原子の含有量H1に対する比(H2/H1)が、0.10以上、10.00以下であることを特徴とする、光透過性フィルム。 - 前記第1無機酸化物層における水素原子の含有量H1、および、前記第2無機酸化物層における水素原子の含有量H2が、ともに、5×1019atoms/cm3以上、8,000×1019atoms/cm3以下であることを特徴とする、請求項1に記載の光透過性フィルム。
- 前記第1無機酸化物層および前記第2無機酸化物層のうち、少なくとも一方が、酸化インジウムを含有することを特徴とする、請求項1または2のいずれかに記載の光透過性フィルム。
- 前記第1無機酸化物層および前記第2無機酸化物層のいずれもが、非晶質であることを特徴とする、請求項1〜3のいずれか一項に記載の光透過性フィルム。
- 前記第2無機酸化物層の厚みT2の、前記第1無機酸化物層の厚みT1に対する比(T2/T1)が、0.5以上、1.5以下であることを特徴とする、請求項1〜4のいずれか一項に記載の光透過性フィルム。
- 前記第1無機酸化物層および前記第2無機酸化物層は、炭素原子をさらに含有しており、
前記第1無機酸化物層における水素原子の含有量H1と炭素原子の含有量C1との合計含有量(H1+C1)、および、前記第2無機酸化物層における水素原子の含有量H2と炭素原子の含有量C2との合計含有量(H2+C2)が、ともに、6×1019atoms/cm3以上、10,000×1019atoms/cm3以下であることを特徴とする、請求項1〜5のいずれか一項に記載の光透過性フィルム。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018051487A1 (ja) * | 2016-09-16 | 2018-09-13 | 凸版印刷株式会社 | 表示装置及び表示装置基板 |
JP2020082566A (ja) * | 2018-11-28 | 2020-06-04 | 日東電工株式会社 | 導電性フィルム、および、そのパターニング方法 |
JPWO2020095814A1 (ja) * | 2018-11-07 | 2021-09-24 | 日東電工株式会社 | タッチパネル用光透過性導電層付きフィルム、光透過性導電層付き偏光フィルムおよびタッチパネル表示装置 |
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JP6776454B2 (ja) | 2017-08-29 | 2020-10-28 | 富士フイルム株式会社 | 積層膜および積層膜の製造方法 |
US11635186B2 (en) * | 2018-03-13 | 2023-04-25 | Motherson Innovations Company Limited | Polymeric substrate and a method of providing same |
TWI664304B (zh) * | 2018-08-01 | 2019-07-01 | 崑山科技大學 | 氧化銦鎵鋅/銅鉻/氧化銦鎵鋅之透明導電薄膜 |
TWI664307B (zh) * | 2018-08-01 | 2019-07-01 | 崑山科技大學 | 氧化銦鋅/銅鋯/氧化銦鋅之透明導電薄膜 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1170610A (ja) * | 1996-07-26 | 1999-03-16 | Asahi Glass Co Ltd | 透明導電膜、および透明電極の形成方法 |
JP2002157929A (ja) * | 2000-09-08 | 2002-05-31 | Mitsui Chemicals Inc | 透明導電性薄膜積層体及びそのエッチング方法 |
JP2002279835A (ja) * | 2001-03-21 | 2002-09-27 | Mitsui Chemicals Inc | 透明導電性薄膜積層体及びそのエッチング方法 |
JP2013001009A (ja) * | 2011-06-17 | 2013-01-07 | Nitto Denko Corp | 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。 |
JP2014069572A (ja) * | 2012-09-28 | 2014-04-21 | Samsung Corning Precision Materials Co Ltd | 透明導電性基材及びこれを含むタッチパネル |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3031224B2 (ja) | 1995-12-21 | 2000-04-10 | 凸版印刷株式会社 | 透明導電膜 |
WO1998004406A1 (fr) * | 1996-07-26 | 1998-02-05 | Asahi Glass Company Ltd. | Pellicule conductrice transparente et procede pour former une electrode transparente |
JP2001047549A (ja) * | 1999-08-06 | 2001-02-20 | Mitsui Chemicals Inc | 透明導電性フィルム |
JP3918721B2 (ja) * | 2002-03-27 | 2007-05-23 | 住友金属鉱山株式会社 | 透明導電性薄膜、その製造方法と製造用焼結体ターゲット、及び有機エレクトロルミネッセンス素子とその製造方法 |
KR100505536B1 (ko) * | 2002-03-27 | 2005-08-04 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 투명한 도전성 박막, 그것의 제조방법, 그것의 제조를위한 소결 타겟, 디스플레이 패널용의 투명한 전기전도성기재, 및 유기 전기루미네선스 디바이스 |
EP2657768B1 (en) * | 2004-06-16 | 2020-08-05 | Hoya Corporation | Photomask blank and photomask |
US8609994B2 (en) * | 2008-09-24 | 2013-12-17 | Alliance For Sustainable Energy, Llc | Thin film electronic devices with conductive and transparent gas and moisture permeation barriers |
-
2016
- 2016-02-10 JP JP2016023802A patent/JP5976970B1/ja active Active
- 2016-02-18 US US15/550,553 patent/US20180040393A1/en not_active Abandoned
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- 2016-02-22 TW TW105105163A patent/TWI716379B/zh active
- 2016-07-20 JP JP2016142151A patent/JP6713866B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1170610A (ja) * | 1996-07-26 | 1999-03-16 | Asahi Glass Co Ltd | 透明導電膜、および透明電極の形成方法 |
JP2002157929A (ja) * | 2000-09-08 | 2002-05-31 | Mitsui Chemicals Inc | 透明導電性薄膜積層体及びそのエッチング方法 |
JP2002279835A (ja) * | 2001-03-21 | 2002-09-27 | Mitsui Chemicals Inc | 透明導電性薄膜積層体及びそのエッチング方法 |
JP2013001009A (ja) * | 2011-06-17 | 2013-01-07 | Nitto Denko Corp | 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス。 |
JP2014069572A (ja) * | 2012-09-28 | 2014-04-21 | Samsung Corning Precision Materials Co Ltd | 透明導電性基材及びこれを含むタッチパネル |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2018051487A1 (ja) * | 2016-09-16 | 2018-09-13 | 凸版印刷株式会社 | 表示装置及び表示装置基板 |
CN109478110A (zh) * | 2016-09-16 | 2019-03-15 | 凸版印刷株式会社 | 显示装置及显示装置基板 |
KR20190028759A (ko) * | 2016-09-16 | 2019-03-19 | 도판 인사츠 가부시키가이샤 | 표시 장치 및 표시 장치 기판 |
KR102207053B1 (ko) * | 2016-09-16 | 2021-01-25 | 도판 인사츠 가부시키가이샤 | 표시 장치 및 표시 장치 기판 |
JPWO2020095814A1 (ja) * | 2018-11-07 | 2021-09-24 | 日東電工株式会社 | タッチパネル用光透過性導電層付きフィルム、光透過性導電層付き偏光フィルムおよびタッチパネル表示装置 |
JP7469043B2 (ja) | 2018-11-07 | 2024-04-16 | 日東電工株式会社 | タッチパネル用光透過性導電層付きフィルム、光透過性導電層付き偏光フィルムおよびタッチパネル表示装置 |
JP2020082566A (ja) * | 2018-11-28 | 2020-06-04 | 日東電工株式会社 | 導電性フィルム、および、そのパターニング方法 |
KR20200063976A (ko) | 2018-11-28 | 2020-06-05 | 닛토덴코 가부시키가이샤 | 도전성 필름, 및 그 패터닝 방법 |
JP7114446B2 (ja) | 2018-11-28 | 2022-08-08 | 日東電工株式会社 | 導電性フィルム、および、そのパターニング方法 |
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