JP2016039301A - 粘着テープ剥離方法および粘着テープ剥離装置 - Google Patents

粘着テープ剥離方法および粘着テープ剥離装置 Download PDF

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Publication number
JP2016039301A
JP2016039301A JP2014162616A JP2014162616A JP2016039301A JP 2016039301 A JP2016039301 A JP 2016039301A JP 2014162616 A JP2014162616 A JP 2014162616A JP 2014162616 A JP2014162616 A JP 2014162616A JP 2016039301 A JP2016039301 A JP 2016039301A
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JP
Japan
Prior art keywords
adhesive tape
peeling
double
gripping member
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014162616A
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English (en)
Japanese (ja)
Inventor
幸敏 長谷
Yukitoshi Hase
幸敏 長谷
山本　雅之
Masayuki Yamamoto
雅之 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Seiki Co Ltd
Nitto Denko Corp
Original Assignee
Nitto Seiki Co Ltd
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Seiki Co Ltd, Nitto Denko Corp filed Critical Nitto Seiki Co Ltd
Priority to JP2014162616A priority Critical patent/JP2016039301A/ja
Priority to TW104125055A priority patent/TW201608631A/zh
Priority to KR1020150110653A priority patent/KR20160018401A/ko
Priority to CN201510475226.1A priority patent/CN105374728A/zh
Publication of JP2016039301A publication Critical patent/JP2016039301A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
JP2014162616A 2014-08-08 2014-08-08 粘着テープ剥離方法および粘着テープ剥離装置 Pending JP2016039301A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014162616A JP2016039301A (ja) 2014-08-08 2014-08-08 粘着テープ剥離方法および粘着テープ剥離装置
TW104125055A TW201608631A (zh) 2014-08-08 2015-08-03 黏著帶剝離方法及黏著帶剝離裝置
KR1020150110653A KR20160018401A (ko) 2014-08-08 2015-08-05 점착 테이프 박리 방법 및 점착 테이프 박리 장치
CN201510475226.1A CN105374728A (zh) 2014-08-08 2015-08-05 粘合带剥离方法和粘合带剥离装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014162616A JP2016039301A (ja) 2014-08-08 2014-08-08 粘着テープ剥離方法および粘着テープ剥離装置

Publications (1)

Publication Number Publication Date
JP2016039301A true JP2016039301A (ja) 2016-03-22

Family

ID=55376795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014162616A Pending JP2016039301A (ja) 2014-08-08 2014-08-08 粘着テープ剥離方法および粘着テープ剥離装置

Country Status (4)

Country Link
JP (1) JP2016039301A (zh)
KR (1) KR20160018401A (zh)
CN (1) CN105374728A (zh)
TW (1) TW201608631A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190024631A (ko) 2017-08-28 2019-03-08 닛토덴코 가부시키가이샤 점착 테이프 박리 방법 및 점착 테이프 박리 장치
KR20190118967A (ko) 2018-04-11 2019-10-21 닛토덴코 가부시키가이샤 점착 테이프 박리 방법 및 점착 테이프 박리 장치
JP2020122987A (ja) * 2016-09-23 2020-08-13 日本ゼオン株式会社 熱伝導シートの転写方法および転写装置
CN113299576A (zh) * 2020-02-21 2021-08-24 济南晶正电子科技有限公司 一种薄膜机械分离装置
KR102323999B1 (ko) * 2020-07-10 2021-11-09 주식회사 에이치와이씨코리아 웨이퍼 박리 장치

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102422604B1 (ko) * 2016-08-24 2022-07-19 토레 엔지니어링 가부시키가이샤 실장 방법 및 실장 장치
CN106783688A (zh) * 2016-12-28 2017-05-31 京东方科技集团股份有限公司 一种剥离装置及其剥离方法
TWI612858B (zh) * 2017-02-17 2018-01-21 盟立自動化股份有限公司 承載基板以及從承載基板移除黏著層的方法
JP6916641B2 (ja) * 2017-03-15 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 基材処理装置および基材処理方法
KR20180115942A (ko) * 2017-04-14 2018-10-24 한화에어로스페이스 주식회사 부품 실장기용 테이프 박리기
WO2019019114A1 (zh) * 2017-07-27 2019-01-31 深圳市柔宇科技有限公司 剥离装置和剥离方法
CN110125094A (zh) * 2018-02-08 2019-08-16 华为机器有限公司 一种残胶清除系统及残胶清除方法
CN108639484A (zh) * 2018-06-20 2018-10-12 苏州科技大学 一种双面胶条自动粘贴装置
CN109823908A (zh) * 2019-02-03 2019-05-31 无锡奥特维智能装备有限公司 绝缘片撕胶装置及方法
CN110255271A (zh) * 2019-04-19 2019-09-20 安特（惠州）工业有限公司 绝缘胶片组装贴附设备
CN110676207B (zh) * 2019-09-27 2021-11-16 云谷（固安）科技有限公司 分离装置以及分离方法
CN114714748A (zh) * 2021-01-06 2022-07-08 志圣科技（广州）有限公司 剥膜装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003078A (ja) * 2000-06-23 2002-01-09 Ricoh Co Ltd 剥離装置
JP2009239072A (ja) * 2008-03-27 2009-10-15 Dainippon Screen Mfg Co Ltd 剥離装置
JP2009233988A (ja) * 2008-03-26 2009-10-15 Sharp Corp 保護フィルム剥離装置および保護フィルム剥離方法
JP2009274838A (ja) * 2008-05-15 2009-11-26 Sharp Corp 保護フィルム剥離装置
JP2010045069A (ja) * 2008-08-08 2010-02-25 Lintec Corp シート剥離装置および剥離方法
JP2012069768A (ja) * 2010-09-24 2012-04-05 Nitto Denko Corp 両面粘着テープ剥離方法および両面粘着テープ剥離装置
JP2013034011A (ja) * 2012-11-05 2013-02-14 Lintec Corp 半導体ウエハの処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5149122B2 (ja) * 2008-10-22 2013-02-20 リンテック株式会社 シート剥離装置及び剥離方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003078A (ja) * 2000-06-23 2002-01-09 Ricoh Co Ltd 剥離装置
JP2009233988A (ja) * 2008-03-26 2009-10-15 Sharp Corp 保護フィルム剥離装置および保護フィルム剥離方法
JP2009239072A (ja) * 2008-03-27 2009-10-15 Dainippon Screen Mfg Co Ltd 剥離装置
JP2009274838A (ja) * 2008-05-15 2009-11-26 Sharp Corp 保護フィルム剥離装置
JP2010045069A (ja) * 2008-08-08 2010-02-25 Lintec Corp シート剥離装置および剥離方法
JP2012069768A (ja) * 2010-09-24 2012-04-05 Nitto Denko Corp 両面粘着テープ剥離方法および両面粘着テープ剥離装置
JP2013034011A (ja) * 2012-11-05 2013-02-14 Lintec Corp 半導体ウエハの処理方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020122987A (ja) * 2016-09-23 2020-08-13 日本ゼオン株式会社 熱伝導シートの転写方法および転写装置
KR20190024631A (ko) 2017-08-28 2019-03-08 닛토덴코 가부시키가이샤 점착 테이프 박리 방법 및 점착 테이프 박리 장치
JP2019041051A (ja) * 2017-08-28 2019-03-14 日東電工株式会社 粘着テープ剥離方法および粘着テープ剥離装置
KR20190118967A (ko) 2018-04-11 2019-10-21 닛토덴코 가부시키가이샤 점착 테이프 박리 방법 및 점착 테이프 박리 장치
CN113299576A (zh) * 2020-02-21 2021-08-24 济南晶正电子科技有限公司 一种薄膜机械分离装置
KR102323999B1 (ko) * 2020-07-10 2021-11-09 주식회사 에이치와이씨코리아 웨이퍼 박리 장치

Also Published As

Publication number Publication date
KR20160018401A (ko) 2016-02-17
CN105374728A (zh) 2016-03-02
TW201608631A (zh) 2016-03-01

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