JP2016022552A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2016022552A JP2016022552A JP2014147659A JP2014147659A JP2016022552A JP 2016022552 A JP2016022552 A JP 2016022552A JP 2014147659 A JP2014147659 A JP 2014147659A JP 2014147659 A JP2014147659 A JP 2014147659A JP 2016022552 A JP2016022552 A JP 2016022552A
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- JP
- Japan
- Prior art keywords
- separator
- suction
- suction source
- pipe
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 239000012530 fluid Substances 0.000 claims description 6
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Jigs For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
【解決手段】第1の配管32は、第1の吸引源31とチャックテーブル11との間を連通させ、分離器33は、第1の配管32の途中に設けられ、チャックテーブル11から吸引された気体に混入した液体を分離する。排水手段34は、分離器33によって分離された液体を排水する。第2の配管42は、第2の吸引源41と分離器33の排水口との間を連通させる。逆止弁43は、第2の配管42の途中に設けられ、第2の吸引源41の側から分離器33の側への流れを阻止する。
【選択図】図1
Description
また、前記排水手段は、前記分離器内の液体の貯水量を検知する貯水量センサーと、
前記第1の配管の内部の圧力を検知する圧力センサーと、該貯水量センサーにより検知される液体の量が所定量を超えたか否かを判断するとともに、該圧力センサーが検知する圧力が所定値より低いか否かを判断する判断部と、該分離器内に溜まった液体の量が所定量を超えたと該判断部が判断した場合に該第2の吸引源を動作させ、該圧力センサーが検知する圧力が所定値を下回ったと該判断部が判断した場合に該第2の吸引源の動作を停止する切換制御部と、を備えることが好ましい。
分離器に溜まった液体の量が所定の量を超えた場合に第2の吸引源を動作させ、分離器に溜まった液体が完全に排出された場合に第2の吸引源の動作を停止すれば、第2の吸引源を効率的に動作させることができるので、エネルギー効率が向上する。
また、第2の吸引源41の動作を停止させるための構成は、電磁弁48でエア供給源30bから供給されるエアを遮断する構成に限らず、他の構成であってもよい。
13 吸引手段、31 第1の吸引源、
311,411 エジェクタ、111 流路、112 狭隘部、113 吸引路、
312 排気口、
313,314,321,322,413,414,421,422 配管、
32 第1の配管、33 分離器、34 排水手段、
41 第2の吸引源、412 排水口、42 第2の配管、43 逆止弁、
44 貯水量センサー、45 圧力センサー、46 判断部、47 切換制御部、
48 電磁弁、
20 板状ワーク、30a,30b エア供給源
Claims (3)
- 板状ワークを吸引保持するチャックテーブルと、
該チャックテーブルに接続された吸引手段と、
該吸引手段により該チャックテーブルに保持された板状ワークに加工水を供給しながら板状ワークを加工する加工手段と、
を備えた加工装置であって、
該吸引手段は、
第1の吸引源と、
該第1の吸引源と該チャックテーブルとの間を連通させる第1の配管と、
該第1の配管の途中に設けられ、該チャックテーブルから吸引された気体と流体とを分離する分離器と、
該分離器によって分離された液体を排水する排水手段と、
を備え、
該排水手段は、
第2の吸引源と、
該第2の吸引源と該分離器の排水口との間を連通させる第2の配管と、
該第2の吸引源から該分離器への流体の流れを阻止し該第2の配管に配設する逆止弁と、
を備える、加工装置。 - 前記第1の吸引源及び前記第2の吸引源は、それぞれ、エア供給源から供給されるエアの流れによって発生する負圧により吸引を行うエジェクタを備える、
請求項1記載の加工装置。 - 前記排水手段は、
前記分離器内の液体の貯水量を検知する貯水量センサーと、
前記第1の配管の内部の圧力を検知する圧力センサーと、
該貯水量センサーにより検知される液体の量が所定量を超えたか否かを判断するとともに、該圧力センサーが検知する圧力が所定値より低いか否かを判断する判断部と、
該分離器内に溜まった液体の量が所定量を超えたと該判断部が判断した場合に該第2の吸引源を動作させ、該圧力センサーが検知する圧力が所定値を下回ったと該判断部が判断した場合に該第2の吸引源の動作を停止する切換制御部と、
を備える、請求項1又は2記載の加工装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014147659A JP6340277B2 (ja) | 2014-07-18 | 2014-07-18 | 加工装置 |
TW104118506A TWI651164B (zh) | 2014-07-18 | 2015-06-08 | 加工裝置 |
SG10201505187TA SG10201505187TA (en) | 2014-07-18 | 2015-06-30 | Processing apparatus |
CN201510411637.4A CN105269705B (zh) | 2014-07-18 | 2015-07-14 | 加工装置 |
US14/800,904 US9975274B2 (en) | 2014-07-18 | 2015-07-16 | Processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014147659A JP6340277B2 (ja) | 2014-07-18 | 2014-07-18 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016022552A true JP2016022552A (ja) | 2016-02-08 |
JP6340277B2 JP6340277B2 (ja) | 2018-06-06 |
Family
ID=55073840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014147659A Active JP6340277B2 (ja) | 2014-07-18 | 2014-07-18 | 加工装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9975274B2 (ja) |
JP (1) | JP6340277B2 (ja) |
CN (1) | CN105269705B (ja) |
SG (1) | SG10201505187TA (ja) |
TW (1) | TWI651164B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018206931A (ja) * | 2017-06-02 | 2018-12-27 | 株式会社ディスコ | ウエーハの研削方法 |
JP2019188552A (ja) * | 2018-04-26 | 2019-10-31 | 株式会社ディスコ | 切削装置 |
JP2019212734A (ja) * | 2018-06-04 | 2019-12-12 | 株式会社ディスコ | 切削装置 |
JP2021052112A (ja) * | 2019-09-25 | 2021-04-01 | 株式会社ディスコ | 加工装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10271093B1 (en) | 2016-06-27 | 2019-04-23 | Amazon Technologies, Inc. | Systems and methods for routing content to an associated output device |
JP6792363B2 (ja) * | 2016-07-22 | 2020-11-25 | 株式会社ディスコ | 研削装置 |
EP3680061A4 (en) * | 2017-09-07 | 2021-06-09 | Shinkoh Co., Ltd. | FASTENING TOOL |
JP7102157B2 (ja) * | 2018-02-08 | 2022-07-19 | Towa株式会社 | 切断装置及び切断品の製造方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422829A (en) * | 1982-02-25 | 1983-12-27 | Buchanan William T | Sump drain system |
JPH11320406A (ja) * | 1998-05-06 | 1999-11-24 | Speedfam-Ipec Co Ltd | 研磨装置における排液・排気の処理方法及び装置 |
JP2000164533A (ja) * | 1998-11-25 | 2000-06-16 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2002103262A (ja) * | 2000-09-27 | 2002-04-09 | Nippei Toyama Corp | 半導体ウェーハの吸着装置 |
JP2002144180A (ja) * | 2000-11-09 | 2002-05-21 | Nippon Electric Glass Co Ltd | ガラス板の吸着保持装置及び吸着保持方法 |
WO2005003043A1 (ja) * | 2003-07-04 | 2005-01-13 | Japan Applied Microbiology Research Institute Ltd | 曝気用エジェクター |
JP2007210037A (ja) * | 2006-02-07 | 2007-08-23 | Apic Yamada Corp | 吸着装置および切断装置 |
JP2008151097A (ja) * | 2006-12-20 | 2008-07-03 | Smc Corp | 真空吸着装置 |
JP2010093301A (ja) * | 2003-08-29 | 2010-04-22 | Nikon Corp | 液体回収装置、露光装置、露光方法及びデバイス製造方法 |
JP2012151263A (ja) * | 2011-01-19 | 2012-08-09 | Disco Abrasive Syst Ltd | 加工装置 |
JP2014034068A (ja) * | 2012-08-07 | 2014-02-24 | Disco Abrasive Syst Ltd | 加工装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5436999B2 (ja) * | 2009-09-24 | 2014-03-05 | 株式会社ディスコ | 被加工物保持装置 |
JP5795977B2 (ja) * | 2012-03-14 | 2015-10-14 | 株式会社荏原製作所 | 研磨装置 |
JP5957330B2 (ja) * | 2012-08-01 | 2016-07-27 | 株式会社ディスコ | ウェーハ貼着装置 |
KR101403614B1 (ko) * | 2012-09-17 | 2014-06-05 | 대우조선해양 주식회사 | 기액 분리 시스템 |
JP6076063B2 (ja) * | 2012-12-11 | 2017-02-08 | 株式会社ディスコ | 加工装置 |
JP6132547B2 (ja) * | 2012-12-25 | 2017-05-24 | 株式会社ディスコ | 負圧生成装置 |
JP6331474B2 (ja) * | 2014-02-28 | 2018-05-30 | ブラザー工業株式会社 | 工作機械の洗浄液濾過装置 |
-
2014
- 2014-07-18 JP JP2014147659A patent/JP6340277B2/ja active Active
-
2015
- 2015-06-08 TW TW104118506A patent/TWI651164B/zh active
- 2015-06-30 SG SG10201505187TA patent/SG10201505187TA/en unknown
- 2015-07-14 CN CN201510411637.4A patent/CN105269705B/zh active Active
- 2015-07-16 US US14/800,904 patent/US9975274B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422829A (en) * | 1982-02-25 | 1983-12-27 | Buchanan William T | Sump drain system |
JPH11320406A (ja) * | 1998-05-06 | 1999-11-24 | Speedfam-Ipec Co Ltd | 研磨装置における排液・排気の処理方法及び装置 |
JP2000164533A (ja) * | 1998-11-25 | 2000-06-16 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP2002103262A (ja) * | 2000-09-27 | 2002-04-09 | Nippei Toyama Corp | 半導体ウェーハの吸着装置 |
JP2002144180A (ja) * | 2000-11-09 | 2002-05-21 | Nippon Electric Glass Co Ltd | ガラス板の吸着保持装置及び吸着保持方法 |
WO2005003043A1 (ja) * | 2003-07-04 | 2005-01-13 | Japan Applied Microbiology Research Institute Ltd | 曝気用エジェクター |
JP2010093301A (ja) * | 2003-08-29 | 2010-04-22 | Nikon Corp | 液体回収装置、露光装置、露光方法及びデバイス製造方法 |
JP2007210037A (ja) * | 2006-02-07 | 2007-08-23 | Apic Yamada Corp | 吸着装置および切断装置 |
JP2008151097A (ja) * | 2006-12-20 | 2008-07-03 | Smc Corp | 真空吸着装置 |
JP2012151263A (ja) * | 2011-01-19 | 2012-08-09 | Disco Abrasive Syst Ltd | 加工装置 |
JP2014034068A (ja) * | 2012-08-07 | 2014-02-24 | Disco Abrasive Syst Ltd | 加工装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018206931A (ja) * | 2017-06-02 | 2018-12-27 | 株式会社ディスコ | ウエーハの研削方法 |
JP2019188552A (ja) * | 2018-04-26 | 2019-10-31 | 株式会社ディスコ | 切削装置 |
JP7071783B2 (ja) | 2018-04-26 | 2022-05-19 | 株式会社ディスコ | 切削装置 |
JP2019212734A (ja) * | 2018-06-04 | 2019-12-12 | 株式会社ディスコ | 切削装置 |
JP2021052112A (ja) * | 2019-09-25 | 2021-04-01 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN105269705B (zh) | 2019-11-29 |
JP6340277B2 (ja) | 2018-06-06 |
TW201607684A (zh) | 2016-03-01 |
CN105269705A (zh) | 2016-01-27 |
TWI651164B (zh) | 2019-02-21 |
US20160016331A1 (en) | 2016-01-21 |
US9975274B2 (en) | 2018-05-22 |
SG10201505187TA (en) | 2016-02-26 |
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