JP2016006809A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016006809A5 JP2016006809A5 JP2014119261A JP2014119261A JP2016006809A5 JP 2016006809 A5 JP2016006809 A5 JP 2016006809A5 JP 2014119261 A JP2014119261 A JP 2014119261A JP 2014119261 A JP2014119261 A JP 2014119261A JP 2016006809 A5 JP2016006809 A5 JP 2016006809A5
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- resist layer
- resin
- examples
- alkali
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L Barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N TMPTA Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- XYRRJTMWSSGQGR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO.OCC(CO)(CO)CO XYRRJTMWSSGQGR-UHFFFAOYSA-N 0.000 description 1
- WFKIYROFDWMUEO-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1.C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 WFKIYROFDWMUEO-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- -1 epoxy acrylate Chemical compound 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014119261A JP6224531B2 (ja) | 2013-06-14 | 2014-06-10 | 配線基板の製造方法 |
Applications Claiming Priority (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013125179 | 2013-06-14 | ||
| JP2013125179 | 2013-06-14 | ||
| JP2013131839 | 2013-06-24 | ||
| JP2013131839 | 2013-06-24 | ||
| JP2013139706 | 2013-07-03 | ||
| JP2013139706 | 2013-07-03 | ||
| JP2013150824 | 2013-07-19 | ||
| JP2013150825 | 2013-07-19 | ||
| JP2013150824 | 2013-07-19 | ||
| JP2013150825 | 2013-07-19 | ||
| JP2013151335 | 2013-07-22 | ||
| JP2013151335 | 2013-07-22 | ||
| JP2014111574 | 2014-05-29 | ||
| JP2014111574 | 2014-05-29 | ||
| JP2014119261A JP6224531B2 (ja) | 2013-06-14 | 2014-06-10 | 配線基板の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017102667A Division JP6416324B2 (ja) | 2013-06-14 | 2017-05-24 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016006809A JP2016006809A (ja) | 2016-01-14 |
| JP2016006809A5 true JP2016006809A5 (de) | 2016-05-26 |
| JP6224531B2 JP6224531B2 (ja) | 2017-11-01 |
Family
ID=52022186
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014119261A Active JP6224531B2 (ja) | 2013-06-14 | 2014-06-10 | 配線基板の製造方法 |
| JP2017102667A Active JP6416324B2 (ja) | 2013-06-14 | 2017-05-24 | 配線基板の製造方法 |
| JP2018093702A Active JP6514808B2 (ja) | 2013-06-14 | 2018-05-15 | 配線基板の製造方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017102667A Active JP6416324B2 (ja) | 2013-06-14 | 2017-05-24 | 配線基板の製造方法 |
| JP2018093702A Active JP6514808B2 (ja) | 2013-06-14 | 2018-05-15 | 配線基板の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (3) | JP6224531B2 (de) |
| KR (1) | KR102082641B1 (de) |
| CN (3) | CN107846786B (de) |
| TW (1) | TWI700974B (de) |
| WO (1) | WO2014199890A1 (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016012702A (ja) * | 2014-06-30 | 2016-01-21 | ファナック株式会社 | ソルダコートの濡れ性と耐食性を両立させたプリント基板およびその製造方法 |
| TWI645760B (zh) * | 2017-10-27 | 2018-12-21 | 南亞電路板股份有限公司 | 電路板及其製造方法 |
| CN108289388A (zh) * | 2017-12-07 | 2018-07-17 | 江门崇达电路技术有限公司 | 一种预防上锡不良的pcb制作方法 |
| JP7142604B2 (ja) | 2019-05-15 | 2022-09-27 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
| TWI731376B (zh) * | 2019-07-22 | 2021-06-21 | 頎邦科技股份有限公司 | 具有粗化防焊層的軟質線路基板及其製造方法 |
| JP7498549B2 (ja) * | 2019-09-11 | 2024-06-12 | 太陽ホールディングス株式会社 | 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法 |
| JP7498550B2 (ja) * | 2019-09-11 | 2024-06-12 | 太陽ホールディングス株式会社 | 積層硬化体、硬化性樹脂組成物、ドライフィルム、および、積層硬化体の製造方法 |
| JP2021163851A (ja) * | 2020-03-31 | 2021-10-11 | 三菱製紙株式会社 | ソルダーレジストパターンの形成方法 |
| KR20210129410A (ko) * | 2020-04-20 | 2021-10-28 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
| CN113747681B (zh) * | 2020-05-27 | 2023-01-17 | 庆鼎精密电子（淮安）有限公司 | 嵌埋元件的软硬结合电路板及其制作方法 |
| US11551939B2 (en) * | 2020-09-02 | 2023-01-10 | Qualcomm Incorporated | Substrate comprising interconnects embedded in a solder resist layer |
| KR20220039385A (ko) | 2020-09-22 | 2022-03-29 | 삼성전자주식회사 | 인터포저 및 이를 포함하는 반도체 패키지 |
| US20220328394A1 (en) * | 2021-04-07 | 2022-10-13 | Mediatek Inc. | Three-dimensional pad structure and interconnection structure for electronic devices |
| TWI780783B (zh) * | 2021-06-18 | 2022-10-11 | 大陸商律勝科技（蘇州）有限公司 | 印刷電路板之製造方法及具保護層之印刷電路板 |
| CN116801482B (zh) * | 2022-03-18 | 2024-05-10 | 华为技术有限公司 | 电路板组件及其加工方法、电子设备 |
| KR102674312B1 (ko) * | 2023-01-13 | 2024-06-12 | 엘지이노텍 주식회사 | 반도체 패키지 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS346263B1 (de) | 1957-01-18 | 1959-07-18 | ||
| JPS61256789A (ja) * | 1985-05-10 | 1986-11-14 | 株式会社日立製作所 | プリント配線板製造方法 |
| JP2910261B2 (ja) * | 1991-02-13 | 1999-06-23 | 松下電器産業株式会社 | プリント配線板とその製造方法 |
| JPH05226505A (ja) | 1992-02-18 | 1993-09-03 | Ibiden Co Ltd | プリント配線板 |
| JP3182371B2 (ja) * | 1997-06-05 | 2001-07-03 | 三洋電機株式会社 | 空気調和機 |
| JP3856414B2 (ja) * | 1997-12-25 | 2006-12-13 | 日本ビクター株式会社 | プリント配線基板の製造方法及びプリント配線基板 |
| JP2001135919A (ja) * | 1999-11-08 | 2001-05-18 | Sumitomo Metal Electronics Devices Inc | プラスチックパッケージの製造方法 |
| JP3883948B2 (ja) * | 2002-10-16 | 2007-02-21 | 大日本印刷株式会社 | 多層配線基板およびフリップチップ方式の半導体パッケージ |
| JP3912405B2 (ja) * | 2003-11-11 | 2007-05-09 | 三菱化学株式会社 | 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置 |
| TWI259572B (en) * | 2004-09-07 | 2006-08-01 | Siliconware Precision Industries Co Ltd | Bump structure of semiconductor package and fabrication method thereof |
| US7420282B2 (en) * | 2004-10-18 | 2008-09-02 | Sharp Kabushiki Kaisha | Connection structure for connecting semiconductor element and wiring board, and semiconductor device |
| US7326636B2 (en) * | 2005-05-24 | 2008-02-05 | Agilent Technologies, Inc. | Method and circuit structure employing a photo-imaged solder mask |
| CN101945533B (zh) * | 2006-05-17 | 2013-04-03 | 三菱制纸株式会社 | 电路基板 |
| JP5255545B2 (ja) * | 2009-09-29 | 2013-08-07 | 三菱製紙株式会社 | ソルダーレジストの形成方法 |
| KR101047139B1 (ko) * | 2009-11-11 | 2011-07-07 | 삼성전기주식회사 | 단층 보드온칩 패키지 기판 및 그 제조방법 |
| JP5444050B2 (ja) * | 2010-03-12 | 2014-03-19 | 三菱製紙株式会社 | ソルダーレジストパターンの形成方法 |
| CN103109588B (zh) * | 2010-09-28 | 2016-09-07 | 三菱制纸株式会社 | 阻焊图案的形成方法 |
| JP5830925B2 (ja) | 2011-05-10 | 2015-12-09 | 日立化成株式会社 | プリント配線板の製造方法 |
| JP3182371U (ja) * | 2012-02-10 | 2013-03-21 | 三菱製紙株式会社 | レジスト層の薄膜化処理装置 |
-
2014
- 2014-06-05 CN CN201711315848.3A patent/CN107846786B/zh active Active
- 2014-06-05 KR KR1020157030883A patent/KR102082641B1/ko active IP Right Grant
- 2014-06-05 CN CN201711315868.0A patent/CN107809854A/zh active Pending
- 2014-06-05 CN CN201480033751.1A patent/CN105309053B/zh active Active
- 2014-06-05 WO PCT/JP2014/064929 patent/WO2014199890A1/ja active Application Filing
- 2014-06-10 JP JP2014119261A patent/JP6224531B2/ja active Active
- 2014-06-12 TW TW103120347A patent/TWI700974B/zh active
-
2017
- 2017-05-24 JP JP2017102667A patent/JP6416324B2/ja active Active
-
2018
- 2018-05-15 JP JP2018093702A patent/JP6514808B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016006809A5 (de) | ||
| JP2009037232A5 (de) | ||
| JP2013083960A5 (de) | ||
| WO2015060021A1 (ja) | 軟磁性樹脂組成物、および、軟磁性フィルム | |
| JP2009517498A5 (de) | ||
| JP5044326B2 (ja) | エポキシ樹脂組成物及び樹脂封止装置 | |
| JP2015147828A5 (de) | ||
| MY160364A (en) | Adhesive tape for manufacturing electronic components | |
| WO2008146723A1 (ja) | 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置 | |
| JP2014240499A5 (de) | ||
| JP2010521555A5 (de) | ||
| JP2014019799A5 (de) | ||
| JP2014015631A5 (de) | ||
| TWI456348B (zh) | 感光性導電膏及導電圖案的製造方法 | |
| JP2016221967A5 (de) | ||
| JP2012033434A (ja) | 組成物、その硬化物、および電子デバイス | |
| JP2007009217A5 (de) | ||
| TWI313282B (en) | Halogen free dry film photosensitive resin composition | |
| JP6230363B2 (ja) | フィルム用樹脂組成物、絶縁フィルムおよび半導体装置 | |
| JP2017097974A5 (de) | ||
| PH12020550991A1 (en) | Curable resin composition, dry film, cured article, and printed circuit board | |
| JP2006312751A5 (ja) | 銅張積層板用プリプレグ及びそれを用いた銅張積層板 | |
| JP2008088405A (ja) | 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート | |
| JP2005181565A5 (de) | ||
| JP2019192891A (ja) | ２液性ソルダーレジストインキを用いて回路基板上にソルダーレジスト層を形成する方法 |