TWI456348B - 感光性導電膏及導電圖案的製造方法 - Google Patents

感光性導電膏及導電圖案的製造方法 Download PDF

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Publication number
TWI456348B
TWI456348B TW101107795A TW101107795A TWI456348B TW I456348 B TWI456348 B TW I456348B TW 101107795 A TW101107795 A TW 101107795A TW 101107795 A TW101107795 A TW 101107795A TW I456348 B TWI456348 B TW I456348B
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TW
Taiwan
Prior art keywords
mgkoh
photosensitive
conductive paste
double bond
acid value
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TW101107795A
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English (en)
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TW201245858A (en
Inventor
Tsukuru Mizuguchi
Kazutaka Kusano
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Toray Industries
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Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW201245858A publication Critical patent/TW201245858A/zh
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Publication of TWI456348B publication Critical patent/TWI456348B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Conductive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Claims (5)

  1. 一種感光性導電膏，其包括：二羧酸或其酸酐(A)；具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)；光聚合起始劑(C)；以及導電性填料(D)，其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)是環氧丙烯酸酯。
  2. 一種感光性導電膏，其包括：二羧酸或其酸酐(A)；具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)；光聚合起始劑(C)；以及導電性填料(D)，其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)具有雙酚A骨架、雙酚F骨架、聯苯骨架、或酚醛清漆骨架。
  3. 如申請專利範圍第1項或第2項所述之感光性導電膏，其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)的玻璃轉移溫度為-10℃~50℃的範圍內。
  4. 如申請專利範圍第1項或第2項所述之感光性導電膏，其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)的分子量為3,000~20,000的範圍內。
  5. 一種導電圖案的製造方法，其將如申請專利範圍第1項或第2項所述之感光性導電膏塗佈於基板上，進行乾燥、曝光、顯影後於100℃以上、300℃以下的溫度下進行硬化。
TW101107795A 2011-03-14 2012-03-08 感光性導電膏及導電圖案的製造方法 TWI456348B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011055025 2011-03-14

Publications (2)

Publication Number Publication Date
TW201245858A TW201245858A (en) 2012-11-16
TWI456348B true TWI456348B (zh) 2014-10-11

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Country Status (5)

Country Link
JP (1) JP5278632B2 (zh)
KR (1) KR101774307B1 (zh)
CN (2) CN105867067A (zh)
TW (1) TWI456348B (zh)
WO (1) WO2012124438A1 (zh)

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US9385132B2 (en) 2011-08-25 2016-07-05 Micron Technology, Inc. Arrays of recessed access devices, methods of forming recessed access gate constructions, and methods of forming isolation gate constructions in the fabrication of recessed access devices
KR101716722B1 (ko) * 2012-03-22 2017-03-15 도레이 카부시키가이샤 감광성 도전 페이스트 및 도전 패턴의 제조 방법
JPWO2014069436A1 (ja) * 2012-10-31 2016-09-08 東レ株式会社 感光性導電ペースト及び導電パターンの製造方法
JP6097556B2 (ja) * 2012-12-25 2017-03-15 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
CN105009695B (zh) 2013-02-18 2018-09-18 奥博泰克有限公司 两步直接刻写激光金属化
US10622244B2 (en) 2013-02-18 2020-04-14 Orbotech Ltd. Pulsed-mode direct-write laser metallization
JP6116285B2 (ja) * 2013-02-21 2017-04-19 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
KR101788100B1 (ko) * 2013-03-29 2017-10-19 도레이 카부시키가이샤 도전 페이스트 및 도전 패턴의 제조 방법
US9005463B2 (en) 2013-05-29 2015-04-14 Micron Technology, Inc. Methods of forming a substrate opening
US10537027B2 (en) 2013-08-02 2020-01-14 Orbotech Ltd. Method producing a conductive path on a substrate
JPWO2015122345A1 (ja) * 2014-02-12 2017-03-30 東レ株式会社 導電ペースト、パターンの製造方法、導電パターンの製造方法及びセンサー
JP6349844B2 (ja) * 2014-03-26 2018-07-04 東レ株式会社 感光性樹脂組成物、それからなる感光性樹脂ペーストならびにそれらを硬化させて得られる硬化膜およびそれを有する電極回路
JP6884547B2 (ja) * 2016-10-26 2021-06-09 キヤノン株式会社 電子写真感光体の製造方法
WO2019073926A1 (ja) * 2017-10-11 2019-04-18 東レ株式会社 感光性導電ペーストおよび導電パターン形成用フィルム

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Also Published As

Publication number Publication date
CN105867067A (zh) 2016-08-17
CN103430097B (zh) 2016-05-25
WO2012124438A1 (ja) 2012-09-20
CN103430097A (zh) 2013-12-04
JP5278632B2 (ja) 2013-09-04
KR101774307B1 (ko) 2017-09-05
KR20140006883A (ko) 2014-01-16
JPWO2012124438A1 (ja) 2014-07-17
TW201245858A (en) 2012-11-16

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