TWI456348B - 感光性導電膏及導電圖案的製造方法 - Google Patents
感光性導電膏及導電圖案的製造方法 Download PDFInfo
- Publication number
- TWI456348B TWI456348B TW101107795A TW101107795A TWI456348B TW I456348 B TWI456348 B TW I456348B TW 101107795 A TW101107795 A TW 101107795A TW 101107795 A TW101107795 A TW 101107795A TW I456348 B TWI456348 B TW I456348B
- Authority
- TW
- Taiwan
- Prior art keywords
- mgkoh
- photosensitive
- conductive paste
- double bond
- acid value
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Conductive Materials (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Electric Cables (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Claims (5)
- 一種感光性導電膏,其包括:二羧酸或其酸酐(A);具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B);光聚合起始劑(C);以及導電性填料(D),其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)是環氧丙烯酸酯。
- 一種感光性導電膏,其包括:二羧酸或其酸酐(A);具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B);光聚合起始劑(C);以及導電性填料(D),其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)具有雙酚A骨架、雙酚F骨架、聯苯骨架、或酚醛清漆骨架。
- 如申請專利範圍第1項或第2項所述之感光性導電膏,其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)的玻璃轉移溫度為-10℃~50℃的範圍內。
- 如申請專利範圍第1項或第2項所述之感光性導電膏,其中上述具有不飽和雙鍵、且酸值為40mgKOH/g~200mgKOH/g的範圍內的感光性成分(B)的分子量為3,000~20,000的範圍內。
- 一種導電圖案的製造方法,其將如申請專利範圍第1項或第2項所述之感光性導電膏塗佈於基板上,進行乾燥、曝光、顯影後於100℃以上、300℃以下的溫度下進行硬化。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011055025 | 2011-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201245858A TW201245858A (en) | 2012-11-16 |
TWI456348B true TWI456348B (zh) | 2014-10-11 |
Family
ID=46830514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101107795A TWI456348B (zh) | 2011-03-14 | 2012-03-08 | 感光性導電膏及導電圖案的製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5278632B2 (zh) |
KR (1) | KR101774307B1 (zh) |
CN (2) | CN105867067A (zh) |
TW (1) | TWI456348B (zh) |
WO (1) | WO2012124438A1 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9385132B2 (en) | 2011-08-25 | 2016-07-05 | Micron Technology, Inc. | Arrays of recessed access devices, methods of forming recessed access gate constructions, and methods of forming isolation gate constructions in the fabrication of recessed access devices |
CN104204946A (zh) * | 2012-03-22 | 2014-12-10 | 东丽株式会社 | 感光性导电浆料和导电图案的制造方法 |
JPWO2014069436A1 (ja) * | 2012-10-31 | 2016-09-08 | 東レ株式会社 | 感光性導電ペースト及び導電パターンの製造方法 |
JP6097556B2 (ja) * | 2012-12-25 | 2017-03-15 | 太陽インキ製造株式会社 | 導電性樹脂組成物及び導電回路 |
CN105009695B (zh) | 2013-02-18 | 2018-09-18 | 奥博泰克有限公司 | 两步直接刻写激光金属化 |
US10622244B2 (en) | 2013-02-18 | 2020-04-14 | Orbotech Ltd. | Pulsed-mode direct-write laser metallization |
JP6116285B2 (ja) * | 2013-02-21 | 2017-04-19 | 太陽インキ製造株式会社 | 導電性樹脂組成物及び導電回路 |
KR101788100B1 (ko) | 2013-03-29 | 2017-10-19 | 도레이 카부시키가이샤 | 도전 페이스트 및 도전 패턴의 제조 방법 |
US9005463B2 (en) | 2013-05-29 | 2015-04-14 | Micron Technology, Inc. | Methods of forming a substrate opening |
US10537027B2 (en) | 2013-08-02 | 2020-01-14 | Orbotech Ltd. | Method producing a conductive path on a substrate |
KR20160122694A (ko) * | 2014-02-12 | 2016-10-24 | 도레이 카부시키가이샤 | 도전 페이스트, 패턴의 제조 방법, 도전 패턴의 제조 방법 및 센서 |
JP6349844B2 (ja) * | 2014-03-26 | 2018-07-04 | 東レ株式会社 | 感光性樹脂組成物、それからなる感光性樹脂ペーストならびにそれらを硬化させて得られる硬化膜およびそれを有する電極回路 |
JP6884547B2 (ja) * | 2016-10-26 | 2021-06-09 | キヤノン株式会社 | 電子写真感光体の製造方法 |
CN111149056B (zh) * | 2017-10-11 | 2023-07-25 | 东丽株式会社 | 感光性导电糊剂及导电图案形成用膜 |
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TW201348354A (zh) * | 2012-03-28 | 2013-12-01 | Toray Industries | 感光性導電糊及導電圖案之製造方法 |
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JPH10279364A (ja) * | 1997-04-01 | 1998-10-20 | Toray Ind Inc | セラミックス・グリーンシート |
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2012
- 2012-02-21 KR KR1020137021506A patent/KR101774307B1/ko active Search and Examination
- 2012-02-21 JP JP2013504623A patent/JP5278632B2/ja active Active
- 2012-02-21 CN CN201610303969.5A patent/CN105867067A/zh active Pending
- 2012-02-21 WO PCT/JP2012/054104 patent/WO2012124438A1/ja active Application Filing
- 2012-02-21 CN CN201280013251.2A patent/CN103430097B/zh active Active
- 2012-03-08 TW TW101107795A patent/TWI456348B/zh active
Patent Citations (3)
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JP2005240092A (ja) * | 2004-02-26 | 2005-09-08 | Dowa Mining Co Ltd | 銀粉およびその製造方法 |
TW201042377A (en) * | 2009-03-31 | 2010-12-01 | Fujifilm Corp | Photosensitive composition, photosensitive resin transfer film, resin pattern, method of making resin pattern, substrate for liquid crystal display device and liquid crystal display device |
TW201348354A (zh) * | 2012-03-28 | 2013-12-01 | Toray Industries | 感光性導電糊及導電圖案之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5278632B2 (ja) | 2013-09-04 |
KR101774307B1 (ko) | 2017-09-05 |
WO2012124438A1 (ja) | 2012-09-20 |
KR20140006883A (ko) | 2014-01-16 |
CN103430097A (zh) | 2013-12-04 |
TW201245858A (en) | 2012-11-16 |
CN105867067A (zh) | 2016-08-17 |
JPWO2012124438A1 (ja) | 2014-07-17 |
CN103430097B (zh) | 2016-05-25 |
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