JP2015533195A5 - - Google Patents

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Publication number
JP2015533195A5
JP2015533195A5 JP2015535693A JP2015535693A JP2015533195A5 JP 2015533195 A5 JP2015533195 A5 JP 2015533195A5 JP 2015535693 A JP2015535693 A JP 2015535693A JP 2015535693 A JP2015535693 A JP 2015535693A JP 2015533195 A5 JP2015533195 A5 JP 2015533195A5
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JP
Japan
Prior art keywords
module
substrate
processing tool
substrate processing
indexed inline
Prior art date
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Application number
JP2015535693A
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English (en)
Japanese (ja)
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JP6285446B2 (ja
JP2015533195A (ja
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Priority claimed from US14/034,921 external-priority patent/US9406538B2/en
Publication of JP2015533195A publication Critical patent/JP2015533195A/ja
Publication of JP2015533195A5 publication Critical patent/JP2015533195A5/ja
Application granted granted Critical
Publication of JP6285446B2 publication Critical patent/JP6285446B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015535693A 2012-10-09 2013-09-24 割り送り式インライン基板処理ツール Expired - Fee Related JP6285446B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261711493P 2012-10-09 2012-10-09
US61/711,493 2012-10-09
US14/034,921 2013-09-24
US14/034,921 US9406538B2 (en) 2012-10-09 2013-09-24 Indexed inline substrate processing tool
PCT/US2013/061404 WO2014058612A1 (en) 2012-10-09 2013-09-24 Indexed inline substrate processing tool

Publications (3)

Publication Number Publication Date
JP2015533195A JP2015533195A (ja) 2015-11-19
JP2015533195A5 true JP2015533195A5 (enExample) 2016-11-10
JP6285446B2 JP6285446B2 (ja) 2018-02-28

Family

ID=50432986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015535693A Expired - Fee Related JP6285446B2 (ja) 2012-10-09 2013-09-24 割り送り式インライン基板処理ツール

Country Status (6)

Country Link
US (1) US9406538B2 (enExample)
JP (1) JP6285446B2 (enExample)
KR (1) KR101782874B1 (enExample)
CN (1) CN104704624B (enExample)
TW (1) TWI592513B (enExample)
WO (1) WO2014058612A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016043965A1 (en) * 2014-09-19 2016-03-24 Applied Materials, Inc. Parallel plate inline substrate processing tool
CN112135923B (zh) * 2018-06-08 2022-11-22 东芝三菱电机产业系统株式会社 成膜装置
CN113874544B (zh) * 2019-05-24 2025-06-27 应用材料公司 用于热处理的设备、基板处理系统、用于在基板处理期间支撑基板的载体、和用于感应加热在基板处理系统中的载体的方法

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