JP2015528753A5 - - Google Patents
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- Publication number
- JP2015528753A5 JP2015528753A5 JP2015515596A JP2015515596A JP2015528753A5 JP 2015528753 A5 JP2015528753 A5 JP 2015528753A5 JP 2015515596 A JP2015515596 A JP 2015515596A JP 2015515596 A JP2015515596 A JP 2015515596A JP 2015528753 A5 JP2015528753 A5 JP 2015528753A5
- Authority
- JP
- Japan
- Prior art keywords
- base film
- functional thin
- thin film
- heat
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 16
- 239000010409 thin film Substances 0.000 claims 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 6
- 239000011247 coating layer Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 229920006015 heat resistant resin Polymers 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- -1 polyethylene terephthalate Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052787 antimony Inorganic materials 0.000 claims 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 2
- 229910052785 arsenic Inorganic materials 0.000 claims 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 2
- 229910052793 cadmium Inorganic materials 0.000 claims 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 2
- 239000002041 carbon nanotube Substances 0.000 claims 2
- 229910017052 cobalt Inorganic materials 0.000 claims 2
- 239000010941 cobalt Substances 0.000 claims 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 229910052732 germanium Inorganic materials 0.000 claims 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910021389 graphene Inorganic materials 0.000 claims 2
- 229910002804 graphite Inorganic materials 0.000 claims 2
- 239000010439 graphite Substances 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229920000548 poly(silane) polymer Polymers 0.000 claims 2
- 229910052711 selenium Inorganic materials 0.000 claims 2
- 239000011669 selenium Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 229910052714 tellurium Inorganic materials 0.000 claims 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims 2
- 229910052716 thallium Inorganic materials 0.000 claims 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 2
- 229910001887 tin oxide Inorganic materials 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- 239000011701 zinc Substances 0.000 claims 2
- 239000011787 zinc oxide Substances 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000002296 dynamic light scattering Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims 1
- 229920003050 poly-cycloolefin Polymers 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 239000011112 polyethylene naphthalate Substances 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000191 poly(N-vinyl pyrrolidone) Polymers 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000728 polyester Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261655644P | 2012-06-05 | 2012-06-05 | |
| US61/655,644 | 2012-06-05 | ||
| PCT/IB2013/001254 WO2013182896A1 (en) | 2012-06-05 | 2013-05-31 | Substrate film and sintering method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015528753A JP2015528753A (ja) | 2015-10-01 |
| JP2015528753A5 true JP2015528753A5 (https=) | 2016-07-21 |
| JP6258303B2 JP6258303B2 (ja) | 2018-01-10 |
Family
ID=49711481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015515596A Active JP6258303B2 (ja) | 2012-06-05 | 2013-05-31 | 光照射による加熱焼成用の樹脂基材フィルム、基板及び加熱焼成方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9631283B2 (https=) |
| EP (1) | EP2855148B1 (https=) |
| JP (1) | JP6258303B2 (https=) |
| KR (3) | KR102122749B1 (https=) |
| CN (1) | CN104797419B (https=) |
| WO (1) | WO2013182896A1 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10000411B2 (en) | 2010-01-16 | 2018-06-19 | Cardinal Cg Company | Insulating glass unit transparent conductivity and low emissivity coating technology |
| US10000965B2 (en) | 2010-01-16 | 2018-06-19 | Cardinal Cg Company | Insulating glass unit transparent conductive coating technology |
| US10060180B2 (en) | 2010-01-16 | 2018-08-28 | Cardinal Cg Company | Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology |
| JP5275498B1 (ja) * | 2012-07-03 | 2013-08-28 | 石原薬品株式会社 | 導電膜形成方法及び焼結進行剤 |
| JP6441212B2 (ja) * | 2013-03-29 | 2018-12-19 | 太陽ホールディングス株式会社 | 光焼成用熱可塑性樹脂フィルム基材、これを用いた導電回路基板およびその製造方法 |
| EP3122542B1 (en) * | 2014-03-28 | 2019-06-05 | Ez Print, LLC | 3d print bed having permanent coating |
| WO2017073967A1 (ko) * | 2015-10-26 | 2017-05-04 | 한국기계연구원 | 광소결을 이용한 패턴 형성 장치 및 이를 이용한 패턴 형성 방법 |
| CN209440968U (zh) * | 2015-12-24 | 2019-09-27 | 株式会社村田制作所 | 树脂片 |
| JP2017216303A (ja) * | 2016-05-30 | 2017-12-07 | 株式会社リコー | 回路部材用基材、回路部材、回路部材用基材の製造方法、及び回路部材の製造方法 |
| EP3543214A4 (en) * | 2016-11-17 | 2019-11-27 | Nippon Chemical Industrial Co., Ltd. | COPPER OXIDE PARTICLES, PRODUCTION METHOD THEREFOR, PHOTOSINTERA COMPOSITION, METHOD FOR PRODUCING A CONDUCTIVE FILM THEREFOR AND COPPER OXIDE PARTICLE PASTE |
| CN109426397B (zh) * | 2017-08-22 | 2020-08-04 | 京东方科技集团股份有限公司 | 触控结构的制备方法、触控结构 |
| US11028012B2 (en) | 2018-10-31 | 2021-06-08 | Cardinal Cg Company | Low solar heat gain coatings, laminated glass assemblies, and methods of producing same |
| US11267763B2 (en) | 2019-05-17 | 2022-03-08 | Raytheon Technologies Corporation | Rapid processing of laminar composite components |
| DE102019114806A1 (de) * | 2019-06-03 | 2020-12-03 | Value & Intellectual Properties Management Gmbh | Verfahren zur Herstellung elektrischer oder elektronischer Bauteile oder Schaltungen auf einem flexiblen flächigen Träger |
| JP7344297B2 (ja) * | 2019-07-31 | 2023-09-13 | 株式会社Fuji | ３次元積層造形による回路配線の製造方法 |
| WO2021044986A1 (ja) * | 2019-09-05 | 2021-03-11 | 株式会社Adeka | 重合性組成物、被覆構造体の製造方法、被覆構造体及び被覆材 |
| CN110577771A (zh) * | 2019-09-17 | 2019-12-17 | 宁波石墨烯创新中心有限公司 | 一种导电油墨、rfid天线和电子标签及制备方法 |
| US11996384B2 (en) | 2020-12-15 | 2024-05-28 | Pulseforge, Inc. | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications |
| JP2023017150A (ja) * | 2021-07-26 | 2023-02-07 | 株式会社リコー | 導体の製造方法、導体の製造装置、及び構造体 |
| EP4274391A1 (en) | 2022-05-06 | 2023-11-08 | Ecole Polytechnique Federale De Lausanne (Epfl) | Method for manufacturing an electrically conductive metal trace and corresponding metal trace, particularly suitable for transient electronic devices |
| JP2024001439A (ja) * | 2022-06-22 | 2024-01-10 | 石原ケミカル株式会社 | 回路基板、ｒｆタグ、及び回路基板作製方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4147639B2 (ja) | 1998-09-29 | 2008-09-10 | 宇部興産株式会社 | フレキシブル金属箔積層体 |
| US7394663B2 (en) * | 2003-02-18 | 2008-07-01 | Matsushita Electric Industrial Co., Ltd. | Electronic component built-in module and method of manufacturing the same |
| US20060257625A1 (en) | 2003-09-10 | 2006-11-16 | Yasuhiro Wakizaka | Resin composite film |
| JP2005203396A (ja) | 2004-01-13 | 2005-07-28 | Toshiba Corp | 電子部品の製造装置、電子部品の製造方法および電子部品 |
| US7820097B2 (en) | 2004-11-24 | 2010-10-26 | Ncc Nano, Llc | Electrical, plating and catalytic uses of metal nanomaterial compositions |
| US8945686B2 (en) | 2007-05-24 | 2015-02-03 | Ncc | Method for reducing thin films on low temperature substrates |
| CN101605658B (zh) * | 2007-02-14 | 2012-10-03 | 东丽株式会社 | 易粘合性叠层热塑性树脂膜 |
| US10231344B2 (en) | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
| EP2172337A4 (en) * | 2007-07-31 | 2012-04-25 | Techno Polymer Co Ltd | LAYER PRODUCT |
| US7833683B2 (en) | 2007-08-14 | 2010-11-16 | Xerox Corporation | Photosensitive member having an overcoat |
| US8410712B2 (en) * | 2008-07-09 | 2013-04-02 | Ncc Nano, Llc | Method and apparatus for curing thin films on low-temperature substrates at high speeds |
| KR100999506B1 (ko) * | 2008-09-09 | 2010-12-09 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
| KR100999921B1 (ko) | 2008-09-26 | 2010-12-13 | 삼성전기주식회사 | 기판의 이중 표면 처리 방법 및 상기 방법에 의해 표면 처리된 기판 |
| CA2740618C (en) * | 2008-10-17 | 2016-01-12 | Ncc Nano, Llc | Method for reducing thin films on low temperature substrates |
| WO2012011491A1 (ja) * | 2010-07-22 | 2012-01-26 | パナソニック電工株式会社 | 導電性フィルム |
| JP5608491B2 (ja) * | 2010-09-13 | 2014-10-15 | 東芝テック株式会社 | 導電パターンの形成方法および印刷物 |
| JP5880100B2 (ja) * | 2012-02-10 | 2016-03-08 | コニカミノルタ株式会社 | 透明電極の製造方法 |
| JP5849834B2 (ja) * | 2012-04-09 | 2016-02-03 | コニカミノルタ株式会社 | 透明電極、透明電極の製造方法、及び該透明電極を用いた有機電子素子 |
-
2013
- 2013-05-31 KR KR1020197017474A patent/KR102122749B1/ko active Active
- 2013-05-31 WO PCT/IB2013/001254 patent/WO2013182896A1/en not_active Ceased
- 2013-05-31 KR KR1020147034282A patent/KR20150016552A/ko not_active Ceased
- 2013-05-31 US US14/405,662 patent/US9631283B2/en active Active
- 2013-05-31 JP JP2015515596A patent/JP6258303B2/ja active Active
- 2013-05-31 KR KR1020177004747A patent/KR20170023202A/ko not_active Ceased
- 2013-05-31 CN CN201380029777.4A patent/CN104797419B/zh active Active
- 2013-05-31 EP EP13799914.0A patent/EP2855148B1/en active Active
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