JP2015506061A5 - - Google Patents

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Publication number
JP2015506061A5
JP2015506061A5 JP2014544724A JP2014544724A JP2015506061A5 JP 2015506061 A5 JP2015506061 A5 JP 2015506061A5 JP 2014544724 A JP2014544724 A JP 2014544724A JP 2014544724 A JP2014544724 A JP 2014544724A JP 2015506061 A5 JP2015506061 A5 JP 2015506061A5
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JP
Japan
Prior art keywords
weight
polyester resin
metal composition
conductive metal
thermoplastic polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014544724A
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English (en)
Japanese (ja)
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JP2015506061A (ja
JP6329079B2 (ja
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Publication date
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Priority claimed from PCT/US2012/036667 external-priority patent/WO2013081664A1/en
Publication of JP2015506061A publication Critical patent/JP2015506061A/ja
Publication of JP2015506061A5 publication Critical patent/JP2015506061A5/ja
Application granted granted Critical
Publication of JP6329079B2 publication Critical patent/JP6329079B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014544724A 2011-12-02 2012-05-04 導電性金属組成物 Expired - Fee Related JP6329079B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161566174P 2011-12-02 2011-12-02
US61/566,174 2011-12-02
PCT/US2012/036667 WO2013081664A1 (en) 2011-12-02 2012-05-04 Conductive metal composition

Publications (3)

Publication Number Publication Date
JP2015506061A JP2015506061A (ja) 2015-02-26
JP2015506061A5 true JP2015506061A5 (https=) 2015-06-25
JP6329079B2 JP6329079B2 (ja) 2018-05-23

Family

ID=46085242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014544724A Expired - Fee Related JP6329079B2 (ja) 2011-12-02 2012-05-04 導電性金属組成物

Country Status (5)

Country Link
US (1) US9245664B2 (https=)
EP (1) EP2785792B1 (https=)
JP (1) JP6329079B2 (https=)
CN (1) CN103958603B (https=)
WO (1) WO2013081664A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
US9374907B2 (en) 2013-06-24 2016-06-21 Xerox Corporation Method of improving sheet resistivity of printed conductive inks
CN105579533B (zh) * 2013-08-16 2020-04-14 汉高知识产权控股有限责任公司 亚微米银颗粒油墨组合物、方法和用途
JP6845015B2 (ja) * 2014-05-30 2021-03-17 エレクトロニンクス ライタブルズ， インコーポレイテッド 基材上に形成されたローラーボールペンおよび導電性トレースのための導電性インク
EP2966124A1 (en) 2014-07-09 2016-01-13 Heraeus Deutschland GmbH & Co. KG Electro-conductive paste with characteristic weight loss for low temperature application
WO2016063931A1 (ja) * 2014-10-24 2016-04-28 ナミックス株式会社 導電性組成物及びそれを用いた電子部品
US9637648B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a solderable polymer thick film copper conductor composition
US9637647B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a polymer thick film copper conductor composition
CN109690698A (zh) 2016-09-16 2019-04-26 株式会社则武 柔性基板用银糊
WO2018051831A1 (ja) 2016-09-16 2018-03-22 株式会社ノリタケカンパニーリミテド 樹脂基板用銀ペースト
EP3630376B1 (en) * 2017-05-23 2024-03-27 Alpha Assembly Solutions Inc. Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures
US11239004B2 (en) 2018-03-30 2022-02-01 Panasonic Intellectual Property Management Co., Ltd. Conductive resin composition and conductive structure using same
JP7426592B2 (ja) 2019-03-27 2024-02-02 パナソニックＩｐマネジメント株式会社 伸縮性回路基板
GB2585844B (en) * 2019-07-16 2022-04-20 Paragraf Ltd Method of forming conductive contacts on graphene
EP3796404B1 (en) * 2019-09-19 2021-12-01 Karlsruher Institut für Technologie Ag-se-based n-type thermoelectric material and flexible printed thermoelectric generator comprising the same

Family Cites Families (20)

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DE3804831C1 (en) * 1988-02-17 1989-07-20 Degussa Ag, 6000 Frankfurt, De Electroconductive coating composition for the contacting of solar cells
JPH11150135A (ja) 1997-11-17 1999-06-02 Nec Corp 熱伝導性が良好な導電性ペースト及び電子部品
JP2005166322A (ja) * 2003-11-28 2005-06-23 Kyocera Chemical Corp 導電性ペースト及び圧電振動子
JP3858902B2 (ja) 2004-03-03 2006-12-20 住友電気工業株式会社 導電性銀ペーストおよびその製造方法
JP2005347038A (ja) * 2004-06-01 2005-12-15 Nandei Electronics:Kk 細線形成用金属ペースト
US8143326B2 (en) * 2004-09-28 2012-03-27 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
JP4487143B2 (ja) * 2004-12-27 2010-06-23 ナミックス株式会社 銀微粒子及びその製造方法並びに導電ペースト及びその製造方法
JP5023506B2 (ja) * 2005-02-28 2012-09-12 Ｄｉｃ株式会社 導電性塗料の製造方法
JP4943435B2 (ja) * 2005-08-24 2012-05-30 アー、エム、ランプ、ウント、コンパニー、ゲーエムベーハー 導電性被覆を有する物品の製造方法
JP4935175B2 (ja) * 2006-04-28 2012-05-23 東洋インキＳｃホールディングス株式会社 金属微粒子分散体およびその製造方法
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CN101697292B (zh) 2009-10-27 2011-06-15 彩虹集团公司 一种低温固化导电浆料的制备方法
WO2011083813A1 (ja) * 2010-01-08 2011-07-14 東洋紡績株式会社 導電性ペーストおよび金属薄膜
JP4832615B1 (ja) * 2010-11-01 2011-12-07 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法

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