CN103958603B - 导电金属组合物 - Google Patents

导电金属组合物 Download PDF

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Publication number
CN103958603B
CN103958603B CN201280058062.7A CN201280058062A CN103958603B CN 103958603 B CN103958603 B CN 103958603B CN 201280058062 A CN201280058062 A CN 201280058062A CN 103958603 B CN103958603 B CN 103958603B
Authority
CN
China
Prior art keywords
weight
conductive metal
metal composition
substrate
thermoplastic polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280058062.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103958603A (zh
Inventor
D·柯克
D·辉
M·斯维特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronics Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN103958603A publication Critical patent/CN103958603A/zh
Application granted granted Critical
Publication of CN103958603B publication Critical patent/CN103958603B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Electric Cables (AREA)
CN201280058062.7A 2011-12-02 2012-05-04 导电金属组合物 Expired - Fee Related CN103958603B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161566174P 2011-12-02 2011-12-02
US61/566,174 2011-12-02
PCT/US2012/036667 WO2013081664A1 (en) 2011-12-02 2012-05-04 Conductive metal composition

Publications (2)

Publication Number Publication Date
CN103958603A CN103958603A (zh) 2014-07-30
CN103958603B true CN103958603B (zh) 2016-09-21

Family

ID=46085242

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280058062.7A Expired - Fee Related CN103958603B (zh) 2011-12-02 2012-05-04 导电金属组合物

Country Status (5)

Country Link
US (1) US9245664B2 (https=)
EP (1) EP2785792B1 (https=)
JP (1) JP6329079B2 (https=)
CN (1) CN103958603B (https=)
WO (1) WO2013081664A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
US9374907B2 (en) 2013-06-24 2016-06-21 Xerox Corporation Method of improving sheet resistivity of printed conductive inks
CN105579533B (zh) * 2013-08-16 2020-04-14 汉高知识产权控股有限责任公司 亚微米银颗粒油墨组合物、方法和用途
JP6845015B2 (ja) * 2014-05-30 2021-03-17 エレクトロニンクス ライタブルズ， インコーポレイテッド 基材上に形成されたローラーボールペンおよび導電性トレースのための導電性インク
EP2966124A1 (en) 2014-07-09 2016-01-13 Heraeus Deutschland GmbH & Co. KG Electro-conductive paste with characteristic weight loss for low temperature application
WO2016063931A1 (ja) * 2014-10-24 2016-04-28 ナミックス株式会社 導電性組成物及びそれを用いた電子部品
US9637648B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a solderable polymer thick film copper conductor composition
US9637647B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a polymer thick film copper conductor composition
CN109690698A (zh) 2016-09-16 2019-04-26 株式会社则武 柔性基板用银糊
WO2018051831A1 (ja) 2016-09-16 2018-03-22 株式会社ノリタケカンパニーリミテド 樹脂基板用銀ペースト
EP3630376B1 (en) * 2017-05-23 2024-03-27 Alpha Assembly Solutions Inc. Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures
US11239004B2 (en) 2018-03-30 2022-02-01 Panasonic Intellectual Property Management Co., Ltd. Conductive resin composition and conductive structure using same
JP7426592B2 (ja) 2019-03-27 2024-02-02 パナソニックＩｐマネジメント株式会社 伸縮性回路基板
GB2585844B (en) * 2019-07-16 2022-04-20 Paragraf Ltd Method of forming conductive contacts on graphene
EP3796404B1 (en) * 2019-09-19 2021-12-01 Karlsruher Institut für Technologie Ag-se-based n-type thermoelectric material and flexible printed thermoelectric generator comprising the same

Family Cites Families (20)

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DE3804831C1 (en) * 1988-02-17 1989-07-20 Degussa Ag, 6000 Frankfurt, De Electroconductive coating composition for the contacting of solar cells
JPH11150135A (ja) 1997-11-17 1999-06-02 Nec Corp 熱伝導性が良好な導電性ペースト及び電子部品
JP2005166322A (ja) * 2003-11-28 2005-06-23 Kyocera Chemical Corp 導電性ペースト及び圧電振動子
JP3858902B2 (ja) 2004-03-03 2006-12-20 住友電気工業株式会社 導電性銀ペーストおよびその製造方法
JP2005347038A (ja) * 2004-06-01 2005-12-15 Nandei Electronics:Kk 細線形成用金属ペースト
US8143326B2 (en) * 2004-09-28 2012-03-27 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
JP4487143B2 (ja) * 2004-12-27 2010-06-23 ナミックス株式会社 銀微粒子及びその製造方法並びに導電ペースト及びその製造方法
JP5023506B2 (ja) * 2005-02-28 2012-09-12 Ｄｉｃ株式会社 導電性塗料の製造方法
JP4943435B2 (ja) * 2005-08-24 2012-05-30 アー、エム、ランプ、ウント、コンパニー、ゲーエムベーハー 導電性被覆を有する物品の製造方法
JP4935175B2 (ja) * 2006-04-28 2012-05-23 東洋インキＳｃホールディングス株式会社 金属微粒子分散体およびその製造方法
JP5126567B2 (ja) * 2006-04-13 2013-01-23 福田金属箔粉工業株式会社 導電塗料
TWI329323B (en) * 2006-04-21 2010-08-21 Kwo Kung Ming Method of fabricating conductive paste for conductive substrate or conductive film
US8344523B2 (en) * 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
JP5119851B2 (ja) * 2007-10-16 2013-01-16 大日本印刷株式会社 電磁波シールド部材
JP2010047649A (ja) * 2008-08-19 2010-03-04 Toyo Ink Mfg Co Ltd 導電性インキ及びこれを用いてスクリーン印刷により形成された導電回路
KR101133466B1 (ko) 2008-09-08 2012-04-09 주식회사 에프피 태양전지용 저온 건조형 전극 페이스트 조성물 및 이를 이용한 인쇄방법
JP2011034890A (ja) * 2009-08-04 2011-02-17 Sumitomo Rubber Ind Ltd 導電性ペーストとそれを用いた導電機能部材の製造方法
CN101697292B (zh) 2009-10-27 2011-06-15 彩虹集团公司 一种低温固化导电浆料的制备方法
WO2011083813A1 (ja) * 2010-01-08 2011-07-14 東洋紡績株式会社 導電性ペーストおよび金属薄膜
JP4832615B1 (ja) * 2010-11-01 2011-12-07 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法

Also Published As

Publication number Publication date
JP2015506061A (ja) 2015-02-26
WO2013081664A1 (en) 2013-06-06
US9245664B2 (en) 2016-01-26
CN103958603A (zh) 2014-07-30
EP2785792B1 (en) 2015-08-12
EP2785792A1 (en) 2014-10-08
JP6329079B2 (ja) 2018-05-23
US20130142963A1 (en) 2013-06-06

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20221118

Address after: Delaware

Patentee after: DuPont Electronics

Address before: Delaware

Patentee before: E.I. Nemours DuPont

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160921

CF01 Termination of patent right due to non-payment of annual fee