JP7426592B2 - 伸縮性回路基板 - Google Patents
伸縮性回路基板 Download PDFInfo
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- JP7426592B2 JP7426592B2 JP2021509582A JP2021509582A JP7426592B2 JP 7426592 B2 JP7426592 B2 JP 7426592B2 JP 2021509582 A JP2021509582 A JP 2021509582A JP 2021509582 A JP2021509582 A JP 2021509582A JP 7426592 B2 JP7426592 B2 JP 7426592B2
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
伸縮性絶縁層と、配線とを備え、
前記配線は、その主要部を構成する金属配線部と、該金属配線部に付随的に配置された導電性伸縮部との組合せで構成されていることを特徴とする。
まず、本実施形態の伸縮性回路基板の基本構成について説明する。本実施形態の伸縮性回路基板は、図1にその一例を示すように、伸縮性絶縁層1と、配線3とを備える。そして、図1に示すように、前記配線3は、その主要部を構成する金属配線部6と、該金属配線部6に付随的に配置された導電性伸縮部2との組合せで構成されている、具体的には、前記配線3の一部が導電性伸縮材料により構成される、前記導電性伸縮部2で構成されているか、前記配線3の一部が前記導電性伸縮部2で補強されているか、もしくはその両方であることを特徴とする。
次に、本実施形態の伸縮性回路基板の変形例を、図面を用いていくつか説明するが、本実施形態はこれらに限定されるわけではない。
本実施形態における伸縮性絶縁層は、伸縮性を有する絶縁層であれば特に限定はない。
本実施形態で用いられる伸張-復元試験では、樹脂組成物の硬化物片(厚み:50μm、サンプル形状:ダンベル6号(測定部位幅:4mm、平行部分長さ:25mm))を用いて、ISO3384に準拠した引張-圧縮試験機(例えば、島津製作所製のオートグラフ(型式:AGS-X))を用いて、下記条件で伸張行程を行った後に復元行程を行い、下記算出方法によって応力緩和率R及び残留歪み率αを計算する。
試験片をつかみ具に取り付けたときに発生するたわみを除去するために、たわみ補正を0.05N以下の力で行う。
試験速度:25mm/min、0~25%伸張まで
温度条件:23℃
伸張・保持条件:25%伸張で、保持時間5分
試験速度:0.1mm/min、引張力が0±0.05Nになるまで
温度条件:23℃
0.1≦(FB(t30)/FB0)≦0.7
を満たす樹脂組成物であることが望ましい。
樹脂組成物の硬化物片(厚み:50μm、サンプル形状:ダンベル6号(測定部位幅:4mm、平行部分長さ:25mm))を用いて、ISO3384に準拠した引張-圧縮試験機で、下記条件で伸張行程を行い、伸張終了時の引張力の測定を行い、これを初期引張力FB0とする。その後、30分後に引張力FB(t30)を測定する。
試験片をつかみ具に取り付けたときに発生するたわみを除去するために、たわみ補正を行う。たわみ補正は、0.05N以下の力で行う。
試験速度:25mm/min、50%伸張まで
温度条件:23℃
伸張・保持条件:50%伸張で、保持時間30分
本実施形態において、金属配線部及び金属層は、一般的な回路基板の配線やパッド部などを形成することに使用される各種金属箔や、金属インク、スパッタ等を特に限定なく使用することができる。
本実施形態の導電性伸縮部としては、導電性と伸縮性を兼ね備えた部材であれば特に限定なく使用できるが、例えば、伸縮性を有する導電性組成物によって形成されていてもよく、例えば硬化物が伸縮性を有する樹脂組成物をバインダーとした導電ペーストを用いることができる。また、前記導電性伸縮部には、液体金属を用いることができる。
前記導電性組成物中の各成分の割合は、本発明の効果を発揮し得る限り特に制限はなく、前記(F)樹脂:前記(G)硬化剤の配合割合は、樹脂と硬化剤の種類によって、当量比などを考慮して適宜決めることが可能である。
本実施形態の導電性組成物または液体金属を、上述したような伸縮性絶縁層、金属配線部または金属層上に塗布または印刷すること等によって、導電性組成物の塗膜を形成し、所望の箇所に導電性伸縮部(架橋部)を形成することができる。
Claims (6)
- 伸縮性絶縁層と、配線とを備え、
前記配線は、その主要部を構成する金属配線部と、該金属配線部に付随的に配置された導電性伸縮部との組合せで構成されており、
前記金属配線部は直線または曲線形状を有している、
伸縮性回路基板。 - 前記配線がミアンダ配線である、請求項1に記載の伸縮性回路基板。
- さらにパッド部を備え、
前記配線と前記パッド部との接続部が、該接続部に付随的に配置された前記導電性伸縮部で構成されている、請求項1に記載の伸縮性回路基板。 - さらにパッド部を備え、
前記パッド部は、その主要部を構成する金属層と、該金属層に付随的に配置された前記導電性伸縮部で構成される、請求項1に記載の伸縮性回路基板。 - 前記伸縮性絶縁層の両面に前記配線を備え、片面に形成された配線ともう一方の面に形成された配線との架橋が、前記導電性伸縮部で構成されている、請求項1~4のいずれかに記載の伸縮性回路基板。
- 前記導電性伸縮部が導電ペーストまたは液体金属で形成されている、請求項1~5のいずれかに記載の伸縮性回路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019061651 | 2019-03-27 | ||
JP2019061651 | 2019-03-27 | ||
PCT/JP2020/013644 WO2020196745A1 (ja) | 2019-03-27 | 2020-03-26 | 伸縮性回路基板 |
Publications (2)
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JP2017118109A (ja) | 2015-12-21 | 2017-06-29 | パナソニックIpマネジメント株式会社 | 基板 |
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TWI370714B (en) * | 2008-01-09 | 2012-08-11 | Ind Tech Res Inst | Circuit structure and menufacturing method thereof |
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JP2020088271A (ja) * | 2018-11-29 | 2020-06-04 | 株式会社ジャパンディスプレイ | フレキシブル基板 |
TWI788740B (zh) * | 2020-12-09 | 2023-01-01 | 財團法人工業技術研究院 | 可拉伸電路和可拉伸電路佈局方法 |
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US20040192082A1 (en) | 2003-03-28 | 2004-09-30 | Sigurd Wagner | Stretchable and elastic interconnects |
US20120051005A1 (en) | 2009-01-30 | 2012-03-01 | Universiteit Gent | Stretchable electronic device |
US20120052268A1 (en) | 2009-01-30 | 2012-03-01 | Universiteit Gent | Stretchable electronic device |
JP2015517209A (ja) | 2012-03-30 | 2015-06-18 | ノキア コーポレイション | 変形可能な装置および方法 |
US20140299362A1 (en) | 2013-04-04 | 2014-10-09 | Electronics And Telecommunications Research Institute | Stretchable electric device and manufacturing method thereof |
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US20220167497A1 (en) | 2022-05-26 |
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