JP2015521368A5 - - Google Patents
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- Publication number
- JP2015521368A5 JP2015521368A5 JP2015507019A JP2015507019A JP2015521368A5 JP 2015521368 A5 JP2015521368 A5 JP 2015521368A5 JP 2015507019 A JP2015507019 A JP 2015507019A JP 2015507019 A JP2015507019 A JP 2015507019A JP 2015521368 A5 JP2015521368 A5 JP 2015521368A5
- Authority
- JP
- Japan
- Prior art keywords
- transparent plate
- transparent
- energy
- transparent sheet
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261635136P | 2012-04-18 | 2012-04-18 | |
| US61/635,136 | 2012-04-18 | ||
| PCT/US2013/033441 WO2013158335A1 (en) | 2012-04-18 | 2013-03-22 | Apparatus and method to reduce particles in advance anneal process |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018026659A Division JP6526855B6 (ja) | 2012-04-18 | 2018-02-19 | アドバンスアニールプロセスにおいて粒子を低減させる装置および方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015521368A JP2015521368A (ja) | 2015-07-27 |
| JP2015521368A5 true JP2015521368A5 (enExample) | 2016-05-19 |
Family
ID=49380495
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015507019A Pending JP2015521368A (ja) | 2012-04-18 | 2013-03-22 | アドバンスアニールプロセスにおいて粒子を低減させる装置および方法 |
| JP2018026659A Active JP6526855B6 (ja) | 2012-04-18 | 2018-02-19 | アドバンスアニールプロセスにおいて粒子を低減させる装置および方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018026659A Active JP6526855B6 (ja) | 2012-04-18 | 2018-02-19 | アドバンスアニールプロセスにおいて粒子を低減させる装置および方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9214346B2 (enExample) |
| JP (2) | JP2015521368A (enExample) |
| KR (1) | KR102108939B1 (enExample) |
| CN (2) | CN107579022B (enExample) |
| SG (1) | SG11201405535PA (enExample) |
| TW (1) | TWI622099B (enExample) |
| WO (1) | WO2013158335A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201517133A (zh) * | 2013-10-07 | 2015-05-01 | Applied Materials Inc | 使用熱佈植與奈秒退火致使銦鋁鎵氮化物材料系統中摻雜劑的高活化 |
| CN109427541A (zh) * | 2017-08-29 | 2019-03-05 | 中芯国际集成电路制造(北京)有限公司 | 半导体器件的形成方法 |
| CA3088725A1 (en) * | 2018-01-19 | 2019-07-25 | Ncc Nano, Llc | Method for curing solder paste on a thermally fragile substrate |
| JP7108185B2 (ja) * | 2018-11-22 | 2022-07-28 | 富士通株式会社 | 最適化装置および最適化装置の制御方法 |
| WO2024042364A1 (en) * | 2022-08-24 | 2024-02-29 | Rockley Photonics Limited | Wearable module |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4131363A (en) * | 1977-12-05 | 1978-12-26 | International Business Machines Corporation | Pellicle cover for projection printing system |
| JPS59137789A (ja) * | 1983-01-27 | 1984-08-07 | Matsushita Electric Ind Co Ltd | 潜熱型蓄熱装置 |
| JPH06100825B2 (ja) * | 1985-08-29 | 1994-12-12 | 富士通株式会社 | パタ−ン形成方法 |
| JPH0444309A (ja) * | 1990-06-12 | 1992-02-14 | Seiko Epson Corp | 投影露光方法及び半導体装置の製造方法 |
| JPH04174846A (ja) * | 1990-11-08 | 1992-06-23 | Matsushita Electron Corp | マスク保護部材 |
| JP3149450B2 (ja) * | 1991-04-04 | 2001-03-26 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法及び製造装置 |
| JPH04370925A (ja) * | 1991-06-20 | 1992-12-24 | Hitachi Ltd | レーザアニール用マスク並びにレーザアニール方法及び装置 |
| JPH06140304A (ja) * | 1992-10-29 | 1994-05-20 | Nikon Corp | 投影露光装置 |
| JPH0866790A (ja) * | 1994-08-30 | 1996-03-12 | Sony Corp | レーザ加工装置 |
| US5576125A (en) | 1995-07-27 | 1996-11-19 | Micro Lithography, Inc. | Method for making an optical pellicle |
| JPH09260257A (ja) * | 1996-03-26 | 1997-10-03 | Canon Inc | レンズ汚染を防止した投影露光装置およびそれを用いた半導体デバイス製造プロセス |
| US5793836A (en) * | 1996-09-06 | 1998-08-11 | International Business Machines Corporation | X-ray mask pellicle |
| TW445545B (en) * | 1999-03-10 | 2001-07-11 | Mitsubishi Electric Corp | Laser heat treatment method, laser heat treatment apparatus and semiconductor device |
| JP3562389B2 (ja) * | 1999-06-25 | 2004-09-08 | 三菱電機株式会社 | レーザ熱処理装置 |
| JP2001023918A (ja) * | 1999-07-08 | 2001-01-26 | Nec Corp | 半導体薄膜形成装置 |
| JP4841740B2 (ja) | 2000-04-26 | 2011-12-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| DE60119026T2 (de) * | 2000-06-01 | 2006-11-30 | Asahi Glass Co., Ltd. | Membranabdeckung und Verfahren zu deren Verwendung |
| US6792029B2 (en) * | 2002-03-27 | 2004-09-14 | Sharp Laboratories Of America, Inc. | Method of suppressing energy spikes of a partially-coherent beam |
| US6829035B2 (en) | 2002-11-12 | 2004-12-07 | Applied Materials Israel, Ltd. | Advanced mask cleaning and handling |
| SG129265A1 (en) * | 2002-11-29 | 2007-02-26 | Semiconductor Energy Lab | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
| JP4364611B2 (ja) * | 2002-11-29 | 2009-11-18 | 株式会社半導体エネルギー研究所 | 結晶性半導体膜の作製方法 |
| US7162223B2 (en) | 2004-02-17 | 2007-01-09 | Teamon Systems, Inc. | System and method for notifying users of an event using alerts |
| JP2005277007A (ja) * | 2004-03-24 | 2005-10-06 | Hitachi Ltd | 多結晶半導体膜製造方法とその装置および画像表示パネル |
| KR100778389B1 (ko) * | 2006-02-14 | 2007-11-21 | 한국과학기술원 | 레이저를 이용한 광투과성 기판 오염물 세정 장치 및 방법 |
| US7927991B2 (en) * | 2006-08-25 | 2011-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5110830B2 (ja) * | 2006-08-31 | 2012-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8148663B2 (en) * | 2007-07-31 | 2012-04-03 | Applied Materials, Inc. | Apparatus and method of improving beam shaping and beam homogenization |
| US20090120924A1 (en) * | 2007-11-08 | 2009-05-14 | Stephen Moffatt | Pulse train annealing method and apparatus |
| US7800081B2 (en) | 2007-11-08 | 2010-09-21 | Applied Materials, Inc. | Pulse train annealing method and apparatus |
| JP2009230020A (ja) * | 2008-03-25 | 2009-10-08 | Lasertec Corp | 欠陥修正装置、欠陥修正方法、及びパターン基板の製造方法 |
| US7473501B1 (en) | 2008-03-30 | 2009-01-06 | International Business Machines Corporation | Method for reducing photo-mask distortion |
| US20100124709A1 (en) * | 2008-11-20 | 2010-05-20 | Daniel Warren Hawtof | Image mask assembly for photolithography |
| US8432613B2 (en) | 2009-04-21 | 2013-04-30 | Applied Materials, Inc. | Multi-stage optical homogenization |
| US8569187B2 (en) * | 2011-06-24 | 2013-10-29 | Applied Materials, Inc. | Thermal processing apparatus |
-
2013
- 2013-03-22 SG SG11201405535PA patent/SG11201405535PA/en unknown
- 2013-03-22 KR KR1020147030256A patent/KR102108939B1/ko active Active
- 2013-03-22 CN CN201710619013.0A patent/CN107579022B/zh active Active
- 2013-03-22 WO PCT/US2013/033441 patent/WO2013158335A1/en not_active Ceased
- 2013-03-22 JP JP2015507019A patent/JP2015521368A/ja active Pending
- 2013-03-22 US US13/849,097 patent/US9214346B2/en not_active Expired - Fee Related
- 2013-03-22 CN CN201380012265.7A patent/CN104160489A/zh active Pending
- 2013-03-25 TW TW102110524A patent/TWI622099B/zh active
-
2018
- 2018-02-19 JP JP2018026659A patent/JP6526855B6/ja active Active
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