KR102108939B1 - 발전된 어닐링 프로세스에서 입자를 감소시키기 위한 장치 및 방법 - Google Patents

발전된 어닐링 프로세스에서 입자를 감소시키기 위한 장치 및 방법 Download PDF

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KR102108939B1
KR102108939B1 KR1020147030256A KR20147030256A KR102108939B1 KR 102108939 B1 KR102108939 B1 KR 102108939B1 KR 1020147030256 A KR1020147030256 A KR 1020147030256A KR 20147030256 A KR20147030256 A KR 20147030256A KR 102108939 B1 KR102108939 B1 KR 102108939B1
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energy
transparent
substrate
pulses
pulse
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KR20150003769A (ko
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아미캄 사데
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Beam Processing (AREA)
KR1020147030256A 2012-04-18 2013-03-22 발전된 어닐링 프로세스에서 입자를 감소시키기 위한 장치 및 방법 Active KR102108939B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261635136P 2012-04-18 2012-04-18
US61/635,136 2012-04-18
PCT/US2013/033441 WO2013158335A1 (en) 2012-04-18 2013-03-22 Apparatus and method to reduce particles in advance anneal process

Publications (2)

Publication Number Publication Date
KR20150003769A KR20150003769A (ko) 2015-01-09
KR102108939B1 true KR102108939B1 (ko) 2020-05-12

Family

ID=49380495

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KR1020147030256A Active KR102108939B1 (ko) 2012-04-18 2013-03-22 발전된 어닐링 프로세스에서 입자를 감소시키기 위한 장치 및 방법

Country Status (7)

Country Link
US (1) US9214346B2 (enExample)
JP (2) JP2015521368A (enExample)
KR (1) KR102108939B1 (enExample)
CN (2) CN107579022B (enExample)
SG (1) SG11201405535PA (enExample)
TW (1) TWI622099B (enExample)
WO (1) WO2013158335A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201517133A (zh) * 2013-10-07 2015-05-01 Applied Materials Inc 使用熱佈植與奈秒退火致使銦鋁鎵氮化物材料系統中摻雜劑的高活化
CN109427541A (zh) * 2017-08-29 2019-03-05 中芯国际集成电路制造(北京)有限公司 半导体器件的形成方法
CA3088725A1 (en) * 2018-01-19 2019-07-25 Ncc Nano, Llc Method for curing solder paste on a thermally fragile substrate
JP7108185B2 (ja) * 2018-11-22 2022-07-28 富士通株式会社 最適化装置および最適化装置の制御方法
WO2024042364A1 (en) * 2022-08-24 2024-02-29 Rockley Photonics Limited Wearable module

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2002025907A (ja) 2000-04-26 2002-01-25 Semiconductor Energy Lab Co Ltd 半導体装置作製方法

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JPS59137789A (ja) * 1983-01-27 1984-08-07 Matsushita Electric Ind Co Ltd 潜熱型蓄熱装置
JPH06100825B2 (ja) * 1985-08-29 1994-12-12 富士通株式会社 パタ−ン形成方法
JPH0444309A (ja) * 1990-06-12 1992-02-14 Seiko Epson Corp 投影露光方法及び半導体装置の製造方法
JPH04174846A (ja) * 1990-11-08 1992-06-23 Matsushita Electron Corp マスク保護部材
JP3149450B2 (ja) * 1991-04-04 2001-03-26 セイコーエプソン株式会社 薄膜トランジスタの製造方法及び製造装置
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JPH0866790A (ja) * 1994-08-30 1996-03-12 Sony Corp レーザ加工装置
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JPH09260257A (ja) * 1996-03-26 1997-10-03 Canon Inc レンズ汚染を防止した投影露光装置およびそれを用いた半導体デバイス製造プロセス
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Also Published As

Publication number Publication date
CN107579022A (zh) 2018-01-12
SG11201405535PA (en) 2014-11-27
KR20150003769A (ko) 2015-01-09
CN104160489A (zh) 2014-11-19
TW201344798A (zh) 2013-11-01
JP2018117134A (ja) 2018-07-26
WO2013158335A1 (en) 2013-10-24
CN107579022B (zh) 2021-03-16
JP6526855B2 (ja) 2019-06-05
US20130280923A1 (en) 2013-10-24
US9214346B2 (en) 2015-12-15
JP2015521368A (ja) 2015-07-27
JP6526855B6 (ja) 2019-06-26
TWI622099B (zh) 2018-04-21

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