JP2015517919A5 - - Google Patents

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Publication number
JP2015517919A5
JP2015517919A5 JP2014559988A JP2014559988A JP2015517919A5 JP 2015517919 A5 JP2015517919 A5 JP 2015517919A5 JP 2014559988 A JP2014559988 A JP 2014559988A JP 2014559988 A JP2014559988 A JP 2014559988A JP 2015517919 A5 JP2015517919 A5 JP 2015517919A5
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JP
Japan
Prior art keywords
plate
mems
metal film
radiation
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014559988A
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English (en)
Japanese (ja)
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JP2015517919A (ja
JP6199322B2 (ja
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Publication date
Priority claimed from US13/405,513 external-priority patent/US8866237B2/en
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Publication of JP2015517919A publication Critical patent/JP2015517919A/ja
Publication of JP2015517919A5 publication Critical patent/JP2015517919A5/ja
Application granted granted Critical
Publication of JP6199322B2 publication Critical patent/JP6199322B2/ja
Active legal-status Critical Current
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JP2014559988A 2012-02-27 2013-02-27 制御されたキャビティｍｅｍｓパッケージを集積化ボードに埋め込むための方法 Active JP6199322B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/405,513 US8866237B2 (en) 2012-02-27 2012-02-27 Methods for embedding controlled-cavity MEMS package in integration board
US13/405,513 2012-02-27
PCT/US2013/027989 WO2013130582A1 (en) 2012-02-27 2013-02-27 Method for embedding controlled-cavity mems package in integration board

Publications (3)

Publication Number Publication Date
JP2015517919A JP2015517919A (ja) 2015-06-25
JP2015517919A5 true JP2015517919A5 (enExample) 2016-03-24
JP6199322B2 JP6199322B2 (ja) 2017-09-20

Family

ID=49001917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014559988A Active JP6199322B2 (ja) 2012-02-27 2013-02-27 制御されたキャビティｍｅｍｓパッケージを集積化ボードに埋め込むための方法

Country Status (4)

Country Link
US (2) US8866237B2 (enExample)
JP (1) JP6199322B2 (enExample)
CN (1) CN104136365B (enExample)
WO (1) WO2013130582A1 (enExample)

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DE102012208492A1 (de) * 2012-05-22 2013-11-28 Continental Teves Ag & Co. Ohg Dehnmessstreifenanordnung
US8809973B2 (en) * 2013-01-23 2014-08-19 Infineon Technologies Ag Chip package comprising a microphone structure and a method of manufacturing the same
KR101983142B1 (ko) * 2013-06-28 2019-08-28 삼성전기주식회사 반도체 패키지
DE102014105754B4 (de) * 2014-04-24 2022-02-10 USound GmbH Lautsprecheranordnung mit leiterplattenintegriertem ASIC
US10142718B2 (en) 2014-12-04 2018-11-27 Invensense, Inc. Integrated temperature sensor in microphone package
CN105845635B (zh) * 2015-01-16 2018-12-07 恒劲科技股份有限公司 电子封装结构
JP6398806B2 (ja) * 2015-03-12 2018-10-03 オムロン株式会社 センサパッケージ
US9663357B2 (en) * 2015-07-15 2017-05-30 Texas Instruments Incorporated Open cavity package using chip-embedding technology
WO2017100255A1 (en) 2015-12-08 2017-06-15 Skyworks Solutions, Inc. Method of providing protective cavity and integrated passive components in wafer-level chip-scale package using a carrier wafer
DE102016124270A1 (de) * 2016-12-13 2018-06-14 Infineon Technologies Ag Halbleiter-package und verfahren zum fertigen eines halbleiter-package
EP3363983B1 (en) * 2017-02-17 2021-10-27 VKR Holding A/S Vacuum insulated glazing unit
US10370244B2 (en) * 2017-11-30 2019-08-06 Infineon Technologies Ag Deposition of protective material at wafer level in front end for early stage particle and moisture protection
DE102018216433A1 (de) * 2018-09-26 2020-03-26 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Elektronikmoduls und Elektronikmodul
CN110010479B (zh) * 2018-10-10 2021-04-06 浙江集迈科微电子有限公司 一种射频芯片的Fan-out封装工艺
DE102019201228B4 (de) * 2019-01-31 2023-10-05 Robert Bosch Gmbh Verfahren zum Herstellen einer Mehrzahl von Sensoreinrichtungen und Sensoreinrichtung
JP7284606B2 (ja) * 2019-03-22 2023-05-31 新科實業有限公司 Ｍｅｍｓパッケージ、ｍｅｍｓマイクロフォンおよびｍｅｍｓパッケージの製造方法
CN111901731B (zh) * 2019-05-06 2022-01-07 奥音科技（北京）有限公司 电动声学换能器及其制造方法
US11289396B2 (en) * 2019-09-29 2022-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region
CN112073850B (zh) * 2020-08-27 2021-12-24 瑞声新能源发展(常州)有限公司科教城分公司 扬声器箱
US20220270960A1 (en) * 2021-02-23 2022-08-25 Texas Instruments Incorporated Open-Cavity Package for Chip Sensor
US20220415762A1 (en) * 2021-06-27 2022-12-29 Texas Instruments Incorporated Semiconductor package with drilled mold cavity
US12051655B2 (en) * 2021-07-16 2024-07-30 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of forming the same
US20230183880A1 (en) * 2021-12-15 2023-06-15 Texas Instruments Incorporated Fluid sensor package
US20230268318A1 (en) * 2022-02-18 2023-08-24 Micron Technology, Inc. Methods and assemblies for measurement and prediction of package and die strength

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JPH08204059A (ja) * 1995-01-20 1996-08-09 Kyocera Corp 半導体素子収納用パッケージ
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
DE10333840B4 (de) * 2003-07-24 2006-12-28 Infineon Technologies Ag Halbleiterbauteil mit einem Kunststoffgehäuse, das eine Umverdrahrungsstruktur aufweist und Verfahren zu deren Herstellung
JP3936365B2 (ja) * 2004-09-14 2007-06-27 ソニーケミカル＆インフォメーションデバイス株式会社 機能素子実装モジュール及びその製造方法
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US7504716B2 (en) 2005-10-26 2009-03-17 Texas Instruments Incorporated Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking
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US7655553B2 (en) * 2006-01-11 2010-02-02 Texas Instruments Incorporated Microstructure sealing tool and methods of using the same
US20080122061A1 (en) 2006-11-29 2008-05-29 Texas Instruments Incorporated Semiconductor chip embedded in an insulator and having two-way heat extraction
JP5016382B2 (ja) 2007-05-24 2012-09-05 パナソニック株式会社 センサ装置およびその製造方法
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US8309388B2 (en) 2008-04-25 2012-11-13 Texas Instruments Incorporated MEMS package having formed metal lid
US8690631B2 (en) 2008-09-12 2014-04-08 Texas Instruments Incorporated Toy building block with embedded integrated circuit
TWI508194B (zh) * 2009-01-06 2015-11-11 精材科技股份有限公司 電子元件封裝體及其製作方法
US7989249B2 (en) * 2009-02-04 2011-08-02 Northrop Grumman Systems Corporation Method of manufacturing a micro-electrical-mechanical system with thermally isolated active elements
US8338208B2 (en) 2009-12-31 2012-12-25 Texas Instruments Incorporated Micro-electro-mechanical system having movable element integrated into leadframe-based package
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