JP2015509196A5 - - Google Patents

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Publication number
JP2015509196A5
JP2015509196A5 JP2014553401A JP2014553401A JP2015509196A5 JP 2015509196 A5 JP2015509196 A5 JP 2015509196A5 JP 2014553401 A JP2014553401 A JP 2014553401A JP 2014553401 A JP2014553401 A JP 2014553401A JP 2015509196 A5 JP2015509196 A5 JP 2015509196A5
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JP
Japan
Prior art keywords
wafer
physical location
defect detection
detection methods
defect
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Application number
JP2014553401A
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English (en)
Japanese (ja)
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JP2015509196A (ja
JP6180435B2 (ja
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Priority claimed from US13/743,074 external-priority patent/US9277186B2/en
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Publication of JP2015509196A publication Critical patent/JP2015509196A/ja
Publication of JP2015509196A5 publication Critical patent/JP2015509196A5/ja
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Publication of JP6180435B2 publication Critical patent/JP6180435B2/ja
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JP2014553401A 2012-01-18 2013-01-17 ビット不良および仮想検査を用いたウェハ検査プロセスの生成 Active JP6180435B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261587911P 2012-01-18 2012-01-18
US61/587,911 2012-01-18
US13/743,074 US9277186B2 (en) 2012-01-18 2013-01-16 Generating a wafer inspection process using bit failures and virtual inspection
US13/743,074 2013-01-16
PCT/US2013/021880 WO2013109714A1 (en) 2012-01-18 2013-01-17 Generating a wafer inspection process using bit failures and virtual inspection

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017138801A Division JP6342046B2 (ja) 2012-01-18 2017-07-18 ビット不良および仮想検査を用いたウェハ検査プロセスの生成

Publications (3)

Publication Number Publication Date
JP2015509196A JP2015509196A (ja) 2015-03-26
JP2015509196A5 true JP2015509196A5 (enExample) 2016-03-03
JP6180435B2 JP6180435B2 (ja) 2017-08-16

Family

ID=48779693

Family Applications (2)

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JP2014553401A Active JP6180435B2 (ja) 2012-01-18 2013-01-17 ビット不良および仮想検査を用いたウェハ検査プロセスの生成
JP2017138801A Active JP6342046B2 (ja) 2012-01-18 2017-07-18 ビット不良および仮想検査を用いたウェハ検査プロセスの生成

Family Applications After (1)

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JP2017138801A Active JP6342046B2 (ja) 2012-01-18 2017-07-18 ビット不良および仮想検査を用いたウェハ検査プロセスの生成

Country Status (6)

Country Link
US (2) US9277186B2 (enExample)
JP (2) JP6180435B2 (enExample)
KR (2) KR102001356B1 (enExample)
CN (2) CN104137120B (enExample)
TW (1) TWI625803B (enExample)
WO (1) WO2013109714A1 (enExample)

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US20140282327A1 (en) * 2013-03-14 2014-09-18 Nvidia Corporation Cutter in diagnosis (cid) a method to improve the throughput of the yield ramp up process
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US9355208B2 (en) * 2013-07-08 2016-05-31 Kla-Tencor Corp. Detecting defects on a wafer
TWI548013B (zh) * 2014-03-04 2016-09-01 旺宏電子股份有限公司 結合實體座標之位元失效偵測方法
US9470743B2 (en) * 2014-03-04 2016-10-18 Nvidia Corporation Dynamic yield prediction
US9816939B2 (en) * 2014-07-22 2017-11-14 Kla-Tencor Corp. Virtual inspection systems with multiple modes
US10127653B2 (en) * 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
US10267746B2 (en) 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
US9830421B2 (en) * 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
US10018571B2 (en) * 2015-05-28 2018-07-10 Kla-Tencor Corporation System and method for dynamic care area generation on an inspection tool
US9916965B2 (en) * 2015-12-31 2018-03-13 Kla-Tencor Corp. Hybrid inspectors
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JP7209513B2 (ja) * 2018-11-21 2023-01-20 三菱電機株式会社 半導体チップの製造方法および半導体ウェハ
JP7404009B2 (ja) * 2019-09-19 2023-12-25 キオクシア株式会社 加工情報管理システム及び加工情報管理方法
KR102459337B1 (ko) * 2020-12-21 2022-10-28 주식회사 에타맥스 실리콘 카바이드 웨이퍼의 결함을 회피하는 다이 구획방법 및 검사장치

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CN101334414B (zh) * 2007-06-29 2011-11-30 中芯国际集成电路制造(上海)有限公司 用于晶片的缺陷检测机台的匹配方法
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JP5081590B2 (ja) * 2007-11-14 2012-11-28 株式会社日立ハイテクノロジーズ 欠陥観察分類方法及びその装置
JP6185693B2 (ja) * 2008-06-11 2017-08-23 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ ウェーハー上の設計欠陥および工程欠陥の検出、ウェーハー上の欠陥の精査、設計内の１つ以上の特徴を工程監視特徴として使用するための選択、またはそのいくつかの組み合わせのためのシステムおよび方法
US8269960B2 (en) * 2008-07-24 2012-09-18 Kla-Tencor Corp. Computer-implemented methods for inspecting and/or classifying a wafer
WO2010014609A2 (en) * 2008-07-28 2010-02-04 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8041106B2 (en) * 2008-12-05 2011-10-18 Kla-Tencor Corp. Methods and systems for detecting defects on a reticle
JP5297261B2 (ja) * 2009-04-28 2013-09-25 株式会社日立ハイテクノロジーズ 観察欠陥選択処理方法、欠陥観察方法、観察欠陥選択処理装置、欠陥観察装置
JP5604067B2 (ja) * 2009-07-31 2014-10-08 株式会社日立ハイテクノロジーズ マッチング用テンプレートの作成方法、及びテンプレート作成装置
US9087367B2 (en) * 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US9277186B2 (en) * 2012-01-18 2016-03-01 Kla-Tencor Corp. Generating a wafer inspection process using bit failures and virtual inspection

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