JP2020519017A5 - - Google Patents

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JP2020519017A5
JP2020519017A5 JP2019559038A JP2019559038A JP2020519017A5 JP 2020519017 A5 JP2020519017 A5 JP 2020519017A5 JP 2019559038 A JP2019559038 A JP 2019559038A JP 2019559038 A JP2019559038 A JP 2019559038A JP 2020519017 A5 JP2020519017 A5 JP 2020519017A5
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Japan
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wafer
interpolation
readable medium
modified
data
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JP2019559038A
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Japanese (ja)
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JP2020519017A (ja
JP6931084B2 (ja
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Priority claimed from US15/671,230 external-priority patent/US10598617B2/en
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JP2019559038A 2017-05-05 2018-05-04 光学検査結果に発する計量案内型検査サンプルシェイピング Active JP6931084B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762502459P 2017-05-05 2017-05-05
US62/502,459 2017-05-05
US15/671,230 US10598617B2 (en) 2017-05-05 2017-08-08 Metrology guided inspection sample shaping of optical inspection results
US15/671,230 2017-08-08
PCT/US2018/031002 WO2018204731A1 (en) 2017-05-05 2018-05-04 Metrology guided inspection sample shaping from optical inspection results

Publications (3)

Publication Number Publication Date
JP2020519017A JP2020519017A (ja) 2020-06-25
JP2020519017A5 true JP2020519017A5 (enExample) 2021-06-10
JP6931084B2 JP6931084B2 (ja) 2021-09-01

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JP2019559038A Active JP6931084B2 (ja) 2017-05-05 2018-05-04 光学検査結果に発する計量案内型検査サンプルシェイピング

Country Status (6)

Country Link
US (1) US10598617B2 (enExample)
JP (1) JP6931084B2 (enExample)
KR (1) KR102324687B1 (enExample)
CN (1) CN110582842B (enExample)
TW (1) TWI750368B (enExample)
WO (1) WO2018204731A1 (enExample)

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US20230317528A1 (en) * 2022-03-31 2023-10-05 Mellanox Technologies, Ltd. Efficient Semiconductor Metrology Using Machine Learning
WO2025021438A1 (en) * 2023-07-24 2025-01-30 Asml Netherlands B.V. A multiple-device training flow to reduce the time-to-recipe for computational guided inspection

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US6121156A (en) 1998-04-28 2000-09-19 Cypress Semiconductor Corporation Contact monitor, method of forming same and method of analyzing contact-, via-and/or trench-forming processes in an integrated circuit
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US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
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KR101613048B1 (ko) * 2005-11-18 2016-04-15 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
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US10101676B2 (en) * 2015-09-23 2018-10-16 KLA—Tencor Corporation Spectroscopic beam profile overlay metrology

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