TWI750368B - 光學檢驗結果之計量導引檢驗樣品成形 - Google Patents

光學檢驗結果之計量導引檢驗樣品成形 Download PDF

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Publication number
TWI750368B
TWI750368B TW107114978A TW107114978A TWI750368B TW I750368 B TWI750368 B TW I750368B TW 107114978 A TW107114978 A TW 107114978A TW 107114978 A TW107114978 A TW 107114978A TW I750368 B TWI750368 B TW I750368B
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Taiwan
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wafer
inspection
measurements
metrology
controller
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TW107114978A
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English (en)
Chinese (zh)
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TW201907156A (zh
Inventor
考希克 沙
安德魯 詹姆士 克羅斯
安東尼歐 曼尼
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美商克萊譚克公司
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Publication of TW201907156A publication Critical patent/TW201907156A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q90/00—Scanning-probe techniques or apparatus not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW107114978A 2017-05-05 2018-05-03 光學檢驗結果之計量導引檢驗樣品成形 TWI750368B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762502459P 2017-05-05 2017-05-05
US62/502,459 2017-05-05
US15/671,230 US10598617B2 (en) 2017-05-05 2017-08-08 Metrology guided inspection sample shaping of optical inspection results
US15/671,230 2017-08-08

Publications (2)

Publication Number Publication Date
TW201907156A TW201907156A (zh) 2019-02-16
TWI750368B true TWI750368B (zh) 2021-12-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW107114978A TWI750368B (zh) 2017-05-05 2018-05-03 光學檢驗結果之計量導引檢驗樣品成形

Country Status (6)

Country Link
US (1) US10598617B2 (enExample)
JP (1) JP6931084B2 (enExample)
KR (1) KR102324687B1 (enExample)
CN (1) CN110582842B (enExample)
TW (1) TWI750368B (enExample)
WO (1) WO2018204731A1 (enExample)

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US10679333B2 (en) * 2018-03-14 2020-06-09 Kla-Tencor Corporation Defect detection, classification, and process window control using scanning electron microscope metrology
CN114930154B (zh) * 2020-01-07 2023-08-01 诺威有限公司 检测ocd计量机器学习的离群值和异常
US11967060B2 (en) * 2020-08-25 2024-04-23 Kla Corporation Wafer level spatial signature grouping using transfer learning
US12443840B2 (en) 2020-10-09 2025-10-14 Kla Corporation Dynamic control of machine learning based measurement recipe optimization
CN117581161A (zh) * 2021-07-13 2024-02-20 Asml控股股份有限公司 具有用于污染物检测和显微镜检查的相控阵列的量测系统
US20230317528A1 (en) * 2022-03-31 2023-10-05 Mellanox Technologies, Ltd. Efficient Semiconductor Metrology Using Machine Learning
CN121586867A (zh) * 2023-07-24 2026-02-27 Asml荷兰有限公司 减少用于计算引导检查的工艺配方时间的多器件训练流程

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US20130035888A1 (en) * 2011-04-06 2013-02-07 Kla-Tencor Corporation Method and system for providing a quality metric for improved process control
US20140031968A1 (en) * 2012-07-25 2014-01-30 International Business Machines Corporation Run-to-Run Control Utilizing Virtual Metrology in Semiconductor Manufacturing
US20150029499A1 (en) * 2013-07-25 2015-01-29 Kla-Tencor Corporation Auto-focus system and methods for die-to-die inspection
CN106463430A (zh) * 2014-05-12 2017-02-22 科磊股份有限公司 用于测量半导体参数的设备、技术和目标设计

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US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
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US7207017B1 (en) 2004-06-10 2007-04-17 Advanced Micro Devices, Inc. Method and system for metrology recipe generation and review and analysis of design, simulation and metrology results
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US20110170091A1 (en) * 2010-01-11 2011-07-14 Kla-Tencor Corporation Inspection guided overlay metrology
CN102572447A (zh) * 2010-10-21 2012-07-11 索尼公司 图像处理设备、图像处理方法及程序
US20130035888A1 (en) * 2011-04-06 2013-02-07 Kla-Tencor Corporation Method and system for providing a quality metric for improved process control
US20140031968A1 (en) * 2012-07-25 2014-01-30 International Business Machines Corporation Run-to-Run Control Utilizing Virtual Metrology in Semiconductor Manufacturing
US20150029499A1 (en) * 2013-07-25 2015-01-29 Kla-Tencor Corporation Auto-focus system and methods for die-to-die inspection
CN106463430A (zh) * 2014-05-12 2017-02-22 科磊股份有限公司 用于测量半导体参数的设备、技术和目标设计

Also Published As

Publication number Publication date
CN110582842A (zh) 2019-12-17
WO2018204731A1 (en) 2018-11-08
KR20190138891A (ko) 2019-12-16
US10598617B2 (en) 2020-03-24
JP2020519017A (ja) 2020-06-25
TW201907156A (zh) 2019-02-16
CN110582842B (zh) 2021-02-23
US20180321168A1 (en) 2018-11-08
KR102324687B1 (ko) 2021-11-10
JP6931084B2 (ja) 2021-09-01

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