TWI750368B - 光學檢驗結果之計量導引檢驗樣品成形 - Google Patents

光學檢驗結果之計量導引檢驗樣品成形 Download PDF

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Publication number
TWI750368B
TWI750368B TW107114978A TW107114978A TWI750368B TW I750368 B TWI750368 B TW I750368B TW 107114978 A TW107114978 A TW 107114978A TW 107114978 A TW107114978 A TW 107114978A TW I750368 B TWI750368 B TW I750368B
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Taiwan
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wafer
inspection
measurements
metrology
controller
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TW107114978A
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English (en)
Chinese (zh)
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TW201907156A (zh
Inventor
考希克 沙
安德魯 詹姆士 克羅斯
安東尼歐 曼尼
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美商克萊譚克公司
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Publication of TW201907156A publication Critical patent/TW201907156A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q90/00—Scanning-probe techniques or apparatus not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW107114978A 2017-05-05 2018-05-03 光學檢驗結果之計量導引檢驗樣品成形 TWI750368B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762502459P 2017-05-05 2017-05-05
US62/502,459 2017-05-05
US15/671,230 2017-08-08
US15/671,230 US10598617B2 (en) 2017-05-05 2017-08-08 Metrology guided inspection sample shaping of optical inspection results

Publications (2)

Publication Number Publication Date
TW201907156A TW201907156A (zh) 2019-02-16
TWI750368B true TWI750368B (zh) 2021-12-21

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Family Applications (1)

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TW107114978A TWI750368B (zh) 2017-05-05 2018-05-03 光學檢驗結果之計量導引檢驗樣品成形

Country Status (6)

Country Link
US (1) US10598617B2 (enExample)
JP (1) JP6931084B2 (enExample)
KR (1) KR102324687B1 (enExample)
CN (1) CN110582842B (enExample)
TW (1) TWI750368B (enExample)
WO (1) WO2018204731A1 (enExample)

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US10679333B2 (en) * 2018-03-14 2020-06-09 Kla-Tencor Corporation Defect detection, classification, and process window control using scanning electron microscope metrology
TWI777357B (zh) * 2020-01-07 2022-09-11 以色列商諾威量測設備股份有限公司 用於光學關鍵尺寸計量的方法和系統及機器可存取的儲存介質
US11967060B2 (en) * 2020-08-25 2024-04-23 Kla Corporation Wafer level spatial signature grouping using transfer learning
US12443840B2 (en) 2020-10-09 2025-10-14 Kla Corporation Dynamic control of machine learning based measurement recipe optimization
US20240319617A1 (en) * 2021-07-13 2024-09-26 Asml Holding N.V. Metrology systems with phased arrays for contaminant detection and microscopy
US20230317528A1 (en) * 2022-03-31 2023-10-05 Mellanox Technologies, Ltd. Efficient Semiconductor Metrology Using Machine Learning
WO2025021438A1 (en) * 2023-07-24 2025-01-30 Asml Netherlands B.V. A multiple-device training flow to reduce the time-to-recipe for computational guided inspection

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CN102572447A (zh) * 2010-10-21 2012-07-11 索尼公司 图像处理设备、图像处理方法及程序
US20130035888A1 (en) * 2011-04-06 2013-02-07 Kla-Tencor Corporation Method and system for providing a quality metric for improved process control
US20140031968A1 (en) * 2012-07-25 2014-01-30 International Business Machines Corporation Run-to-Run Control Utilizing Virtual Metrology in Semiconductor Manufacturing
US20150029499A1 (en) * 2013-07-25 2015-01-29 Kla-Tencor Corporation Auto-focus system and methods for die-to-die inspection
CN106463430A (zh) * 2014-05-12 2017-02-22 科磊股份有限公司 用于测量半导体参数的设备、技术和目标设计

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US20110170091A1 (en) * 2010-01-11 2011-07-14 Kla-Tencor Corporation Inspection guided overlay metrology
CN102572447A (zh) * 2010-10-21 2012-07-11 索尼公司 图像处理设备、图像处理方法及程序
US20130035888A1 (en) * 2011-04-06 2013-02-07 Kla-Tencor Corporation Method and system for providing a quality metric for improved process control
US20140031968A1 (en) * 2012-07-25 2014-01-30 International Business Machines Corporation Run-to-Run Control Utilizing Virtual Metrology in Semiconductor Manufacturing
US20150029499A1 (en) * 2013-07-25 2015-01-29 Kla-Tencor Corporation Auto-focus system and methods for die-to-die inspection
CN106463430A (zh) * 2014-05-12 2017-02-22 科磊股份有限公司 用于测量半导体参数的设备、技术和目标设计

Also Published As

Publication number Publication date
JP6931084B2 (ja) 2021-09-01
US20180321168A1 (en) 2018-11-08
CN110582842B (zh) 2021-02-23
KR20190138891A (ko) 2019-12-16
CN110582842A (zh) 2019-12-17
WO2018204731A1 (en) 2018-11-08
US10598617B2 (en) 2020-03-24
TW201907156A (zh) 2019-02-16
KR102324687B1 (ko) 2021-11-10
JP2020519017A (ja) 2020-06-25

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