JP2013062508A5 - - Google Patents
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- JP2013062508A5 JP2013062508A5 JP2012218060A JP2012218060A JP2013062508A5 JP 2013062508 A5 JP2013062508 A5 JP 2013062508A5 JP 2012218060 A JP2012218060 A JP 2012218060A JP 2012218060 A JP2012218060 A JP 2012218060A JP 2013062508 A5 JP2013062508 A5 JP 2013062508A5
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- 230000000737 periodic effect Effects 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 238000012545 processing Methods 0.000 claims description 30
- 238000013461 design Methods 0.000 claims description 20
- 238000007689 inspection Methods 0.000 claims description 15
- 238000003491 array Methods 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 description 14
- 230000037431 insertion Effects 0.000 description 14
- 238000003860 storage Methods 0.000 description 13
- 230000007547 defect Effects 0.000 description 7
- 230000002085 persistent effect Effects 0.000 description 4
- 230000003252 repetitive effect Effects 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/230,483 US9141730B2 (en) | 2011-09-12 | 2011-09-12 | Method of generating a recipe for a manufacturing tool and system thereof |
| US13/230,483 | 2011-09-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013062508A JP2013062508A (ja) | 2013-04-04 |
| JP2013062508A5 true JP2013062508A5 (enExample) | 2015-11-05 |
| JP6096455B2 JP6096455B2 (ja) | 2017-03-15 |
Family
ID=47830554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012218060A Active JP6096455B2 (ja) | 2011-09-12 | 2012-09-11 | 製造ツールのレシピを生成する方法及びそのシステム |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9141730B2 (enExample) |
| JP (1) | JP6096455B2 (enExample) |
| KR (2) | KR101993409B1 (enExample) |
| SG (1) | SG188724A1 (enExample) |
| TW (1) | TWI578130B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8640060B2 (en) * | 2012-05-29 | 2014-01-28 | Applied Materials Israel, Ltd. | Method of generating a recipe for a manufacturing tool and system thereof |
| US20140214192A1 (en) * | 2013-01-25 | 2014-07-31 | Dmo Systems Limited | Apparatus For Design-Based Manufacturing Optimization In Semiconductor Fab |
| WO2016117103A1 (ja) * | 2015-01-23 | 2016-07-28 | 株式会社 日立ハイテクノロジーズ | 半導体測定装置、或いは半導体検査装置に用いられるレシピ作成装置 |
| US10012689B2 (en) | 2015-03-25 | 2018-07-03 | Applied Materials Israel Ltd. | Method of inspecting a specimen and system thereof |
| US9846934B2 (en) | 2015-04-13 | 2017-12-19 | Anchor Semiconductor Inc. | Pattern weakness and strength detection and tracking during a semiconductor device fabrication process |
| US10545490B2 (en) * | 2015-06-01 | 2020-01-28 | Applied Materials Israel Ltd. | Method of inspecting a specimen and system thereof |
| US10754256B2 (en) | 2015-10-08 | 2020-08-25 | Asml Netherlands B.V. | Method and apparatus for pattern correction and verification |
| CN106774193B (zh) * | 2016-11-29 | 2019-04-16 | 河海大学常州校区 | 基于激素反应扩散原理的制造系统动态协调方法 |
| US10290087B2 (en) * | 2017-09-11 | 2019-05-14 | Applied Materials Israel Ltd. | Method of generating an examination recipe and system thereof |
| US10937705B2 (en) * | 2018-03-30 | 2021-03-02 | Onto Innovation Inc. | Sample inspection using topography |
| TWI776015B (zh) * | 2019-01-30 | 2022-09-01 | 晶喬科技股份有限公司 | 半導體元件的製程開發方法以及系統 |
| JP7497359B2 (ja) * | 2020-07-01 | 2024-06-10 | 株式会社Tmeic | 製造設備の診断支援装置 |
| JP2022189284A (ja) * | 2021-06-11 | 2022-12-22 | 東京エレクトロン株式会社 | 基板検査装置、基板検査方法及び記憶媒体 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4845558A (en) * | 1987-12-03 | 1989-07-04 | Kla Instruments Corporation | Method and apparatus for detecting defects in repeated microminiature patterns |
| JP3999301B2 (ja) * | 1997-03-07 | 2007-10-31 | 富士通株式会社 | 露光データ作成方法 |
| JP3397101B2 (ja) * | 1997-10-29 | 2003-04-14 | 株式会社日立製作所 | 欠陥検査方法および装置 |
| JP3562975B2 (ja) * | 1998-09-29 | 2004-09-08 | 株式会社東芝 | 集積回路設計方法及び集積回路設計装置 |
| US6476913B1 (en) * | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
| US7817844B2 (en) * | 1999-08-26 | 2010-10-19 | Nanogeometry Research Inc. | Pattern inspection apparatus and method |
| US7065239B2 (en) * | 2001-10-24 | 2006-06-20 | Applied Materials, Inc. | Automated repetitive array microstructure defect inspection |
| US6886153B1 (en) * | 2001-12-21 | 2005-04-26 | Kla-Tencor Corporation | Design driven inspection or measurement for semiconductor using recipe |
| JP3699960B2 (ja) | 2003-03-14 | 2005-09-28 | 株式会社東芝 | 検査レシピ作成システム、欠陥レビューシステム、検査レシピ作成方法及び欠陥レビュー方法 |
| JP4664630B2 (ja) * | 2004-07-22 | 2011-04-06 | 株式会社東芝 | 半導体装置の製造装置に対する自動レシピ作成装置及び作成方法 |
| US20070041144A1 (en) * | 2005-05-23 | 2007-02-22 | Clement Szeto | Method for reducing substrate noise from penetrating noise sensitive circuits |
| JP2007165670A (ja) * | 2005-12-15 | 2007-06-28 | Matsushita Electric Ind Co Ltd | 半導体回路装置およびその設計方法 |
| WO2008077100A2 (en) | 2006-12-19 | 2008-06-26 | Kla-Tencor Corporation | Systems and methods for creating inspection recipes |
| US7869643B2 (en) * | 2007-01-31 | 2011-01-11 | Applied Materials South East Asia Pte. Ltd. | Advanced cell-to-cell inspection |
| US8826200B2 (en) | 2012-05-25 | 2014-09-02 | Kla-Tencor Corp. | Alteration for wafer inspection |
| US8640060B2 (en) * | 2012-05-29 | 2014-01-28 | Applied Materials Israel, Ltd. | Method of generating a recipe for a manufacturing tool and system thereof |
| US9053390B2 (en) | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
-
2011
- 2011-09-12 US US13/230,483 patent/US9141730B2/en active Active
-
2012
- 2012-08-27 SG SG2012063335A patent/SG188724A1/en unknown
- 2012-09-11 JP JP2012218060A patent/JP6096455B2/ja active Active
- 2012-09-12 TW TW101133328A patent/TWI578130B/zh active
- 2012-09-12 KR KR1020120100962A patent/KR101993409B1/ko active Active
-
2019
- 2019-06-19 KR KR1020190072871A patent/KR102028747B1/ko active Active
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