JP6096455B2 - 製造ツールのレシピを生成する方法及びそのシステム - Google Patents

製造ツールのレシピを生成する方法及びそのシステム Download PDF

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JP6096455B2
JP6096455B2 JP2012218060A JP2012218060A JP6096455B2 JP 6096455 B2 JP6096455 B2 JP 6096455B2 JP 2012218060 A JP2012218060 A JP 2012218060A JP 2012218060 A JP2012218060 A JP 2012218060A JP 6096455 B2 JP6096455 B2 JP 6096455B2
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cell
basic
periodic
simple array
cells
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JP2013062508A (ja
JP2013062508A5 (enExample
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ゲシェル マーク
ゲシェル マーク
バルトフ アヴィシャイ
バルトフ アヴィシャイ
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アプライド マテリアルズ イスラエル リミテッド
アプライド マテリアルズ イスラエル リミテッド
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32096—Batch, recipe configuration for flexible batch control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • General Factory Administration (AREA)
  • Architecture (AREA)
  • Software Systems (AREA)
JP2012218060A 2011-09-12 2012-09-11 製造ツールのレシピを生成する方法及びそのシステム Active JP6096455B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/230,483 US9141730B2 (en) 2011-09-12 2011-09-12 Method of generating a recipe for a manufacturing tool and system thereof
US13/230,483 2011-09-12

Publications (3)

Publication Number Publication Date
JP2013062508A JP2013062508A (ja) 2013-04-04
JP2013062508A5 JP2013062508A5 (enExample) 2015-11-05
JP6096455B2 true JP6096455B2 (ja) 2017-03-15

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ID=47830554

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JP2012218060A Active JP6096455B2 (ja) 2011-09-12 2012-09-11 製造ツールのレシピを生成する方法及びそのシステム

Country Status (5)

Country Link
US (1) US9141730B2 (enExample)
JP (1) JP6096455B2 (enExample)
KR (2) KR101993409B1 (enExample)
SG (1) SG188724A1 (enExample)
TW (1) TWI578130B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8640060B2 (en) * 2012-05-29 2014-01-28 Applied Materials Israel, Ltd. Method of generating a recipe for a manufacturing tool and system thereof
US20140214192A1 (en) * 2013-01-25 2014-07-31 Dmo Systems Limited Apparatus For Design-Based Manufacturing Optimization In Semiconductor Fab
US10984143B2 (en) 2015-01-23 2021-04-20 Hitachi High-Tech Corporation Recipe creation device for use in semiconductor measurement device or semiconductor inspection device
US10012689B2 (en) 2015-03-25 2018-07-03 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US9846934B2 (en) * 2015-04-13 2017-12-19 Anchor Semiconductor Inc. Pattern weakness and strength detection and tracking during a semiconductor device fabrication process
US10545490B2 (en) * 2015-06-01 2020-01-28 Applied Materials Israel Ltd. Method of inspecting a specimen and system thereof
US10754256B2 (en) 2015-10-08 2020-08-25 Asml Netherlands B.V. Method and apparatus for pattern correction and verification
CN106774193B (zh) * 2016-11-29 2019-04-16 河海大学常州校区 基于激素反应扩散原理的制造系统动态协调方法
US10290087B2 (en) * 2017-09-11 2019-05-14 Applied Materials Israel Ltd. Method of generating an examination recipe and system thereof
US10937705B2 (en) * 2018-03-30 2021-03-02 Onto Innovation Inc. Sample inspection using topography
TWI776015B (zh) * 2019-01-30 2022-09-01 晶喬科技股份有限公司 半導體元件的製程開發方法以及系統
CN114206518B (zh) * 2020-07-01 2024-07-02 株式会社Tmeic 制造设备的诊断辅助装置
JP2022189284A (ja) * 2021-06-11 2022-12-22 東京エレクトロン株式会社 基板検査装置、基板検査方法及び記憶媒体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845558A (en) * 1987-12-03 1989-07-04 Kla Instruments Corporation Method and apparatus for detecting defects in repeated microminiature patterns
JP3999301B2 (ja) * 1997-03-07 2007-10-31 富士通株式会社 露光データ作成方法
JP3397101B2 (ja) * 1997-10-29 2003-04-14 株式会社日立製作所 欠陥検査方法および装置
JP3562975B2 (ja) * 1998-09-29 2004-09-08 株式会社東芝 集積回路設計方法及び集積回路設計装置
US6476913B1 (en) * 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
US7817844B2 (en) * 1999-08-26 2010-10-19 Nanogeometry Research Inc. Pattern inspection apparatus and method
US7065239B2 (en) * 2001-10-24 2006-06-20 Applied Materials, Inc. Automated repetitive array microstructure defect inspection
US6886153B1 (en) * 2001-12-21 2005-04-26 Kla-Tencor Corporation Design driven inspection or measurement for semiconductor using recipe
JP3699960B2 (ja) 2003-03-14 2005-09-28 株式会社東芝 検査レシピ作成システム、欠陥レビューシステム、検査レシピ作成方法及び欠陥レビュー方法
JP4664630B2 (ja) * 2004-07-22 2011-04-06 株式会社東芝 半導体装置の製造装置に対する自動レシピ作成装置及び作成方法
WO2006127751A2 (en) * 2005-05-23 2006-11-30 Amalfi Semiconductor, Inc. Electrically isolated cmos device
JP2007165670A (ja) * 2005-12-15 2007-06-28 Matsushita Electric Ind Co Ltd 半導体回路装置およびその設計方法
WO2008077100A2 (en) 2006-12-19 2008-06-26 Kla-Tencor Corporation Systems and methods for creating inspection recipes
US7869643B2 (en) * 2007-01-31 2011-01-11 Applied Materials South East Asia Pte. Ltd. Advanced cell-to-cell inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US8640060B2 (en) * 2012-05-29 2014-01-28 Applied Materials Israel, Ltd. Method of generating a recipe for a manufacturing tool and system thereof
US9053390B2 (en) 2012-08-14 2015-06-09 Kla-Tencor Corporation Automated inspection scenario generation

Also Published As

Publication number Publication date
US9141730B2 (en) 2015-09-22
TWI578130B (zh) 2017-04-11
SG188724A1 (en) 2013-04-30
KR20130028886A (ko) 2013-03-20
TW201321911A (zh) 2013-06-01
KR101993409B1 (ko) 2019-06-26
JP2013062508A (ja) 2013-04-04
US20130066454A1 (en) 2013-03-14
KR20190076931A (ko) 2019-07-02
KR102028747B1 (ko) 2019-10-04

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