JP2017502499A5 - - Google Patents

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Publication number
JP2017502499A5
JP2017502499A5 JP2016528082A JP2016528082A JP2017502499A5 JP 2017502499 A5 JP2017502499 A5 JP 2017502499A5 JP 2016528082 A JP2016528082 A JP 2016528082A JP 2016528082 A JP2016528082 A JP 2016528082A JP 2017502499 A5 JP2017502499 A5 JP 2017502499A5
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JP
Japan
Prior art keywords
wafer
parameters
inspection process
regions
determining
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JP2016528082A
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English (en)
Japanese (ja)
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JP2017502499A (ja
JP6545164B2 (ja
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Priority claimed from US14/517,751 external-priority patent/US9518932B2/en
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Publication of JP2017502499A publication Critical patent/JP2017502499A/ja
Publication of JP2017502499A5 publication Critical patent/JP2017502499A5/ja
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Publication of JP6545164B2 publication Critical patent/JP6545164B2/ja
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JP2016528082A 2013-11-06 2014-11-05 ウェハ検査プロセスの１つ以上のパラメータを決定するための方法、コンピュータ読み出し可能な媒体およびシステム Active JP6545164B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361900869P 2013-11-06 2013-11-06
US61/900,869 2013-11-06
US14/517,751 US9518932B2 (en) 2013-11-06 2014-10-17 Metrology optimized inspection
US14/517,751 2014-10-17
PCT/US2014/064103 WO2015069751A1 (en) 2013-11-06 2014-11-05 Metrology optimized inspection

Publications (3)

Publication Number Publication Date
JP2017502499A JP2017502499A (ja) 2017-01-19
JP2017502499A5 true JP2017502499A5 (enExample) 2017-12-14
JP6545164B2 JP6545164B2 (ja) 2019-07-17

Family

ID=53006822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016528082A Active JP6545164B2 (ja) 2013-11-06 2014-11-05 ウェハ検査プロセスの１つ以上のパラメータを決定するための方法、コンピュータ読み出し可能な媒体およびシステム

Country Status (7)

Country Link
US (1) US9518932B2 (enExample)
JP (1) JP6545164B2 (enExample)
KR (1) KR102177677B1 (enExample)
CN (1) CN105793970B (enExample)
IL (1) IL245472A0 (enExample)
TW (1) TWI625806B (enExample)
WO (1) WO2015069751A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102211093B1 (ko) * 2014-02-12 2021-02-03 에이에스엠엘 네델란즈 비.브이. 프로세스 윈도우를 최적화하는 방법
US10181185B2 (en) 2016-01-11 2019-01-15 Kla-Tencor Corp. Image based specimen process control
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
SG11201902745RA (en) * 2016-10-17 2019-05-30 Kla Tencor Corp Optimizing training sets used for setting up inspection-related algorithms
US10699926B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corp. Identifying nuisances and defects of interest in defects detected on a wafer
US10408764B2 (en) 2017-09-13 2019-09-10 Applied Materials Israel Ltd. System, method and computer program product for object examination
US11056366B2 (en) * 2018-03-23 2021-07-06 Kla Corporation Sample transport device with integrated metrology
KR20210036962A (ko) 2018-08-28 2021-04-05 에이에스엠엘 네델란즈 비.브이. 최적의 계측 안내 시스템들 및 방법들
US11263737B2 (en) * 2019-01-10 2022-03-01 Lam Research Corporation Defect classification and source analysis for semiconductor equipment
CN114144867B (zh) * 2019-07-05 2025-05-02 科磊股份有限公司 使用量子计算的具有动态采样计划、优化晶片测量路径及优化晶片运输的制造厂管理
US11415531B2 (en) * 2019-10-11 2022-08-16 KLA Corp. Statistical learning-based mode selection for multi-mode inspection
US11610296B2 (en) * 2020-01-09 2023-03-21 Kla Corporation Projection and distance segmentation algorithm for wafer defect detection

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2057675B (en) * 1979-07-20 1983-11-16 Hitachi Ltd Photoelectric detection of surface defects
JPH07270119A (ja) * 1994-03-21 1995-10-20 Nikon Corp 集積回路リソグラフィー用の蛍光使用の直接レチクル対ウエハ・アライメントの方法及び装置
US5789124A (en) * 1996-10-10 1998-08-04 International Business Machines Corporation Method of monitoring lithographic resist poisoning
US7057741B1 (en) 1999-06-18 2006-06-06 Kla-Tencor Corporation Reduced coherence symmetric grazing incidence differential interferometer
IL130874A (en) * 1999-07-09 2002-12-01 Nova Measuring Instr Ltd System and method for measuring pattern structures
US6484064B1 (en) * 1999-10-05 2002-11-19 Advanced Micro Devices, Inc. Method and apparatus for running metrology standard wafer routes for cross-fab metrology calibration
US6552337B1 (en) * 1999-11-02 2003-04-22 Samsung Electronics Co., Ltd. Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements
US6630996B2 (en) * 2000-11-15 2003-10-07 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
US6620563B2 (en) * 2001-03-08 2003-09-16 Motorola, Inc. Lithography method for forming semiconductor devices on a wafer utilizing atomic force microscopy
US6960416B2 (en) * 2002-03-01 2005-11-01 Applied Materials, Inc. Method and apparatus for controlling etch processes during fabrication of semiconductor devices
US6982793B1 (en) * 2002-04-04 2006-01-03 Nanometrics Incorporated Method and apparatus for using an alignment target with designed in offset
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
US6781688B2 (en) * 2002-10-02 2004-08-24 Kla-Tencor Technologies Corporation Process for identifying defects in a substrate having non-uniform surface properties
US7046375B2 (en) * 2003-05-02 2006-05-16 Timbre Technologies, Inc. Edge roughness measurement in optical metrology
US9002497B2 (en) 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
US7001830B2 (en) * 2003-09-02 2006-02-21 Advanced Micro Devices, Inc System and method of pattern recognition and metrology structure for an X-initiative layout design
JP4230899B2 (ja) * 2003-12-15 2009-02-25 株式会社日立ハイテクノロジーズ 回路パターン検査方法
WO2005073807A1 (en) 2004-01-29 2005-08-11 Kla-Tencor Technologies Corporation Computer-implemented methods for detecting defects in reticle design data
US7321426B1 (en) * 2004-06-02 2008-01-22 Kla-Tencor Technologies Corporation Optical metrology on patterned samples
US7502121B1 (en) * 2004-11-24 2009-03-10 Ahbee 1, L.P. Temperature insensitive low coherence based optical metrology for nondestructive characterization of physical characteristics of materials
US7853920B2 (en) * 2005-06-03 2010-12-14 Asml Netherlands B.V. Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturing
TWI308372B (en) 2005-09-01 2009-04-01 Camtek Ltd A method and a system for establishing an inspection-recipe
US8908145B2 (en) * 2006-02-21 2014-12-09 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US7526354B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Managing and using metrology data for process and equipment control
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
US7801635B2 (en) * 2007-01-30 2010-09-21 Tokyo Electron Limited Real-time parameter tuning for etch processes
US7711514B2 (en) 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
JP5159373B2 (ja) 2008-03-06 2013-03-06 オリンパス株式会社 基板検査方法
FR2931292A1 (fr) * 2008-05-15 2009-11-20 St Microelectronics Rousset Procede de controle en temps reel de la fabrication de circuits integres a l'aide de structures de controle localisees dans l'espace modele opc
US8269960B2 (en) 2008-07-24 2012-09-18 Kla-Tencor Corp. Computer-implemented methods for inspecting and/or classifying a wafer
US8379227B2 (en) * 2009-10-28 2013-02-19 Nanometrics Incorporated Optical metrology on textured samples
US8559001B2 (en) 2010-01-11 2013-10-15 Kla-Tencor Corporation Inspection guided overlay metrology
JP2011192769A (ja) * 2010-03-15 2011-09-29 Renesas Electronics Corp 半導体デバイス製造方法、及び製造システム
US9588441B2 (en) 2012-05-18 2017-03-07 Kla-Tencor Corporation Method and device for using substrate geometry to determine optimum substrate analysis sampling

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