JP2017502499A5 - - Google Patents

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Publication number
JP2017502499A5
JP2017502499A5 JP2016528082A JP2016528082A JP2017502499A5 JP 2017502499 A5 JP2017502499 A5 JP 2017502499A5 JP 2016528082 A JP2016528082 A JP 2016528082A JP 2016528082 A JP2016528082 A JP 2016528082A JP 2017502499 A5 JP2017502499 A5 JP 2017502499A5
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JP
Japan
Prior art keywords
wafer
parameters
inspection process
regions
determining
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JP2016528082A
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English (en)
Japanese (ja)
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JP2017502499A (ja
JP6545164B2 (ja
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Priority claimed from US14/517,751 external-priority patent/US9518932B2/en
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Publication of JP2017502499A publication Critical patent/JP2017502499A/ja
Publication of JP2017502499A5 publication Critical patent/JP2017502499A5/ja
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Publication of JP6545164B2 publication Critical patent/JP6545164B2/ja
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JP2016528082A 2013-11-06 2014-11-05 ウェハ検査プロセスの１つ以上のパラメータを決定するための方法、コンピュータ読み出し可能な媒体およびシステム Active JP6545164B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361900869P 2013-11-06 2013-11-06
US61/900,869 2013-11-06
US14/517,751 US9518932B2 (en) 2013-11-06 2014-10-17 Metrology optimized inspection
US14/517,751 2014-10-17
PCT/US2014/064103 WO2015069751A1 (en) 2013-11-06 2014-11-05 Metrology optimized inspection

Publications (3)

Publication Number Publication Date
JP2017502499A JP2017502499A (ja) 2017-01-19
JP2017502499A5 true JP2017502499A5 (enExample) 2017-12-14
JP6545164B2 JP6545164B2 (ja) 2019-07-17

Family

ID=53006822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016528082A Active JP6545164B2 (ja) 2013-11-06 2014-11-05 ウェハ検査プロセスの１つ以上のパラメータを決定するための方法、コンピュータ読み出し可能な媒体およびシステム

Country Status (7)

Country Link
US (1) US9518932B2 (enExample)
JP (1) JP6545164B2 (enExample)
KR (1) KR102177677B1 (enExample)
CN (1) CN105793970B (enExample)
IL (1) IL245472A0 (enExample)
TW (1) TWI625806B (enExample)
WO (1) WO2015069751A1 (enExample)

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US10181185B2 (en) 2016-01-11 2019-01-15 Kla-Tencor Corp. Image based specimen process control
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
SG11201902745RA (en) * 2016-10-17 2019-05-30 Kla Tencor Corp Optimizing training sets used for setting up inspection-related algorithms
US10699926B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corp. Identifying nuisances and defects of interest in defects detected on a wafer
US10408764B2 (en) 2017-09-13 2019-09-10 Applied Materials Israel Ltd. System, method and computer program product for object examination
US11056366B2 (en) 2018-03-23 2021-07-06 Kla Corporation Sample transport device with integrated metrology
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US11263737B2 (en) * 2019-01-10 2022-03-01 Lam Research Corporation Defect classification and source analysis for semiconductor equipment
KR20220028106A (ko) * 2019-07-05 2022-03-08 케이엘에이 코포레이션 양자 컴퓨팅을 이용한 동적 샘플링 계획, 최적화된 웨이퍼 측정 경로 및 최적화된 웨이퍼 이송을 통한 팹 관리
US11415531B2 (en) * 2019-10-11 2022-08-16 KLA Corp. Statistical learning-based mode selection for multi-mode inspection
US11610296B2 (en) * 2020-01-09 2023-03-21 Kla Corporation Projection and distance segmentation algorithm for wafer defect detection

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