JP2015167136A - 多層回路部材とそのためのアセンブリ - Google Patents
多層回路部材とそのためのアセンブリ Download PDFInfo
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- JP2015167136A JP2015167136A JP2015084576A JP2015084576A JP2015167136A JP 2015167136 A JP2015167136 A JP 2015167136A JP 2015084576 A JP2015084576 A JP 2015084576A JP 2015084576 A JP2015084576 A JP 2015084576A JP 2015167136 A JP2015167136 A JP 2015167136A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
- H01R13/6469—Means for preventing cross-talk by cross-over of signal conductors on substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6633—Structural association with built-in electrical component with built-in single component with inductive component, e.g. transformer
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/09—Filters comprising mutual inductance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
【選択図】なし
Description
本出願は米国仮特許出願第61/258,976号(2010年5月6日出願)の利益を主張し、その全体が本明細書に参照により組み込まれる。
Claims (5)
- ハウジング、
該ハウジング内の多層回路部材であって、該多層回路部材が電気的導電性のある第1と第2領域を持つ導電性の1枚の基準面を含み、前記第1と第2領域は電気的に接続され両領域の間に伸長されたスロットを有し、前記多層回路部材が前記基準面の前記第1領域に隣接し概ね平行な第1の一対の信号線と、前記基準面の前記第2領域に隣接し概ね平行な第2の一対の信号線とを含む、多層回路部材、及び、
該多層回路部材の一部分と相互接続されている複数の導線を有する結線を含むケーブルアセンブリ。 - 前記ハウジングが導電性のある材料で構成される請求項1に記載のケーブルアセンブリ。
- 導電性の1枚の第2基準面をさらに含み、前記第1と第2の一対の信号線は前記基準面と前記第2基準面の間に位置する請求項1に記載のケーブルアセンブリ。
- 前記第2基準面は該第2基準面の第2スロットに分割された電気的に接続された第1と第2領域を含み、前記第2基準面の電気的に接続された前記第1と第2領域は前記基準面の電気的に接続された前記第1と第2領域に概ね整列され、前記第2基準面の前記第2スロットは前記基準面の前記スロットに概ね整列されている請求項3に記載のケーブルアセンブリ。
- 前記基準面と前記第2基準面に電気的に接続している複数の第1と第2導電性ビアをさらに含み、前記複数の第1導電性ビアは前記第1の一対の信号線の反対側で配列内に位置し、前記複数の第2導電性ビアは前記第2の一対の信号線の反対側で配列内に位置する請求項4に記載のケーブルアセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25897609P | 2009-11-06 | 2009-11-06 | |
US61/258,976 | 2009-11-06 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012537993A Division JP2013510407A (ja) | 2009-11-06 | 2010-11-04 | 多層回路部材とそのためのアセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015167136A true JP2015167136A (ja) | 2015-09-24 |
JP6267153B2 JP6267153B2 (ja) | 2018-01-24 |
Family
ID=43970748
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012537993A Pending JP2013510407A (ja) | 2009-11-06 | 2010-11-04 | 多層回路部材とそのためのアセンブリ |
JP2012537990A Active JP5995723B2 (ja) | 2009-11-06 | 2010-11-04 | 基準回路を有する多層回路部材 |
JP2015084576A Expired - Fee Related JP6267153B2 (ja) | 2009-11-06 | 2015-04-16 | 多層回路部材とそのためのアセンブリ |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012537993A Pending JP2013510407A (ja) | 2009-11-06 | 2010-11-04 | 多層回路部材とそのためのアセンブリ |
JP2012537990A Active JP5995723B2 (ja) | 2009-11-06 | 2010-11-04 | 基準回路を有する多層回路部材 |
Country Status (5)
Country | Link |
---|---|
US (3) | US9345128B2 (ja) |
JP (3) | JP2013510407A (ja) |
CN (4) | CN102687350B (ja) |
TW (2) | TWM419368U (ja) |
WO (2) | WO2011056967A2 (ja) |
Cited By (2)
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JP2018067541A (ja) * | 2016-10-13 | 2018-04-26 | モレックス エルエルシー | 高速コネクタシステム |
JP2018125070A (ja) * | 2017-01-30 | 2018-08-09 | 日立金属株式会社 | コネクタ及びコネクタ付きケーブル |
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CN102687350B (zh) * | 2009-11-06 | 2016-04-06 | 莫列斯公司 | 具有参考电路的多层电路元件 |
WO2011056979A2 (en) * | 2009-11-06 | 2011-05-12 | Molex Incorporated | Modular jack with enhanced shielding |
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US8289727B2 (en) * | 2010-06-11 | 2012-10-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package substrate |
TW201352092A (zh) | 2012-03-28 | 2013-12-16 | Fujikura Ltd | 配線基板 |
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US9178318B2 (en) * | 2012-04-27 | 2015-11-03 | Pulse Electronics, Inc. | Shielded integrated connector modules and assemblies and methods of manufacturing the same |
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US20140247720A1 (en) * | 2013-03-01 | 2014-09-04 | Nxp B.V. | Signal path isolation for conductive circuit paths and multipurpose interfaces |
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CN113966647A (zh) * | 2019-06-28 | 2022-01-21 | 3M创新有限公司 | 多层电路板 |
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TWI823350B (zh) * | 2022-04-19 | 2023-11-21 | 大陸商深圳市柯達科電子科技有限公司 | 軟性電路板連接頭、觸控式螢幕及顯示裝置 |
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Also Published As
Publication number | Publication date |
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CN102696156A (zh) | 2012-09-26 |
TWM419368U (en) | 2011-12-21 |
WO2011056967A3 (en) | 2011-06-30 |
US9345128B2 (en) | 2016-05-17 |
CN102687350B (zh) | 2016-04-06 |
CN102696156B (zh) | 2016-01-20 |
WO2011056977A3 (en) | 2011-08-04 |
JP2013510444A (ja) | 2013-03-21 |
US20160233616A1 (en) | 2016-08-11 |
CN102687350A (zh) | 2012-09-19 |
US20120280766A1 (en) | 2012-11-08 |
US20120282807A1 (en) | 2012-11-08 |
TWM409680U (en) | 2011-08-11 |
US9462676B2 (en) | 2016-10-04 |
CN201878415U (zh) | 2011-06-22 |
JP5995723B2 (ja) | 2016-09-21 |
CN202095172U (zh) | 2011-12-28 |
WO2011056977A2 (en) | 2011-05-12 |
JP2013510407A (ja) | 2013-03-21 |
JP6267153B2 (ja) | 2018-01-24 |
WO2011056967A2 (en) | 2011-05-12 |
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