JP2015153811A5 - - Google Patents

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Publication number
JP2015153811A5
JP2015153811A5 JP2014024242A JP2014024242A JP2015153811A5 JP 2015153811 A5 JP2015153811 A5 JP 2015153811A5 JP 2014024242 A JP2014024242 A JP 2014024242A JP 2014024242 A JP2014024242 A JP 2014024242A JP 2015153811 A5 JP2015153811 A5 JP 2015153811A5
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JP
Japan
Prior art keywords
semiconductor chip
underfill resin
chip
semiconductor
wiring board
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JP2014024242A
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English (en)
Japanese (ja)
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JP6242231B2 (ja
JP2015153811A (ja
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Priority to JP2014024242A priority Critical patent/JP6242231B2/ja
Priority claimed from JP2014024242A external-priority patent/JP6242231B2/ja
Priority to US14/567,056 priority patent/US9633978B2/en
Publication of JP2015153811A publication Critical patent/JP2015153811A/ja
Publication of JP2015153811A5 publication Critical patent/JP2015153811A5/ja
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JP2014024242A 2014-02-12 2014-02-12 半導体装置及びその製造方法 Active JP6242231B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014024242A JP6242231B2 (ja) 2014-02-12 2014-02-12 半導体装置及びその製造方法
US14/567,056 US9633978B2 (en) 2014-02-12 2014-12-11 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014024242A JP6242231B2 (ja) 2014-02-12 2014-02-12 半導体装置及びその製造方法

Publications (3)

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JP2015153811A JP2015153811A (ja) 2015-08-24
JP2015153811A5 true JP2015153811A5 (enExample) 2016-11-24
JP6242231B2 JP6242231B2 (ja) 2017-12-06

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JP2014024242A Active JP6242231B2 (ja) 2014-02-12 2014-02-12 半導体装置及びその製造方法

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US (1) US9633978B2 (enExample)
JP (1) JP6242231B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566305B (zh) * 2014-10-29 2017-01-11 巨擘科技股份有限公司 製造三維積體電路的方法
KR102356810B1 (ko) * 2015-01-22 2022-01-28 삼성전기주식회사 전자부품내장형 인쇄회로기판 및 그 제조방법
JP6478853B2 (ja) * 2015-07-14 2019-03-06 新光電気工業株式会社 電子部品装置及びその製造方法
JP6489965B2 (ja) * 2015-07-14 2019-03-27 新光電気工業株式会社 電子部品装置及びその製造方法
US10957672B2 (en) * 2017-11-13 2021-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
US11075133B2 (en) * 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill structure for semiconductor packages and methods of forming the same
JP2020047793A (ja) * 2018-09-19 2020-03-26 株式会社東芝 半導体装置の製造方法
JP2022002261A (ja) * 2020-06-22 2022-01-06 キオクシア株式会社 ストレージ装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184936A (ja) * 2000-12-11 2002-06-28 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP3683179B2 (ja) * 2000-12-26 2005-08-17 松下電器産業株式会社 半導体装置及びその製造方法
JP2003258034A (ja) * 2002-03-06 2003-09-12 Mitsubishi Electric Corp 多層配線基体の製造方法および多層配線基体
JP2011054851A (ja) * 2009-09-03 2011-03-17 Toshiba Corp 半導体装置の製造方法
JP2011061004A (ja) * 2009-09-10 2011-03-24 Elpida Memory Inc 半導体装置及びその製造方法
KR101719636B1 (ko) * 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법
JP5357241B2 (ja) 2011-08-10 2013-12-04 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2013115190A (ja) * 2011-11-28 2013-06-10 Elpida Memory Inc 半導体装置の製造方法
JP2013138177A (ja) * 2011-11-28 2013-07-11 Elpida Memory Inc 半導体装置の製造方法
JP2015122445A (ja) * 2013-12-24 2015-07-02 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

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