JP2016012713A5 - - Google Patents

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Publication number
JP2016012713A5
JP2016012713A5 JP2015004623A JP2015004623A JP2016012713A5 JP 2016012713 A5 JP2016012713 A5 JP 2016012713A5 JP 2015004623 A JP2015004623 A JP 2015004623A JP 2015004623 A JP2015004623 A JP 2015004623A JP 2016012713 A5 JP2016012713 A5 JP 2016012713A5
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JP
Japan
Prior art keywords
resin film
film layer
semiconductor device
manufacturing
filler
Prior art date
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Pending
Application number
JP2015004623A
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English (en)
Japanese (ja)
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JP2016012713A (ja
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Publication date
Application filed filed Critical
Priority to JP2015004623A priority Critical patent/JP2016012713A/ja
Priority claimed from JP2015004623A external-priority patent/JP2016012713A/ja
Publication of JP2016012713A publication Critical patent/JP2016012713A/ja
Publication of JP2016012713A5 publication Critical patent/JP2016012713A5/ja
Pending legal-status Critical Current

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JP2015004623A 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法 Pending JP2016012713A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015004623A JP2016012713A (ja) 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014116766 2014-06-05
JP2014116766 2014-06-05
JP2015004623A JP2016012713A (ja) 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2016012713A JP2016012713A (ja) 2016-01-21
JP2016012713A5 true JP2016012713A5 (enExample) 2017-04-13

Family

ID=55229218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015004623A Pending JP2016012713A (ja) 2014-06-05 2015-01-14 樹脂フィルム、半導体装置および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2016012713A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6788344B2 (ja) * 2015-12-21 2020-11-25 京セラ株式会社 電子部品及び電子部品の製造方法
WO2018181761A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 封止フィルム、電子部品装置の製造方法及び電子部品装置
JP7211757B2 (ja) * 2018-10-22 2023-01-24 新光電気工業株式会社 配線基板
CN111370337B (zh) * 2020-03-18 2022-03-18 深圳杰微芯片科技有限公司 降低封装翘曲方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3378374B2 (ja) * 1993-09-14 2003-02-17 株式会社東芝 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2011187877A (ja) * 2010-03-11 2011-09-22 Panasonic Corp 半導体装置及びその製造方法
JP2014056924A (ja) * 2012-09-12 2014-03-27 Hitachi Chemical Co Ltd 半導体装置の製造方法及びそれに用いる熱硬化性樹脂組成物並びにそれらにより得られる半導体装置

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