JP6242231B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP6242231B2
JP6242231B2 JP2014024242A JP2014024242A JP6242231B2 JP 6242231 B2 JP6242231 B2 JP 6242231B2 JP 2014024242 A JP2014024242 A JP 2014024242A JP 2014024242 A JP2014024242 A JP 2014024242A JP 6242231 B2 JP6242231 B2 JP 6242231B2
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semiconductor chip
underfill resin
resin
chip
semiconductor
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JP2015153811A5 (enExample
JP2015153811A (ja
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翔太 三木
翔太 三木
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2014024242A priority Critical patent/JP6242231B2/ja
Priority to US14/567,056 priority patent/US9633978B2/en
Publication of JP2015153811A publication Critical patent/JP2015153811A/ja
Publication of JP2015153811A5 publication Critical patent/JP2015153811A5/ja
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H05K2201/04—Assemblies of printed circuits
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
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US10957672B2 (en) * 2017-11-13 2021-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
US11075133B2 (en) * 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill structure for semiconductor packages and methods of forming the same
JP2020047793A (ja) * 2018-09-19 2020-03-26 株式会社東芝 半導体装置の製造方法
JP2022002261A (ja) * 2020-06-22 2022-01-06 キオクシア株式会社 ストレージ装置

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