JP2015151628A5 - - Google Patents

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Publication number
JP2015151628A5
JP2015151628A5 JP2015023742A JP2015023742A JP2015151628A5 JP 2015151628 A5 JP2015151628 A5 JP 2015151628A5 JP 2015023742 A JP2015023742 A JP 2015023742A JP 2015023742 A JP2015023742 A JP 2015023742A JP 2015151628 A5 JP2015151628 A5 JP 2015151628A5
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JP
Japan
Prior art keywords
solution
ions
platinum
providing
stabilization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015023742A
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English (en)
Japanese (ja)
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JP2015151628A (ja
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Priority claimed from US14/182,987 external-priority patent/US9469902B2/en
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Publication of JP2015151628A publication Critical patent/JP2015151628A/ja
Publication of JP2015151628A5 publication Critical patent/JP2015151628A5/ja
Pending legal-status Critical Current

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JP2015023742A 2014-02-18 2015-02-10 連続白金層の無電解堆積 Pending JP2015151628A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/182,987 2014-02-18
US14/182,987 US9469902B2 (en) 2014-02-18 2014-02-18 Electroless deposition of continuous platinum layer

Publications (2)

Publication Number Publication Date
JP2015151628A JP2015151628A (ja) 2015-08-24
JP2015151628A5 true JP2015151628A5 (https=) 2019-07-11

Family

ID=53797584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015023742A Pending JP2015151628A (ja) 2014-02-18 2015-02-10 連続白金層の無電解堆積

Country Status (6)

Country Link
US (1) US9469902B2 (https=)
JP (1) JP2015151628A (https=)
KR (1) KR102455120B1 (https=)
CN (1) CN104851837B (https=)
SG (1) SG10201501150YA (https=)
TW (1) TW201542873A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003008537A2 (en) 2001-04-06 2003-01-30 Mannkind Corporation Epitope sequences
EP1752160A3 (en) 2001-04-06 2007-05-30 Mannkind Corporation Epitope sequences
DK1635863T3 (da) 2003-06-17 2010-11-22 Mannkind Corp Sammensætninger til udløsning, forbedring og opretholdelse af immunresponser mod MHC-klasse-i-begrænsede epitoper til profylaktiske eller terapeutiske formål
AU2004249254B2 (en) 2003-06-17 2010-07-08 Mannkind Corporation Combinations of tumor-associated antigens for the treatment of various types of cancers
CA2571168A1 (en) 2004-06-17 2006-01-26 Mannkind Corporation Mhc i-binding ssx-241-49 variants
AU2006259221B8 (en) 2005-06-17 2013-02-07 Mannkind Corporation Multivalent entrain-and-amplify immunotherapeutics for carcinoma
SG162817A1 (en) 2005-06-17 2010-07-29 Mannkind Corp Methods and compositions.to elicit multivalent immune responses against dominant and subdominant epitopes, expressed on cancer cells and tumor stroma
NZ564359A (en) 2005-06-17 2011-09-30 Mannkind Corp Analogs of pepetides corresponding to class I MHC-restricted T cell epitopes
AU2010310468A1 (en) 2009-10-23 2012-05-24 Mannkind Corporation Cancer immunotherapy and method of treatment
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
LT6547B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos cheminio nusodinimo tirpalas ir platinos tolydžios dangos formavimo būdas

Family Cites Families (24)

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US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPH04325688A (ja) 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
US5360471A (en) * 1992-08-05 1994-11-01 Murata Manufacturing Co., Ltd. Electroless solder plating bath
JP3116637B2 (ja) 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
JP3920462B2 (ja) * 1998-07-13 2007-05-30 株式会社大和化成研究所 貴金属を化学的還元析出によって得るための水溶液
JP3744300B2 (ja) * 1999-04-06 2006-02-08 住友電気工業株式会社 導電性多孔質とそれを用いた金属多孔質体および電池用極板
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
CN100495824C (zh) * 2002-03-04 2009-06-03 住友电气工业株式会社 各向异性导电膜及其制造方法
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JP4986174B2 (ja) * 2008-10-30 2012-07-25 独立行政法人産業技術総合研究所 マイクロリアクター用反応管及びその製造方法
CN102712045A (zh) * 2009-11-16 2012-10-03 巴斯夫欧洲公司 金属岛涂层及合成方法
KR101079775B1 (ko) * 2010-04-01 2011-11-03 경희대학교 산학협력단 전기방사에 이은 무전해 도금을 통한 전기 전도성 나노섬유 제조 방법
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EP2481835B1 (en) * 2011-01-28 2013-09-11 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
JP2013161928A (ja) * 2012-02-03 2013-08-19 Sumitomo Electric Ind Ltd プリント配線板用基材およびプリント配線板用基材の製造方法
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US20150307994A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
US9428836B2 (en) * 2014-04-29 2016-08-30 Lam Research Corporation Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS

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