SG10201501150YA - Electroless deposition of continuous platinum layer - Google Patents

Electroless deposition of continuous platinum layer

Info

Publication number
SG10201501150YA
SG10201501150YA SG10201501150YA SG10201501150YA SG10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA SG 10201501150Y A SG10201501150Y A SG 10201501150YA
Authority
SG
Singapore
Prior art keywords
electroless deposition
platinum layer
continuous platinum
continuous
electroless
Prior art date
Application number
SG10201501150YA
Inventor
Eugenijus Norkus
Aldona Jagminiene
Albina Zieliene
Ina Stankeviciene
Loreta Tamasauskaite-Tamasiunaite
Aniruddha Joi
Yezdi Dordi
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201501150YA publication Critical patent/SG10201501150YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
SG10201501150YA 2014-02-18 2015-02-13 Electroless deposition of continuous platinum layer SG10201501150YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/182,987 US9469902B2 (en) 2014-02-18 2014-02-18 Electroless deposition of continuous platinum layer

Publications (1)

Publication Number Publication Date
SG10201501150YA true SG10201501150YA (en) 2015-09-29

Family

ID=53797584

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501150YA SG10201501150YA (en) 2014-02-18 2015-02-13 Electroless deposition of continuous platinum layer

Country Status (6)

Country Link
US (1) US9469902B2 (en)
JP (1) JP2015151628A (en)
KR (1) KR102455120B1 (en)
CN (1) CN104851837B (en)
SG (1) SG10201501150YA (en)
TW (1) TW201542873A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003008537A2 (en) 2001-04-06 2003-01-30 Mannkind Corporation Epitope sequences
EP1752160A3 (en) 2001-04-06 2007-05-30 Mannkind Corporation Epitope sequences
US20050118186A1 (en) 2003-06-17 2005-06-02 Chih-Sheng Chiang Combinations of tumor-associated antigens in compositions for various types of cancers
PL1635863T3 (en) 2003-06-17 2011-01-31 Mannkind Corp Compositions to elicit, enhance and sustain immune responses against mhc class i-restricted epitopes, for prophylactic or therapeutic purposes
US8202841B2 (en) 2004-06-17 2012-06-19 Mannkind Corporation SSX-2 peptide analogs
KR20080033271A (en) 2005-06-17 2008-04-16 맨카인드 코포레이션 Multivalent entrain-and-amplify immunotherapeutics for carcinoma
ES2413079T3 (en) 2005-06-17 2013-07-15 Mannkind Corporation Methods and compositions for triggering multivalent immune responses against dominant and subdominant epitopes expressed in cancer cells and tumor stroma
AU2006259307B2 (en) 2005-06-17 2012-12-20 Mannkind Corporation Epitope analogues
AU2010310468A1 (en) 2009-10-23 2012-05-24 Mannkind Corporation Cancer immunotherapy and method of treatment
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
LT6547B (en) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras The solution of chemical platinum deposition and the method of continuous platinum coating formation

Family Cites Families (24)

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Publication number Priority date Publication date Assignee Title
US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPH04325688A (en) 1991-04-26 1992-11-16 Murata Mfg Co Ltd Electroless plating bath
US5360471A (en) * 1992-08-05 1994-11-01 Murata Manufacturing Co., Ltd. Electroless solder plating bath
JP3116637B2 (en) 1993-03-12 2000-12-11 株式会社村田製作所 Electroless plating solution
JP3920462B2 (en) * 1998-07-13 2007-05-30 株式会社大和化成研究所 Aqueous solutions for obtaining noble metals by chemical reduction deposition
JP3455709B2 (en) 1999-04-06 2003-10-14 株式会社大和化成研究所 Plating method and plating solution precursor used for it
JP3744300B2 (en) * 1999-04-06 2006-02-08 住友電気工業株式会社 Conductive porous material, porous metal body using the same, and electrode plate for battery
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (en) * 2000-10-02 2002-04-11 Basf Ag Process for the production of platinum metal catalysts
KR100923183B1 (en) * 2002-03-04 2009-10-22 스미토모덴키고교가부시키가이샤 Anisotropic conductive film and method for producing the same
JP2004115885A (en) * 2002-09-27 2004-04-15 Tokyo Electron Ltd Electroless plating method
JP2009016389A (en) * 2007-06-29 2009-01-22 Panasonic Corp Semiconductor laser element and method of manufacturing the same
JP4986174B2 (en) * 2008-10-30 2012-07-25 独立行政法人産業技術総合研究所 Reaction tube for microreactor and manufacturing method thereof
WO2011057937A2 (en) * 2009-11-16 2011-05-19 Basf Se Metal island coatings and method for synthesis
KR101079775B1 (en) * 2010-04-01 2011-11-03 경희대학교 산학협력단 Preparation Method of Electroconductive Nanofiber through Electrospinning followed by Electroless Plating
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
EP2481835B1 (en) * 2011-01-28 2013-09-11 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
JP2013161928A (en) * 2012-02-03 2013-08-19 Sumitomo Electric Ind Ltd Base material for printed wiring board and manufacturing method of the same
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US9428836B2 (en) * 2014-04-29 2016-08-30 Lam Research Corporation Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
US20150307994A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS

Also Published As

Publication number Publication date
KR102455120B1 (en) 2022-10-14
US20150232995A1 (en) 2015-08-20
US9469902B2 (en) 2016-10-18
JP2015151628A (en) 2015-08-24
CN104851837B (en) 2018-03-13
KR20150097412A (en) 2015-08-26
TW201542873A (en) 2015-11-16
CN104851837A (en) 2015-08-19

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