LT6547B - The solution of chemical platinum deposition and the method of continuous platinum coating formation - Google Patents
The solution of chemical platinum deposition and the method of continuous platinum coating formation Download PDFInfo
- Publication number
- LT6547B LT6547B LT2016535A LT2016535A LT6547B LT 6547 B LT6547 B LT 6547B LT 2016535 A LT2016535 A LT 2016535A LT 2016535 A LT2016535 A LT 2016535A LT 6547 B LT6547 B LT 6547B
- Authority
- LT
- Lithuania
- Prior art keywords
- solution
- platinum
- chemical
- deposition
- chemical precipitation
- Prior art date
Links
Landscapes
- Chemically Coating (AREA)
Abstract
Description
Technikos sritisTechnical field
Išradimas siejamas su platinos dangos formavimo būdu naudojant cheminio (besrovio) nusodinimo metodą, paremtą autokatalizinės metalų jonų redukcijos reakcijomis, kai reduktoriaus anodinės oksidacijos metu susidarę elektronai redukuoja Pt4+ jonus iki metalinės Pt, bei platinos cheminio nusodinimo tirpalu, skirtu šiam būdui realizuoti. Išradimas gali būti panaudotas nusodinant platinos dangas ant dielektrikų, puslaidininkių arba sudėtingos konfigūracijos laidininkų, pvz., gaminant elektronikos prietaisus ir jų komponentus, mikroelektronikoje chemiškai padengiant platiną ant natūralaus arba jau padengto kitų medžiagų sluoksniais silicio kaip barjerinis sluoksnis, panaudojant platinos dangas efektyviai apsaugai nuo korozijos, o taip pat nusodinant platinos sluoksnį, kaip raketinio kuro degimo katalizatorių, ant sudėtingos konfigūracijos ir prigimties nešėjų aerokosminių variklių gamyboje.The present invention relates to a platinum coating method using a chemical (direct current) deposition method based on autocatalytic metal ion reduction reactions where the electrons formed during the anodic oxidation of the reducing agent reduce the Pt 4+ ions to a metal Pt and a platinum chemical deposition solution for this method. The invention can be applied to the deposition of platinum coatings on dielectrics, semiconductors or conductors of complex configuration, e.g., in the manufacture of electronic devices and components, by chemically plating platinum on natural or already coated layers of other materials as a barrier layer, using platinum coatings for effective corrosion protection. , as well as the deposition of the platinum layer as a catalyst for the combustion of propellants on complex configurations and natures in the manufacture of aerospace engines.
Technikos lygisState of the art
Šiuo metu žinomus platinos cheminio nusodinimo tirpalus galima suskirstyti j šarminius ir rūgštinius.Currently known solutions of platinum chemical precipitation can be divided into alkaline and acidic.
US 3486928 (1969 12 30) aprašoma cheminio platinavimo vonia, kurioje Pt(IV) jonų šaltiniu naudojamas heksahidroksi platinos(IV) kompleksas, bei hidrazinas kaip reduktorius. Šio tirpalo trūkumai: aukštesnė nei kambario temperatūra (35 °C), tirpalo stabilizavimo priedu naudojamas kancerogeniškas etilendiaminas, hidrazino kiekis tirpale turi būti pastoviai papildomas, nes, esant didesnėms hidrazino koncentracijoms, vyksta Pt(IV) redukcija visame tirpalo tūryje.US 3486928 (30.12.1969) describes a chemical platinum bath using a hexahydroxy platinum (IV) complex as the source of Pt (IV) and hydrazine as a reducing agent. Disadvantages of this solution: above room temperature (35 ° C), carcinogenic ethylenediamine used as a stabilizer in the solution, the hydrazine content of the solution should be constantly added, since at higher hydrazine concentrations Pt (IV) is reduced throughout the solution.
US 3698939 (1972 10 17) taip pat aprašytas šarminis platinos cheminio nusodinimo tirpalas. Jo trūkumai: temperatūra aukštesnė nei kambario, pH palaikymui naudojamas stipriai garuojantis amoniakas, tirpale naudojami bent trys skirtingi stabilizuojantys priedai, galintys sorbuotis į nusodinamą platinos dangą, hidrazino kiekis tirpale turi būti pastoviai papildomas, nes, esant didesnėms hidrazino koncentracijoms, vyksta Pt(IV) redukcija visame tirpalo tūryje.US 3698939 (October 17, 1972) also describes an alkaline solution of platinum chemical precipitation. Disadvantages: temperature above room temperature, strong evaporation of ammonia to maintain pH, solution with at least three different stabilizing additives capable of sorption into a platinum precipitate, addition of hydrazine to solution as Pt (IV) occurs at higher hydrazine concentrations reduction throughout the solution volume.
US 3562911 (1971 02 16) pasiūlytame rūgštiniame platinos cheminio nusodinimo tirpale tirpalai rūgštinami druskos rūgšties tirpalu. Šio tipo tirpalo trūkumai panašūs kaip ir šarminių platinos cheminio nusodinimo tirpalų: temperatūra ženkliai aukštesnė nei kambario, pH palaikymui naudojamas stipriai garuojantis druskos rūgšties tirpalas, tirpale naudojami bent keturi skirtingi stabilizuojantys ir drėkinamumą gerinantys priedai, galintys sorbuotis į nusodinamą platinos dangą.The acidic solution of platinum chemical precipitation in U.S. Pat. No. 3,562,911 (February 16, 1971) is acidified with hydrochloric acid. The disadvantages of this type of solution are similar to those of alkaline platinum chemical precipitation solutions: the temperature is significantly higher than room temperature, a strong evaporating hydrochloric acid solution is used to maintain the pH, and the solution uses at least four different stabilizing and wetting additives to sorpate the platinum precipitate.
DE 2607988 (1977 08 11) platinos(IV) jonų šaltiniu buvo pasirinktas cisdiamino Pt(IV) dinitritas, o stabilizatoriais naudoti natrio nitritas ir dinatrio vandenilio fosfatas. Be stabilizatorių naudojimo, kaip trūkumus, galima paminėti aukštą darbinę tirpalo temperatūrą (60-95 °C), bei būdą, kai hidrazinas pridedamas lašais, o ne visas reikalingas kiekis iš karto.DE 2607988 (11.08.1977) selected cisdiamine Pt (IV) dinitrite as the source of platinum (IV) and sodium nitrite and disodium hydrogen phosphate as stabilizers. In addition to the use of stabilizers, the drawbacks include the high working temperature of the solution (60-95 ° C) and the way in which hydrazine is added in drops rather than all the required amount at once.
JPS 59336667 (1984 08 17) taip pat buvo naudojamas cis-diamino Pt(IV) dinitratas bei hidrazinas, ligandu pasirinkus lakų amoniaką. Stabilizatoriumi buvo panaudotas hidroksilamino hidrochloridas, o dirbama buvo aukštesnėje, nei kambario temperatūroje (40-50 °C).JPS 59336667 (08.08.1984) also used cis-diamine Pt (IV) dinitrate as well as hydrazine in the choice of varnish ammonia as the ligand. Hydroxylamine hydrochloride was used as a stabilizer and the working temperature was higher than room temperature (40-50 ° C).
US 6391477 (2002 05 21) Pt(IV) šaltiniu buvo naudojamas diamino Pt(IV) dinitritas arba kalio tetranitroplatinatas. Šio tirpalo temperatūra taip pat buvo aukštesnė nei kambario ir lygi 50 °C.US 6391477 (21.05.2002) used diamine Pt (IV) dinitrite or potassium tetranitroplatinate as the source of Pt (IV). The temperature of this solution was also higher than room temperature and equal to 50 ° C.
Be aukščiau paminėtuose patentuose naudojamo reduktoriaus buvo pasiūlyti ir kiti reduktoriai.In addition to the reducer used in the patents mentioned above, other reducers have been proposed.
JP 09287078 (1997 11 04) autoriai reduktoriumi panaudojo taip pat, kaip ir hidrazinas, vandenilį turintį reduktorių - borohidridą. Pasiūlyto platinos cheminio nusodinimo tirpalo trūkumai susiję su kancerogeninių aminų, tokių kaip etilendiaminas, etilenaminas, metilaminas, piperidinas, panaudojimu ligandais bei įvairių priedų, įskaitant sierą turinčius, panaudojimu.The authors of JP 09287078 (04.11.1997) used hydrogen as a reducing agent, borohydride, in the same way as hydrazine. The disadvantages of the proposed platinum chemical precipitation solution relate to the use of carcinogenic amines such as ethylenediamine, ethyleneamine, methylamine, piperidine as ligands and the use of various additives including sulfur.
JP 201037612 (2016 03 22) reduktoriumi taip pat buvo panaudotas borohidridas, o ligandu - toksiškas polietilenaminas. Reiktų pažymėti, kad, kaip ir aukščiau pateiktame patente, pagrindinis trūkumas yra tame, kad gautose dangose šalia redukuotos platinos būtinai susidaro elementinis boras ar į jas sorbuojami boro junginiai, o tai daro įtaką platinos dangos grynumui.JP 201037612 (22.03.2016) also used borohydride as a reducing agent and toxic polyethyleneamine as the ligand. It should be noted that, as in the above patent, the main disadvantage is that the resulting coatings necessarily contain elemental boron or boron compounds adsorbed to the reduced platinum, which affects the purity of the platinum coating.
US 9499913 (2016 11 22) Pt(IV) redukcijai platinos cheminio nusodinimo tirpaluose buvo panaudotas krūvio pernešimo reduktorius - Co(lll)/Co(ll) redokso pora.US 9499913 (22.11.2016) A charge transfer reducing agent, the Co (III) / Co (II) redox pair, was used to reduce Pt (IV) in platinum chemical precipitation solutions.
US 9469902 (2016 10 18) Pt(IV) redukcijai platinos cheminio nusodinimo tirpaluose taip pat buvo panaudotas krūvio pernešimo reduktorius kita redokso pora Ti(IV)/Ti(lll). Abiejų pastarųjų dviejų patentų esminis trūkumas yra tai, kad procesai turi vykti deguonies neturinčioje atmosferoje, nes Co(ll) bei Ti(lll) lengvai oksiduojami iki atitinkamai, Co(lll) ir Ti(IV). Tokių sąlygų užtikrinimas reikalauja daug papildomos įrangos ir lėšų.US 9469902 (18.10.2016) also used a charge transfer reducing agent, another redox pair Ti (IV) / Ti (III), for the reduction of Pt (IV) in platinum chemical precipitation solutions. A major disadvantage of the latter two patents is that the processes must take place in an oxygen-free atmosphere, since Co (II) and Ti (III) are readily oxidized to, respectively, Co (III) and Ti (IV). Ensuring such conditions requires a large amount of additional equipment and funds.
Sprendžiama techninė problemaResolving a technical issue
Išradimu siekiama sumažinti platinos cheminio nusodinimo tirpalo toksiškumą, supaprastinti ir atpiginti tolydžios platinos dangos formavimo būdą, leidžiantį nusodinti tolydžias ir kompaktiškas platinos dangas kambario temperatūroje ir be reduktoriaus papildymo proceso metu bei santykinai brangių priedų naudojimo.The purpose of the invention is to reduce the toxicity of a platinum chemical deposition solution, to simplify and reduce the cost of forming a continuous platinum coating that allows the deposition of continuous and compact platinum coatings at room temperature and without the additive reduction process and the use of relatively expensive additives.
Išradimo esmės atskleidimasDisclosure of Invention
Pagal pasiūlytą išradimą platinos cheminio nusodinimo tirpalą sudaro: 0,0030,03 M koncentracijos Na2Pt(OH)6, kaip platinos(IV) jonų šaltinis, 0,015-0,25 M koncentracijos diizopropanolaminas (Dipa), kaip ligandas, 0,01-0,1 M koncentracijos hidrazinas N2H4, kaip reduktorius, koncentruota acto rūgštis CH3COOH, kaip pH reguliatorius iki mišinio pH 10.According to the present invention, the platinum chemical precipitation solution comprises: 0.0030.03 M Na2Pt (OH) 6 as a source of platinum (IV) ions, 0.015-0.25 M diisopropanolamine (Dipa) as a ligand, 0.01-0 , 1M hydrazine N2H4 as reducing agent, concentrated acetic acid CH3COOH as pH adjuster to pH 10 of the mixture.
Minėtas tirpalas yra iš 0,015 M Na2Pt(OH)6, 0,03 M Dipa, 0,056 M N2H4 ir CH3COOH iki pH 10.Said solution is from 0.015 M Na2Pt (OH) 6, 0.03 M Dipa, 0.056 M N2H4 and CH3COOH to pH 10.
Platinos tolydžios dangos formavimo būdas, apimantis dengimo paviršiaus sensibilizavimą SnCk tirpale, aktyvavimą PdCI2 tirpale bei panardinimą į vonią su cheminio nusodinimo tirpalu pagal bet kurį iš 1-2 išradimo apibrėžties punktų.A method of forming a platinum continuous coating comprising sensitizing a coating surface in a SnCk solution, activating it in a PdCl 2 solution, and immersing in a bath with a chemical precipitation solution according to any one of claims 1-2.
Sensibilizavimui naudojamo SnCI2 tirpalo koncentracija yra ribose 0,1-1,0 g/l, o aktyvavimui naudojamo PdCfe tirpalo koncentracija yra ribose 0,05-1,0 g/l. Platinos cheminio nusodinimo metu minėto tirpalo temperatūra neviršija 20 °C.The concentration of the SnCI 2 solution used for sensitization is in the range of 0.1-1.0 g / l and the concentration of PdCfe solution used for activation is in the range of 0.05-1.0 g / l. The temperature of said solution during chemical deposition of platinum does not exceed 20 ° C.
Platinos cheminio nusodinimo procesas vyksta, leidžiant per tirpalą azotą, kuris atlieka maišymo funkciją bei stabilizuoja tirpalą.The process of chemical precipitation of platinum occurs by passing nitrogen through the solution, which serves as a stirring function and stabilizes the solution.
Išradimo naudingumasUtility of the invention
Pagal pasiūlytą išradimą platinos cheminio nusodinimo tirpalas yra netoksiškas, kadangi naudojamas ekologiškas ir nekancerogeninis Pt(IV) ligandas, taip pat tirpalas neturi papildomų priedų, galinčių sorbuotis į nusodinamas platinos dangas.According to the present invention, the platinum chemical precipitation solution is non-toxic because of the use of organic and non-carcinogenic Pt (IV) ligand, and the solution does not contain additional additives which can sorpate into the platinum precipitates.
Pagal pasiūlytą išradimą platinos dangos formavimo būdas leidžia nusodinti tolydžias ir kompaktiškas platinos dangas kambario temperatūroje ir be reduktoriaus papildymo proceso metu, t. y., vykdant platinos cheminį nusodinimą iš pradinio tirpalo be reaguojančių tirpalo komponentų papildymo.According to the present invention, the method of forming a platinum coating allows for the deposition of a continuous and compact platinum coating at room temperature and without the addition of a reducer during the process, i. i.e., by chemical precipitation of platinum from the stock solution without the addition of reactive solution components.
Reduktoriumi naudojant hidraziną, kurio anodinės oksidacijos reakcijos metu susidaro tik dujiniai produktai ir neužteršią gautos suredukuotos metalinės platinos dangos, Pt(IV) ligandu buvo panaudotas ekologiškai nekenksmingas ir nekancerogeniškas ligandas diizopropanolaminas (Dipa):When using hydrazine as a reducing agent, which produces only gaseous products in the anodic oxidation reaction and does not contaminate the resulting reduced metallic platinum coatings, the environmentally safe and non-carcinogenic ligand diisopropanolamine (Dipa) was used as Pt (IV) ligand:
HO, ,OH (1)HO,, OH (1)
Formulė (1). Diizopropanolamino (Dipa) struktūrinė formulėFormula (1). Structural formula of diisopropanolamine (Dipa)
Pagal išradimą optimizuotos sudėties platinos cheminio nusodinimo tirpalo, kuriame reduktoriumi naudojamas hidrazinas, o ligandu - diizopropanolaminas, panaudojimas kambario temperatūroje, užtikrinančioje didesnį tirpalo tūrinį stabilumą bei padedančioje išvengti aukštesnėse temperatūrose vykstančio hidrazino skilimo, o tuo pačiu ir papildomo hidrazino pridėjimo į platinos cheminio nusodinimo tirpalą.According to the invention, the use of an optimized composition of a platinum chemical precipitation solution employing hydrazine as a reducing agent and diisopropanolamine as a ligand at room temperature provides greater volumetric stability of the solution and prevents the addition of higher hydrazine to the platinum chemical precipitate.
Išradimas detaliau paaiškinamas brėžiniais, kurie neapriboja išradimo apimties ir kuriuose pavaizduota:The invention will be explained in more detail by the following drawings, which do not limit the scope of the invention, and which show:
Fig.1 Ant šiurkštinto stiklo chemiškai nusodintos platinos dangos SEM (skenuojančio elektronų mikroskopo) nuotrauka. Dangos nusodinimo sąlygos: 0,015 M Na2Pt(OH)6, 0,03 M Dipa, 0,056 M N2H4, CH3COOH iki pH 10; 20 °C, dengiama 90 min.Fig.1 Photograph of SEM (scanning electron microscope) chemically deposited on coarse glass. Coating Deposition Conditions: 0.015 M Na 2 Pt (OH) 6 , 0.03 M Dipa, 0.056 MN 2 H 4 , CH 3 COOH to pH 10; 20 ° C, 90 min.
Fig.2 Platinos cheminio nusodinimo kinetika.Fig.2 Kinetics of platinum chemical deposition.
Išradimo realizavimo pavyzdysExample of embodiment of the invention
Paruošiamas platinos cheminio nusodinimo tirpalas, kurio sudėtyje yra 0,015 M Na2Pt(OH)6, 0,03 M Dipa, 0,056 M N2H4, CH3COOH iki pH 10; 20 °C. Po to, kaip nurodyta, paruošiama šiurkštinto stiklo plokštelė: plokštelė 1 min. įmerkiama į 0,5 g/l SnCI2 sensibilizavimo tirpalą, praplaunama dejonizuotu vandeniu, po to 1 min. pamerkiama į 0,5 g/l PdCI2 aktyvavimo tirpalą, praplaunama dejonizuotu vandeniu ir įmerkiama į platinos cheminio nusodinimo tirpalą, kur dangos nusodinimas vyksta 90 min., leidžiant per tirpalą (barbotuojant) azotą, kuris atlieka maišymo funkciją, kartu stabilizuodamas tirpalą, kuriame nėra papildomų tam skirtų priedų. Po 90 min. dengiama plokštelė išimama iš tirpalo, praplaunama dejonizuotu vandeniu ir išdžiovinama. Gaunama tolydi platinos danga (1 pav.), o nusėdusios platinos kiekis yra apie 0,25 mg/cm2 (2 pav.).Prepare a platinum chemical precipitation solution containing 0.015 M Na 2 Pt (OH) 6 , 0.03 M Dipa, 0.056 MN 2 H 4 , CH 3 COOH to pH 10; 20 ° C. Then prepare a coarse glass plate as follows: plate for 1 min. immersed in 0.5 g / l SnCl 2 sensitization solution, rinsed with deionized water, followed by 1 min. immersed in 0.5 g / l PdCI 2 activation solution, rinsed with deionized water and immersed in platinum chemical precipitation solution, where the coating is deposited for 90 minutes, allowing nitrogen (bubbling) to act as a stirring solution while stabilizing the solution. there are no additional accessories for this. In 90 minutes remove the coating plate from the solution, rinse with deionized water and dry. A continuous platinum coating is obtained (Fig. 1) and the amount of deposited platinum is about 0.25 mg / cm 2 (Fig. 2).
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LT2016535A LT6547B (en) | 2016-12-28 | 2016-12-28 | The solution of chemical platinum deposition and the method of continuous platinum coating formation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LT2016535A LT6547B (en) | 2016-12-28 | 2016-12-28 | The solution of chemical platinum deposition and the method of continuous platinum coating formation |
Publications (2)
Publication Number | Publication Date |
---|---|
LT2016535A LT2016535A (en) | 2018-07-10 |
LT6547B true LT6547B (en) | 2018-08-10 |
Family
ID=62750684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
LT2016535A LT6547B (en) | 2016-12-28 | 2016-12-28 | The solution of chemical platinum deposition and the method of continuous platinum coating formation |
Country Status (1)
Country | Link |
---|---|
LT (1) | LT6547B (en) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3486928A (en) | 1965-10-21 | 1969-12-30 | Int Nickel Co | Bath and process for platinum and platinum alloys |
US3562911A (en) | 1968-12-03 | 1971-02-16 | Dentsply Int Inc | Method and composition for platinum plating and articles plated therewith |
US3698939A (en) | 1970-07-09 | 1972-10-17 | Frank H Leaman | Method and composition of platinum plating |
DE2607988A1 (en) | 1976-02-05 | 1977-08-11 | Bbc Brown Boveri & Cie | Electroless deposition of platinum metals - using soln. contg. a complex salt of platinum metal, a reducing agent, stabilizer and accelerator |
JPS5933667A (en) | 1982-08-16 | 1984-02-23 | Tokyo Electric Co Ltd | Floppy disk controller |
JPH09287078A (en) | 1996-04-19 | 1997-11-04 | Japan Energy Corp | Electroless plating solution of platinum and electroless plating method |
US6391477B1 (en) | 2000-07-06 | 2002-05-21 | Honeywell International Inc. | Electroless autocatalytic platinum plating |
JP2016037612A (en) | 2014-08-05 | 2016-03-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Electroless platinum plating solution |
US9469902B2 (en) | 2014-02-18 | 2016-10-18 | Lam Research Corporation | Electroless deposition of continuous platinum layer |
US9499913B2 (en) | 2014-04-02 | 2016-11-22 | Lam Research Corporation | Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent |
-
2016
- 2016-12-28 LT LT2016535A patent/LT6547B/en not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3486928A (en) | 1965-10-21 | 1969-12-30 | Int Nickel Co | Bath and process for platinum and platinum alloys |
US3562911A (en) | 1968-12-03 | 1971-02-16 | Dentsply Int Inc | Method and composition for platinum plating and articles plated therewith |
US3698939A (en) | 1970-07-09 | 1972-10-17 | Frank H Leaman | Method and composition of platinum plating |
DE2607988A1 (en) | 1976-02-05 | 1977-08-11 | Bbc Brown Boveri & Cie | Electroless deposition of platinum metals - using soln. contg. a complex salt of platinum metal, a reducing agent, stabilizer and accelerator |
JPS5933667A (en) | 1982-08-16 | 1984-02-23 | Tokyo Electric Co Ltd | Floppy disk controller |
JPH09287078A (en) | 1996-04-19 | 1997-11-04 | Japan Energy Corp | Electroless plating solution of platinum and electroless plating method |
US6391477B1 (en) | 2000-07-06 | 2002-05-21 | Honeywell International Inc. | Electroless autocatalytic platinum plating |
US9469902B2 (en) | 2014-02-18 | 2016-10-18 | Lam Research Corporation | Electroless deposition of continuous platinum layer |
US9499913B2 (en) | 2014-04-02 | 2016-11-22 | Lam Research Corporation | Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent |
JP2016037612A (en) | 2014-08-05 | 2016-03-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Electroless platinum plating solution |
Also Published As
Publication number | Publication date |
---|---|
LT2016535A (en) | 2018-07-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1322798A1 (en) | Bath and method of electroless plating of silver on metal surfaces | |
CN87102861A (en) | Electroless copper and plating bath thereof | |
US4255194A (en) | Palladium alloy baths for the electroless deposition | |
US20170152600A1 (en) | Plating catalyst and method | |
DE102005038208B4 (en) | Process for the preparation of silver layers and its use | |
CN109415812B (en) | Chemical platinizing liquid | |
WO2017050662A1 (en) | Plating bath composition for electroless plating of gold and a method for depositing a gold layer | |
KR20100017608A (en) | Process for applying a metal coating to a non-conductive substrate | |
JPH03134178A (en) | Hydrazine bath for chemical deposition of platinum and/or palladium and method of manufacturing said bath | |
WO2019163665A1 (en) | Electroless palladium plating solution and palladium coating | |
LT6547B (en) | The solution of chemical platinum deposition and the method of continuous platinum coating formation | |
ES2712858T3 (en) | Use of water-soluble and air-stable phospha-adamantanes as stabilizers in electrolytes for non-electrolytic deposition of metal | |
EP3134562B1 (en) | Process for the preparation of iron boron alloy coatings and plating bath therefor | |
EP3181726A1 (en) | Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces | |
WO2023144003A1 (en) | Composition for depositing a palladium coating on an activated copper-coated substrate | |
LT6548B (en) | The solution of chemical platinum-rhodium alloy deposition and the method of continuous platinum-rhodium alloy coating formation | |
JP2007246955A (en) | Electroless gold-plating bath | |
RU2661644C1 (en) | Pyrophosphate-ammonium electrolyte of contact silvering | |
JP2005047752A (en) | Method for controlling film structure of zinc oxide film | |
JPH08291389A (en) | Gold plating liquid not substituted with cyanide and gold plating method using this liquid | |
KR20150114914A (en) | Electroless deposition of continuous platinum layer using complexed cobalt(ii) metal ion reducing agent | |
KR101685578B1 (en) | Method for electroless palladium plating | |
JPH09157859A (en) | Electroless gold plating solution | |
CA1154984A (en) | Palladium alloy and baths for the electroless deposition thereof | |
JPH03287780A (en) | Electroless copper plating bath |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
BB1A | Patent application published |
Effective date: 20180710 |
|
FG9A | Patent granted |
Effective date: 20180810 |
|
MM9A | Lapsed patents |
Effective date: 20191228 |