TW201542873A - 連續鉑層之無電沉積 - Google Patents

連續鉑層之無電沉積 Download PDF

Info

Publication number
TW201542873A
TW201542873A TW104104496A TW104104496A TW201542873A TW 201542873 A TW201542873 A TW 201542873A TW 104104496 A TW104104496 A TW 104104496A TW 104104496 A TW104104496 A TW 104104496A TW 201542873 A TW201542873 A TW 201542873A
Authority
TW
Taiwan
Prior art keywords
solution
platinum
ions
providing
containing layer
Prior art date
Application number
TW104104496A
Other languages
English (en)
Chinese (zh)
Inventor
尤真尼加斯 諾卡斯
艾朵娜 潔格蜜妮內
埃爾賓那 利連那
伊娜 史達克維淇妮
洛雷塔 塔瑪邵斯凱特－塔瑪西奈特
阿尼律陀 喬伊
葉斯帝 多迪
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201542873A publication Critical patent/TW201542873A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electrochemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
TW104104496A 2014-02-18 2015-02-11 連續鉑層之無電沉積 TW201542873A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/182,987 US9469902B2 (en) 2014-02-18 2014-02-18 Electroless deposition of continuous platinum layer

Publications (1)

Publication Number Publication Date
TW201542873A true TW201542873A (zh) 2015-11-16

Family

ID=53797584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104104496A TW201542873A (zh) 2014-02-18 2015-02-11 連續鉑層之無電沉積

Country Status (6)

Country Link
US (1) US9469902B2 (https=)
JP (1) JP2015151628A (https=)
KR (1) KR102455120B1 (https=)
CN (1) CN104851837B (https=)
SG (1) SG10201501150YA (https=)
TW (1) TW201542873A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003008537A2 (en) 2001-04-06 2003-01-30 Mannkind Corporation Epitope sequences
EP1752160A3 (en) 2001-04-06 2007-05-30 Mannkind Corporation Epitope sequences
AU2004249254B2 (en) 2003-06-17 2010-07-08 Mannkind Corporation Combinations of tumor-associated antigens for the treatment of various types of cancers
DE602004028468D1 (de) 2003-06-17 2010-09-16 Mannkind Corp Haltung von immunantworten gegen mhc-klasse-i-beschränkte epitope, für prophylaktische oder therapeutische zwecke
US8202841B2 (en) 2004-06-17 2012-06-19 Mannkind Corporation SSX-2 peptide analogs
NZ564359A (en) 2005-06-17 2011-09-30 Mannkind Corp Analogs of pepetides corresponding to class I MHC-restricted T cell epitopes
CN101687020A (zh) 2005-06-17 2010-03-31 曼康公司 用于癌症的多价引发-和-增强免疫治疗剂
MX2007015933A (es) 2005-06-17 2008-04-21 Mannkind Corp Metodos y composiciones para generar respuestas inmunes multivalentes contra espitopes dominantes y subdominantes, expresados en celulas cancerigenas y estromas tumorales.
AU2010310468A1 (en) 2009-10-23 2012-05-24 Mannkind Corporation Cancer immunotherapy and method of treatment
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
LT6547B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos cheminio nusodinimo tirpalas ir platinos tolydžios dangos formavimo būdas

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPH04325688A (ja) 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
US5360471A (en) * 1992-08-05 1994-11-01 Murata Manufacturing Co., Ltd. Electroless solder plating bath
JP3116637B2 (ja) 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
JP3920462B2 (ja) * 1998-07-13 2007-05-30 株式会社大和化成研究所 貴金属を化学的還元析出によって得るための水溶液
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
JP3744300B2 (ja) * 1999-04-06 2006-02-08 住友電気工業株式会社 導電性多孔質とそれを用いた金属多孔質体および電池用極板
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
WO2003075409A1 (fr) * 2002-03-04 2003-09-12 Sumitomo Electric Industries, Ltd. Film conducteur anisotrope et procede de production
JP2004115885A (ja) * 2002-09-27 2004-04-15 Tokyo Electron Ltd 無電解メッキ方法
JP2009016389A (ja) * 2007-06-29 2009-01-22 Panasonic Corp 半導体レーザ素子およびその製造方法
JP4986174B2 (ja) * 2008-10-30 2012-07-25 独立行政法人産業技術総合研究所 マイクロリアクター用反応管及びその製造方法
EP2501509A2 (en) * 2009-11-16 2012-09-26 Basf Se Metal island coatings and method for synthesis
KR101079775B1 (ko) * 2010-04-01 2011-11-03 경희대학교 산학협력단 전기방사에 이은 무전해 도금을 통한 전기 전도성 나노섬유 제조 방법
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
EP2481835B1 (en) * 2011-01-28 2013-09-11 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
JP2013161928A (ja) * 2012-02-03 2013-08-19 Sumitomo Electric Ind Ltd プリント配線板用基材およびプリント配線板用基材の製造方法
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
US9428836B2 (en) * 2014-04-29 2016-08-30 Lam Research Corporation Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
US20150307994A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS

Also Published As

Publication number Publication date
US20150232995A1 (en) 2015-08-20
KR20150097412A (ko) 2015-08-26
JP2015151628A (ja) 2015-08-24
CN104851837A (zh) 2015-08-19
KR102455120B1 (ko) 2022-10-14
US9469902B2 (en) 2016-10-18
SG10201501150YA (en) 2015-09-29
CN104851837B (zh) 2018-03-13

Similar Documents

Publication Publication Date Title
TW201542873A (zh) 連續鉑層之無電沉積
JP4559818B2 (ja) シリコン基板の無電解めっき方法およびシリコン基板上の金属層形成方法
JP2015151628A5 (https=)
KR102452723B1 (ko) 환원제로서 착화된 티타늄 ３가 금속 양이온들을 사용하는 연속적인 코발트층의 무전해 디포지션
US9301399B2 (en) Method of treating wiring substrate and wiring substrate manufactured by the same
US20150307995A1 (en) ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
TW201903202A (zh) 使用氫之逐層沉積
TW200901293A (en) Improved method for producing a copper layer on a substrate in a flat panel display manufacturing process
TW201602409A (zh) 使用錯合Co2+金屬離子還原劑之連續鉑層的無電鍍沉積
JP5399308B2 (ja) 半導体ウエハ上への無電解めっきの前処理液、無電解めっき方法、及び半導体装置
KR101807451B1 (ko) 염화 구리, cvd 원료, 구리 배선막 및 염화 구리의 제조 방법
US20150307994A1 (en) ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS
JP2015196904A5 (https=)
KR20110076448A (ko) 탄화물 세라믹 열판 및 그 제조방법
KR101179118B1 (ko) 질화알루미늄-ｈ질화붕소 복합체를 기판으로 하는 열판 및 그 제조방법
JP5772133B2 (ja) 湿式エッチング方法
WO2002046493A1 (fr) Fabrication d'une electrode a couche mince de metal noble pour systemes de super-integration