JP2015196904A5 - - Google Patents

Download PDF

Info

Publication number
JP2015196904A5
JP2015196904A5 JP2015074711A JP2015074711A JP2015196904A5 JP 2015196904 A5 JP2015196904 A5 JP 2015196904A5 JP 2015074711 A JP2015074711 A JP 2015074711A JP 2015074711 A JP2015074711 A JP 2015074711A JP 2015196904 A5 JP2015196904 A5 JP 2015196904A5
Authority
JP
Japan
Prior art keywords
solution
concentrated stock
free
stock solution
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015074711A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015196904A (ja
Filing date
Publication date
Priority claimed from US14/243,793 external-priority patent/US9499913B2/en
Application filed filed Critical
Publication of JP2015196904A publication Critical patent/JP2015196904A/ja
Publication of JP2015196904A5 publication Critical patent/JP2015196904A5/ja
Pending legal-status Critical Current

Links

JP2015074711A 2014-04-02 2015-04-01 錯体Ｃｏ２＋金属イオン還元剤を使用した、連続プラチナ層の無電解堆積 Pending JP2015196904A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/243,793 US9499913B2 (en) 2014-04-02 2014-04-02 Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US14/243,793 2014-04-02

Publications (2)

Publication Number Publication Date
JP2015196904A JP2015196904A (ja) 2015-11-09
JP2015196904A5 true JP2015196904A5 (https=) 2018-05-24

Family

ID=54209249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015074711A Pending JP2015196904A (ja) 2014-04-02 2015-04-01 錯体Ｃｏ２＋金属イオン還元剤を使用した、連続プラチナ層の無電解堆積

Country Status (4)

Country Link
US (1) US9499913B2 (https=)
JP (1) JP2015196904A (https=)
KR (1) KR20150114914A (https=)
TW (1) TW201602409A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9469902B2 (en) * 2014-02-18 2016-10-18 Lam Research Corporation Electroless deposition of continuous platinum layer
LT6547B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos cheminio nusodinimo tirpalas ir platinos tolydžios dangos formavimo būdas

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPS591667A (ja) * 1982-05-20 1984-01-07 ゼネラル・エレクトリツク・カンパニイ シリコンに対する白金の無電解めつき法
JPH04325688A (ja) 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
JP3116637B2 (ja) 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
JP4171604B2 (ja) * 2002-03-18 2008-10-22 株式会社大和化成研究所 無電解めっき浴及び該めっき浴を用いて得られた金属被覆物
US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
US9469902B2 (en) * 2014-02-18 2016-10-18 Lam Research Corporation Electroless deposition of continuous platinum layer
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS

Similar Documents

Publication Publication Date Title
CN104851837B (zh) 连续铂层的无电沉积
KR102134929B1 (ko) 전해질에서 양이온들을 제어할 때 반도체 웨이퍼를 전기 도금하는 방법 및 장치
JP2015151628A5 (https=)
TW201038767A (en) An electroless gold plating solution for forming a gold microstructure, a method for forming the gold microstructure using this plating soltion, and a gold microstructure formed by this method
TW201610227A (zh) 具有至少兩個硼烷還原劑之無電式電鍍
TW201617478A (zh) 用於減少銅及銅合金電路之光學反射率之方法
US20170121823A1 (en) Plating bath composition and method for electroless plating of palladium
KR102452723B1 (ko) 환원제로서 착화된 티타늄 ３가 금속 양이온들을 사용하는 연속적인 코발트층의 무전해 디포지션
JP2015196904A5 (https=)
WO2017195453A1 (ja) レジストの剥離液
TWI793263B (zh) 無電解鍍鈀液，及鈀皮膜
CN104141120A (zh) 一价铜化学镀铜液
TW201606128A (zh) 使用錯合Co2+金屬離子或Ti3+金屬離子做為還原劑之連續鈀層的無電鍍沉積
CN1876891B (zh) 使不导电基底直接金属化的方法
JP2005226156A5 (https=)
US9499913B2 (en) Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
Min et al. Investigation of working mechanism of bis-(3-sulfopropyl) disulfide (SPS) during Cu electroless deposition using real-time observation method
KR101910102B1 (ko) 방사성동위원소 Ni의 전해 도금방법
CN105051254A (zh) 供无电电镀的铜表面活化的方法
JP4273085B2 (ja) 白金−コバルト合金めっき液及びめっき方法
TW201602408A (zh) 使用錯合Ti3+金屬離子做為還原劑之連續鎳層的無電鍍沉積
KR101583913B1 (ko) 내변색성이 우수한 도금액 조성물
JP2022123819A (ja) パラジウムめっき液及びパラジウムめっき補充液
WO2022172464A1 (ja) パラジウムめっき液及びパラジウムめっき補充液
TH2301001017A (th) วิธีการสำหรับการกระตุ้นผิวของซับสเทรทที่มีเส้นใยคาร์บอนหรือไม่เป็นตัวนำสำหรับเมทัลไลเซชัน