CN104851837B - 连续铂层的无电沉积 - Google Patents

连续铂层的无电沉积 Download PDF

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Publication number
CN104851837B
CN104851837B CN201510084904.1A CN201510084904A CN104851837B CN 104851837 B CN104851837 B CN 104851837B CN 201510084904 A CN201510084904 A CN 201510084904A CN 104851837 B CN104851837 B CN 104851837B
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China
Prior art keywords
solution
ions
platinum
stable
diluted mixture
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CN201510084904.1A
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English (en)
Chinese (zh)
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CN104851837A (zh
Inventor
尤金尼厄斯·诺尔库斯
阿尔冬娜·亚格米妮
阿宾娜·齐列内
伊娜·斯坦科维
洛蕾塔·塔玛萨凯特-塔玛修纳特
安鲁达哈·乔伊
耶兹迪·多尔迪
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Lam Research Corp
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Lam Research Corp
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electrochemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201510084904.1A 2014-02-18 2015-02-16 连续铂层的无电沉积 Active CN104851837B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/182,987 US9469902B2 (en) 2014-02-18 2014-02-18 Electroless deposition of continuous platinum layer
US14/182,987 2014-02-18

Publications (2)

Publication Number Publication Date
CN104851837A CN104851837A (zh) 2015-08-19
CN104851837B true CN104851837B (zh) 2018-03-13

Family

ID=53797584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510084904.1A Active CN104851837B (zh) 2014-02-18 2015-02-16 连续铂层的无电沉积

Country Status (6)

Country Link
US (1) US9469902B2 (https=)
JP (1) JP2015151628A (https=)
KR (1) KR102455120B1 (https=)
CN (1) CN104851837B (https=)
SG (1) SG10201501150YA (https=)
TW (1) TW201542873A (https=)

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WO2003008537A2 (en) 2001-04-06 2003-01-30 Mannkind Corporation Epitope sequences
EP1752160A3 (en) 2001-04-06 2007-05-30 Mannkind Corporation Epitope sequences
AU2004249254B2 (en) 2003-06-17 2010-07-08 Mannkind Corporation Combinations of tumor-associated antigens for the treatment of various types of cancers
DE602004028468D1 (de) 2003-06-17 2010-09-16 Mannkind Corp Haltung von immunantworten gegen mhc-klasse-i-beschränkte epitope, für prophylaktische oder therapeutische zwecke
US8202841B2 (en) 2004-06-17 2012-06-19 Mannkind Corporation SSX-2 peptide analogs
NZ564359A (en) 2005-06-17 2011-09-30 Mannkind Corp Analogs of pepetides corresponding to class I MHC-restricted T cell epitopes
CN101687020A (zh) 2005-06-17 2010-03-31 曼康公司 用于癌症的多价引发-和-增强免疫治疗剂
MX2007015933A (es) 2005-06-17 2008-04-21 Mannkind Corp Metodos y composiciones para generar respuestas inmunes multivalentes contra espitopes dominantes y subdominantes, expresados en celulas cancerigenas y estromas tumorales.
AU2010310468A1 (en) 2009-10-23 2012-05-24 Mannkind Corporation Cancer immunotherapy and method of treatment
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
LT6547B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos cheminio nusodinimo tirpalas ir platinos tolydžios dangos formavimo būdas

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1685081A (zh) * 2002-09-27 2005-10-19 东京毅力科创株式会社 无电解镀方法

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US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPH04325688A (ja) 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
US5360471A (en) * 1992-08-05 1994-11-01 Murata Manufacturing Co., Ltd. Electroless solder plating bath
JP3116637B2 (ja) 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
JP3920462B2 (ja) * 1998-07-13 2007-05-30 株式会社大和化成研究所 貴金属を化学的還元析出によって得るための水溶液
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
JP3744300B2 (ja) * 1999-04-06 2006-02-08 住友電気工業株式会社 導電性多孔質とそれを用いた金属多孔質体および電池用極板
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
WO2003075409A1 (fr) * 2002-03-04 2003-09-12 Sumitomo Electric Industries, Ltd. Film conducteur anisotrope et procede de production
JP2009016389A (ja) * 2007-06-29 2009-01-22 Panasonic Corp 半導体レーザ素子およびその製造方法
JP4986174B2 (ja) * 2008-10-30 2012-07-25 独立行政法人産業技術総合研究所 マイクロリアクター用反応管及びその製造方法
EP2501509A2 (en) * 2009-11-16 2012-09-26 Basf Se Metal island coatings and method for synthesis
KR101079775B1 (ko) * 2010-04-01 2011-11-03 경희대학교 산학협력단 전기방사에 이은 무전해 도금을 통한 전기 전도성 나노섬유 제조 방법
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
EP2481835B1 (en) * 2011-01-28 2013-09-11 Atotech Deutschland GmbH Autocatalytic plating bath composition for deposition of tin and tin alloys
JP2013161928A (ja) * 2012-02-03 2013-08-19 Sumitomo Electric Ind Ltd プリント配線板用基材およびプリント配線板用基材の製造方法
US9499913B2 (en) * 2014-04-02 2016-11-22 Lam Research Corporation Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS
US9428836B2 (en) * 2014-04-29 2016-08-30 Lam Research Corporation Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
US20150307994A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1685081A (zh) * 2002-09-27 2005-10-19 东京毅力科创株式会社 无电解镀方法

Also Published As

Publication number Publication date
US20150232995A1 (en) 2015-08-20
KR20150097412A (ko) 2015-08-26
JP2015151628A (ja) 2015-08-24
CN104851837A (zh) 2015-08-19
KR102455120B1 (ko) 2022-10-14
US9469902B2 (en) 2016-10-18
SG10201501150YA (en) 2015-09-29
TW201542873A (zh) 2015-11-16

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