JP2015115549A - 半導体装置、および、半導体装置の製造方法 - Google Patents
半導体装置、および、半導体装置の製造方法 Download PDFInfo
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- JP2015115549A JP2015115549A JP2013258493A JP2013258493A JP2015115549A JP 2015115549 A JP2015115549 A JP 2015115549A JP 2013258493 A JP2013258493 A JP 2013258493A JP 2013258493 A JP2013258493 A JP 2013258493A JP 2015115549 A JP2015115549 A JP 2015115549A
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- H01L2924/3025—Electromagnetic shielding
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Abstract
Description
2 基板
2a 第1の配線層
2b 第2の配線層
2c 第3の配線層
3 外部接続端子
4a、4b、5a、5b、12 ボンディングワイヤ
4a1、4b1、5a1、5b1、12a パッド電極
6 封止樹脂層
7 凹部
8 シールド層
9a 第1の絶縁層
9b 第2の絶縁層
10 半導体装置
Claims (7)
- 接地配線を含む配線層を有し、パッド電極が設けられた基板と、
前記基板に搭載された半導体チップと、
前記基板に設けられた外部接続端子と、
前記半導体チップと前記パッド電極とを電気的に接続するボンディングワイヤと、
前記半導体チップおよび前記ボンディングワイヤを封止するように、前記基板の前記半導体チップが搭載された面を上とした場合における上面上に設けられた封止樹脂層と、
前記封止樹脂層の上面を覆うように設けられた上部と、前記封止樹脂層の側面及び前記基板の側面を覆うように設けられた側部と、を有する導電性のシールド層と、を備え、
前記配線層の一部は、前記基板の側面に露出し且つ前記基板の厚さ方向に切断された切断面を有し、
前記配線層の切断面のうちの前記接地配線の切断面は、前記シールド層と電気的に接続され、
前記接地配線の前記切断面の面積は、前記接地配線の切断面に平行な前記接地配線の断面の面積よりも大きい
ことを特徴とする半導体装置。 - 前記接地配線は、
第1の金属材料を用いた主配線と、
前記第1の金属材料よりも耐酸化性が高い第2の金属材料を用い、且つ前記主配線を被覆する保護金属膜と、を有し、
前記接地配線の前記切断面において、前記主配線の切断面は前記保護金属膜で被覆されている
ことを特徴とする請求項1に記載の半導体装置。 - 前記主配線の前記切断面は、前記保護金属膜を介して、前記シールド層の前記側部と電気的に接続されている
ことを特徴とする請求項2に記載の半導体装置。 - 前記保護金属膜は、前記主配線の上面および側面を被覆していることを特徴とする請求項2に記載の半導体装置。
- 前記接地配線は、前記半導体装置の外部の接地と電気的に接続されるようになっていることを特徴とする請求項1に記載の半導体装置。
- 前記配線層は、
前記基板の上面に設けられ、前記パッド電極と電気的に接続された第1の配線層と、
前記基板の下面に設けられた第2の配線層と、
前記第1の配線層と前記第2の配線層との間に設けられた第3の配線層と、を含み、
前記接地配線は、前記第3の配線層に設けられている
ことを特徴とする請求項1に記載の半導体装置。 - 接地配線を含む配線層を有し且つパッド電極が設けられた基板上に、半導体チップを搭載し、
前記半導体チップと前記パッド電極とをボンディングワイヤにより電気的に接続し、
前記半導体チップおよび前記ボンディングワイヤを封止するように、前記基板の前記半導体チップが搭載された面を上とした場合における上面上に封止樹脂層を形成し、
ダイシングソーにより前記基板を前記配線層とともに切断し、
前記封止樹脂層の上面を覆うとともに、前記封止樹脂層の側面及び前記基板の側面を覆うように導電性のシールド層を形成するものであり、
前記配線層の一部は、前記基板の側面に露出し且つ前記基板の厚さ方向に切断された切断面を有し、
前記配線層の切断面のうちの前記接地配線の切断面は、前記シールド層と電気的に接続され、
前記接地配線の前記切断面の面積は、前記接地配線の切断面に平行な前記接地配線の断面の面積よりも大きい
ことを特徴とする半導体装置の製造方法。
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TW103121260A TW201523829A (zh) | 2013-12-13 | 2014-06-19 | 半導體裝置及半導體裝置之製造方法 |
US14/475,270 US9385090B2 (en) | 2013-12-13 | 2014-09-02 | Semiconductor device and method of manufacturing semiconductor device |
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JP2020025019A (ja) * | 2018-08-07 | 2020-02-13 | キオクシア株式会社 | 半導体装置 |
EP3817043A1 (en) * | 2019-10-31 | 2021-05-05 | Heraeus Deutschland GmbH & Co KG | Electromagnetic interference shielding in recesses of electronic modules |
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JP2021129083A (ja) * | 2020-02-17 | 2021-09-02 | キオクシア株式会社 | 半導体装置およびその製造方法 |
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