JP2015085487A5 - - Google Patents

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Publication number
JP2015085487A5
JP2015085487A5 JP2013228240A JP2013228240A JP2015085487A5 JP 2015085487 A5 JP2015085487 A5 JP 2015085487A5 JP 2013228240 A JP2013228240 A JP 2013228240A JP 2013228240 A JP2013228240 A JP 2013228240A JP 2015085487 A5 JP2015085487 A5 JP 2015085487A5
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JP
Japan
Prior art keywords
polishing
substrate
output current
vibration component
current signal
Prior art date
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Application number
JP2013228240A
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English (en)
Japanese (ja)
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JP2015085487A (ja
JP6030041B2 (ja
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Priority claimed from JP2013228240A external-priority patent/JP6030041B2/ja
Priority to JP2013228240A priority Critical patent/JP6030041B2/ja
Priority to TW103137162A priority patent/TWI568539B/zh
Priority to KR1020140147073A priority patent/KR101711259B1/ko
Priority to US14/527,714 priority patent/US9272389B2/en
Priority to SG10201407062PA priority patent/SG10201407062PA/en
Priority to CN201410605525.8A priority patent/CN104608055B/zh
Publication of JP2015085487A publication Critical patent/JP2015085487A/ja
Publication of JP2015085487A5 publication Critical patent/JP2015085487A5/ja
Publication of JP6030041B2 publication Critical patent/JP6030041B2/ja
Application granted granted Critical
Priority to KR1020170010910A priority patent/KR101901508B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013228240A 2013-11-01 2013-11-01 研磨装置および研磨方法 Active JP6030041B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013228240A JP6030041B2 (ja) 2013-11-01 2013-11-01 研磨装置および研磨方法
TW103137162A TWI568539B (zh) 2013-11-01 2014-10-28 研磨裝置及研磨方法
KR1020140147073A KR101711259B1 (ko) 2013-11-01 2014-10-28 연마 장치 및 연마 방법
SG10201407062PA SG10201407062PA (en) 2013-11-01 2014-10-29 Polishing apparatus and polishing method
US14/527,714 US9272389B2 (en) 2013-11-01 2014-10-29 Polishing apparatus and polishing method
CN201410605525.8A CN104608055B (zh) 2013-11-01 2014-10-31 研磨装置及研磨方法
KR1020170010910A KR101901508B1 (ko) 2013-11-01 2017-01-24 연마 장치 및 연마 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013228240A JP6030041B2 (ja) 2013-11-01 2013-11-01 研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2015085487A JP2015085487A (ja) 2015-05-07
JP2015085487A5 true JP2015085487A5 (enExample) 2016-04-21
JP6030041B2 JP6030041B2 (ja) 2016-11-24

Family

ID=53007324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013228240A Active JP6030041B2 (ja) 2013-11-01 2013-11-01 研磨装置および研磨方法

Country Status (6)

Country Link
US (1) US9272389B2 (enExample)
JP (1) JP6030041B2 (enExample)
KR (2) KR101711259B1 (enExample)
CN (1) CN104608055B (enExample)
SG (1) SG10201407062PA (enExample)
TW (1) TWI568539B (enExample)

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CN108621033B (zh) * 2017-03-21 2020-04-07 中芯国际集成电路制造(上海)有限公司 研磨垫的研磨方法
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
KR101955274B1 (ko) * 2017-04-24 2019-03-08 서우테크놀로지 주식회사 반도체 패키지 그라인더
CN109202719B (zh) * 2017-07-03 2021-02-02 株式会社安川电机 研磨工艺的控制方法
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
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TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN108555771A (zh) * 2018-04-25 2018-09-21 清华大学 Cmp设备的终点确定方法、终点确定系统和cmp系统
CN108807228B (zh) * 2018-06-05 2020-10-16 安徽省华腾农业科技有限公司经开区分公司 一种半导体芯片生产工艺
KR102570975B1 (ko) * 2018-06-18 2023-08-28 주식회사 케이씨텍 금속 박막 두께 검출 장치 및 그 방법
TWI828706B (zh) * 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
JP7084811B2 (ja) * 2018-07-13 2022-06-15 株式会社荏原製作所 研磨装置および研磨方法
WO2020067914A1 (en) 2018-09-26 2020-04-02 Applied Materials, Inc. Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring
CN109531424B (zh) * 2019-01-09 2024-04-09 中国工程物理研究院激光聚变研究中心 抛光盘包络式修整方法及其装置
JP7374710B2 (ja) * 2019-10-25 2023-11-07 株式会社荏原製作所 研磨方法および研磨装置
JP7640562B2 (ja) 2020-05-14 2025-03-05 アプライド マテリアルズ インコーポレイテッド 研磨中のインシトゥモニタリングで使用するためのニューラルネットワークをトレーニングするための技術及び研磨システム
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US20130065493A1 (en) * 2011-08-09 2013-03-14 Taro Takahashi Polishing monitoring method, polishing end point detection method, and polishing apparatus

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