JP2015085487A - 研磨装置および研磨方法 - Google Patents
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
- H01L21/12—Application of an electrode to the exposed surface of the selenium or tellurium after the selenium or tellurium has been applied to the foundation plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
【解決手段】研磨装置は、研磨パッド1を支持する研磨テーブル2と、研磨テーブル2を回転させるテーブルモータ6と、基板を研磨パッド1に押し付けて該基板を研磨するトップリング3と、基板の研磨中に研磨パッド1上を揺動しながら研磨パッド1をドレッシングするドレッサ26と、ドレッサ26の揺動周期に相当する周波数を持つ振動成分を、テーブルモータ6の出力電流信号から除去するフィルター装置35と、振動成分が除去された出力電流信号に基づいて基板の研磨の進捗を監視する研磨監視装置40とを備える。
【選択図】図1
Description
上述した第2の態様および第5の態様によれば、トップリングの揺動に起因する振動成分がテーブルモータの出力電流信号から除去される。したがって、研磨監視装置は、振動成分を含まない出力電流信号に基づいて基板研磨の進捗を正確に監視することができる。
上述した第3の態様および第6の態様によれば、基板の構造に起因する振動成分が渦電流センサの膜厚信号から除去される。したがって、研磨監視装置は、振動成分を含まない膜厚信号に基づいて基板研磨の進捗を正確に監視することができる。
2 研磨テーブル
3 トップリング
4 研磨液供給ノズル
5 テーブル軸
6 テーブルモータ
7 トップリングシャフト
8 トップリングアーム
9 トップリング旋回軸
24 ドレッシング装置
26 ドレッサ
27 ドレッサアーム
28 ドレッサ旋回軸
30 動作制御部
32 電流計
35 フィルター装置
40 研磨監視装置
50 渦電流センサ
102 センサコイル
103 交流電源
105 同期検波部
111 ボビン
112 励磁コイル
113 検出コイル
114 バランスコイル
120 バンドパスフィルタ
121 ブリッジ回路
123 高周波アンプ
124 位相シフト回路
125 cos同期検波回路
126 sin同期検波回路
127,128 ローパスフィルタ
130 ベクトル演算回路
131 θ処理回路
Claims (10)
- 研磨パッドを支持する研磨テーブルと、
前記研磨テーブルを回転させるテーブルモータと、
基板を前記研磨パッドに押し付けて該基板を研磨するトップリングと、
前記基板の研磨中に前記研磨パッド上を揺動しながら前記研磨パッドをドレッシングするドレッサと、
前記ドレッサの揺動周期に相当する周波数を持つ振動成分を、前記テーブルモータの出力電流信号から除去するフィルター装置と、
前記振動成分が除去された前記出力電流信号に基づいて前記基板の研磨の進捗を監視する研磨監視装置とを備えたことを特徴とする研磨装置。 - 前記フィルター装置は、前記ドレッサの揺動周期に相当する周波数を算出することを特徴とする請求項1に記載の研磨装置。
- 研磨パッドを支持する研磨テーブルと、
前記研磨テーブルを回転させるテーブルモータと、
基板を前記研磨パッドに押し付けながら揺動するトップリングと、
前記トップリングの揺動周期に相当する周波数を持つ振動成分を、前記テーブルモータの出力電流信号から除去するフィルター装置と、
前記振動成分が除去された前記出力電流信号に基づいて前記基板の研磨の進捗を監視する研磨監視装置とを備えたことを特徴とする研磨装置。 - 前記フィルター装置は、前記トップリングの揺動周期に相当する周波数を算出することを特徴とする請求項3に記載の研磨装置。
- 研磨パッドを支持する研磨テーブルと、
前記研磨テーブルを回転させるテーブルモータと、
基板を前記研磨パッドに押し付けて該基板を研磨するトップリングと、
前記基板の表面を走査して、該基板の膜厚に従って変化する膜厚信号を取得する渦電流センサと、
所定の周波数を持つ振動成分を、前記膜厚信号から除去するフィルター装置と、
前記振動成分が除去された前記膜厚信号に基づいて前記基板の研磨の進捗を監視する研磨監視装置とを備えたことを特徴とする研磨装置。 - 研磨テーブルをテーブルモータにより回転させ、
基板を前記研磨テーブル上の研磨パッドに押し付けて該基板を研磨し、
前記基板の研磨中に、ドレッサを前記研磨パッド上で揺動させて前記研磨パッドをドレッシングし、
前記ドレッサの揺動周期に相当する周波数を持つ振動成分を、前記テーブルモータの出力電流信号から除去し、
前記振動成分が除去された前記出力電流信号に基づいて前記基板の研磨の進捗を監視することを特徴とする研磨方法。 - 前記ドレッサの揺動周期に相当する周波数を算出する工程をさらに含むことを特徴とする請求項6に記載の研磨方法。
- 研磨テーブルをテーブルモータにより回転させ、
トップリングにより基板を前記研磨テーブル上の研磨パッドに押し付けながら、前記トップリングを揺動させ、
前記トップリングの揺動周期に相当する周波数を持つ振動成分を、前記テーブルモータの出力電流信号から除去し、
前記振動成分が除去された前記出力電流信号に基づいて前記基板の研磨の進捗を監視することを特徴とする研磨方法。 - 前記トップリングの揺動周期に相当する周波数を算出する工程をさらに含むことを特徴とする請求項8に記載の研磨方法。
- 研磨テーブルをテーブルモータにより回転させ、
基板を前記研磨テーブル上の研磨パッドに押し付けて該基板を研磨し、
渦電流センサに前記基板の表面を走査させて、該基板の膜厚に従って変化する膜厚信号を取得し、
所定の周波数を持つ振動成分を、前記膜厚信号から除去し、
前記振動成分が除去された前記膜厚信号に基づいて前記基板の研磨の進捗を監視することを特徴とする研磨方法。
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JP2013228240A JP6030041B2 (ja) | 2013-11-01 | 2013-11-01 | 研磨装置および研磨方法 |
TW103137162A TWI568539B (zh) | 2013-11-01 | 2014-10-28 | 研磨裝置及研磨方法 |
KR1020140147073A KR101711259B1 (ko) | 2013-11-01 | 2014-10-28 | 연마 장치 및 연마 방법 |
US14/527,714 US9272389B2 (en) | 2013-11-01 | 2014-10-29 | Polishing apparatus and polishing method |
SG10201407062PA SG10201407062PA (en) | 2013-11-01 | 2014-10-29 | Polishing apparatus and polishing method |
CN201410605525.8A CN104608055B (zh) | 2013-11-01 | 2014-10-31 | 研磨装置及研磨方法 |
KR1020170010910A KR101901508B1 (ko) | 2013-11-01 | 2017-01-24 | 연마 장치 및 연마 방법 |
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US (1) | US9272389B2 (ja) |
JP (1) | JP6030041B2 (ja) |
KR (2) | KR101711259B1 (ja) |
CN (1) | CN104608055B (ja) |
SG (1) | SG10201407062PA (ja) |
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KR20200120745A (ko) * | 2018-03-12 | 2020-10-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 연마의 인-시튜 모니터링 동안의 필터링 |
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US20130017762A1 (en) * | 2011-07-15 | 2013-01-17 | Infineon Technologies Ag | Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine |
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KR101901508B1 (ko) | 2018-09-21 |
US20150125971A1 (en) | 2015-05-07 |
TWI568539B (zh) | 2017-02-01 |
KR20170015406A (ko) | 2017-02-08 |
KR101711259B1 (ko) | 2017-02-28 |
KR20150051150A (ko) | 2015-05-11 |
US9272389B2 (en) | 2016-03-01 |
TW201527045A (zh) | 2015-07-16 |
SG10201407062PA (en) | 2015-06-29 |
CN104608055A (zh) | 2015-05-13 |
JP6030041B2 (ja) | 2016-11-24 |
CN104608055B (zh) | 2017-09-22 |
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